Driven by exponential global data growth and the demand for high-speed and low-power processing,photonic integrated circuits(PICs)have emerged as a cornerstone of next-generation chip technologies[1].As electronic cir...Driven by exponential global data growth and the demand for high-speed and low-power processing,photonic integrated circuits(PICs)have emerged as a cornerstone of next-generation chip technologies[1].As electronic circuits hit physical limits,constrained by speed,heat dissipation,and scaling bottlenecks,PICs,which transmit data using photons,provide a viable alternative with high bandwidth,ultrafast processing,and low energy consumption.Beyond planar PICs,which have achieved substantial advancements,three-dimensional(3D)PICs—based on 3D path routing and arbitrary cross-sectional shapes—have developed rapidly.展开更多
基金supported by the Human Resource Training Project of Innovation Laboratory for Sciences and Technologies of Energy Materials of Fujian Province(No.HRTP-[2022]–53).
文摘Driven by exponential global data growth and the demand for high-speed and low-power processing,photonic integrated circuits(PICs)have emerged as a cornerstone of next-generation chip technologies[1].As electronic circuits hit physical limits,constrained by speed,heat dissipation,and scaling bottlenecks,PICs,which transmit data using photons,provide a viable alternative with high bandwidth,ultrafast processing,and low energy consumption.Beyond planar PICs,which have achieved substantial advancements,three-dimensional(3D)PICs—based on 3D path routing and arbitrary cross-sectional shapes—have developed rapidly.
