A polysilicon-based organic nonvolatile floating-gate memory device with a bottom-gate top-contact configuration is investigated,in which polysilicon is sandwiched between oxide layers as a floating gate.Simulations f...A polysilicon-based organic nonvolatile floating-gate memory device with a bottom-gate top-contact configuration is investigated,in which polysilicon is sandwiched between oxide layers as a floating gate.Simulations for the electrical characteristics of the polysilicon floating gate-based memory device are performed.The shifted transfer characteristics and corresponding charge trapping mechanisms during programing and erasing（P/E） operations at various P/E voltages are discussed.The simulated results show that present memory exhibits a large memory window of 57.5 V,and a high read current on/off ratio of ≈ 10~3.Compared with the reported experimental results,these simulated results indicate that the polysilicon floating gate based memory device demonstrates remarkable memory effects,which shows great promise in device designing and practical application.展开更多
In this study,we present an organic field-effect transistor floating-gate memory using polysilicon(poly-Si)as a charge trapping layer.The memory device is fabricated on a N^+-Si/SiO2 substrate.Poly-Si,polymethylmethac...In this study,we present an organic field-effect transistor floating-gate memory using polysilicon(poly-Si)as a charge trapping layer.The memory device is fabricated on a N^+-Si/SiO2 substrate.Poly-Si,polymethylmethacrylate,and pentacene are used as a floating-gate layer,tunneling layer,and active layer,respectively.The device shows bidirectional storage characteristics under the action of programming/erasing(P/E)operation due to the supplied electrons and holes in the channel and the bidirectional charge trapping characteristic of the poly-Si floating-gate.The carrier mobility and switching current ratio(Ion/Ioff ratio)of the device with a tunneling layer thickness of 85 nm are 0.01 cm^2·V^-1·s^-1 and 102,respectively.A large memory window of 9.28 V can be obtained under a P/E voltage of±60 V.展开更多
利用0.35μm工艺条件实现了性能优良的小尺寸全耗尽的器件硅绝缘体技术(SOI)互补金属氧化物半导体(FD SOI CMOS)器件,器件制作采用双多晶硅栅工艺、低掺杂浓度源/漏(LDD)结构以及突起的源漏区。这种结构的器件防止漏的击穿,减小短沟道效...利用0.35μm工艺条件实现了性能优良的小尺寸全耗尽的器件硅绝缘体技术(SOI)互补金属氧化物半导体(FD SOI CMOS)器件,器件制作采用双多晶硅栅工艺、低掺杂浓度源/漏(LDD)结构以及突起的源漏区。这种结构的器件防止漏的击穿,减小短沟道效应(SCE)和漏感应势垒降低效应(DIBL);突起的源漏区增加了源漏区的厚度并减小源漏区的串联电阻,增强了器件的电流驱动能力。设计了101级环形振荡器电路,并对该电路进行测试与分析。根据在3V工作电压下环形振荡器电路的振荡波形图,计算出其单级门延迟时间为45ps,远小于体硅CMOS的单级门延迟时间。展开更多
文摘A polysilicon-based organic nonvolatile floating-gate memory device with a bottom-gate top-contact configuration is investigated,in which polysilicon is sandwiched between oxide layers as a floating gate.Simulations for the electrical characteristics of the polysilicon floating gate-based memory device are performed.The shifted transfer characteristics and corresponding charge trapping mechanisms during programing and erasing（P/E） operations at various P/E voltages are discussed.The simulated results show that present memory exhibits a large memory window of 57.5 V,and a high read current on/off ratio of ≈ 10~3.Compared with the reported experimental results,these simulated results indicate that the polysilicon floating gate based memory device demonstrates remarkable memory effects,which shows great promise in device designing and practical application.
文摘In this study,we present an organic field-effect transistor floating-gate memory using polysilicon(poly-Si)as a charge trapping layer.The memory device is fabricated on a N^+-Si/SiO2 substrate.Poly-Si,polymethylmethacrylate,and pentacene are used as a floating-gate layer,tunneling layer,and active layer,respectively.The device shows bidirectional storage characteristics under the action of programming/erasing(P/E)operation due to the supplied electrons and holes in the channel and the bidirectional charge trapping characteristic of the poly-Si floating-gate.The carrier mobility and switching current ratio(Ion/Ioff ratio)of the device with a tunneling layer thickness of 85 nm are 0.01 cm^2·V^-1·s^-1 and 102,respectively.A large memory window of 9.28 V can be obtained under a P/E voltage of±60 V.
文摘利用0.35μm工艺条件实现了性能优良的小尺寸全耗尽的器件硅绝缘体技术(SOI)互补金属氧化物半导体(FD SOI CMOS)器件,器件制作采用双多晶硅栅工艺、低掺杂浓度源/漏(LDD)结构以及突起的源漏区。这种结构的器件防止漏的击穿,减小短沟道效应(SCE)和漏感应势垒降低效应(DIBL);突起的源漏区增加了源漏区的厚度并减小源漏区的串联电阻,增强了器件的电流驱动能力。设计了101级环形振荡器电路,并对该电路进行测试与分析。根据在3V工作电压下环形振荡器电路的振荡波形图,计算出其单级门延迟时间为45ps,远小于体硅CMOS的单级门延迟时间。
