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Cross-scale structures fabrication via hybrid lithography for nanolevel positioning
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作者 Jingwen Li Shengtong Wang Xinghui Li 《Microsystems & Nanoengineering》 2025年第4期443-452,共10页
Planar cross-scale structures encode position and posture,enabling nanometer-level accuracy and multi-scale cascaded precision,emerging as a potential sensing device for semiconductor manufacturing and inspection syst... Planar cross-scale structures encode position and posture,enabling nanometer-level accuracy and multi-scale cascaded precision,emerging as a potential sensing device for semiconductor manufacturing and inspection systems.However,the fabrication of cross-scale hybrid structures,which is the integration of structures spanning three orders of magnitude in feature dimensions(500 nm-1.5 mm)on single substrates,still faces challenges.This requires fabrication of submicron-periodic encoder arrays(reflective regions)and micron-scale non-periodic absolute code tracks(transmissive regions)while maintaining directional consistency.Herein,we demonstrate a mask-interference hybrid lithography method to generate cross-scale structures.The multi-step lithography process integrates interference lithography for fabricating subwavelength periodic structures and mask lithography for patterning millimeter and micrometer-scale non-periodic structures.Alignment marks etched on the mask enable direction consistency between structural zones.The transmissive and reflective structures are differentially processed through region-specific etching and deposition.The effectiveness of this process in realizing the fabrication of hybrid structures is validated through experimental characterization.Moreover,the inherent process scalability establishes a versatile platform for creating multifunctional photonic architectures. 展开更多
关键词 planar cross scale structures integration structures position postureenabling hybrid lithography cross scale structures nanolevel positioning semiconductor manufacturing sensing device
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