Phase change thermal interface materials(PC-TIMs)have emerged as a promising solution to address the increasing thermal management challenges in electronic devices.This is attributed to their dual mechanisms of latent...Phase change thermal interface materials(PC-TIMs)have emerged as a promising solution to address the increasing thermal management challenges in electronic devices.This is attributed to their dual mechanisms of latent heat absorption and phase change-induced interfacial wettability.This review explores the fundamental principles,material innovations,and diverse applications of PC-TIMs.The heat transfer enhancement mechanisms are first underlined with key factors such as thermal carrier mismatch at the microscale and contact geometry at the macroscale,emphasizing the importance of material selection and design for optimizing thermal performance.Section 2 focuses on corresponding experimental approaches provided,including intrinsic thermal conductivity improvements and interfacial heat transfer optimization.Section 3 discusses common methods such as physical adsorption via porous materials,chain-crosslinked network designs,and core-shell structures,and their effects on leakage prevention,heat transfer enhancement,and application flexibility.Furthermore,the extended applications of PC-TIMs in thermal energy storage are explored in Section 4,suggesting their potential in diverse technological fields.The current challenges in interfacial heat transfer research and the prospect of PC-TIMs are also discussed.The data-driven machine learning technologies will play an increasingly important role in addressing material development and performance prediction.展开更多
基金funding from the National Natural Science Foundation of China(Grant Nos.52306214,52425601,and 52276074)the Shanghai Chenguang Plan Program(Grant No.22CGA78)the National Key Research and the Development Program of China(Grant No.2023YFB4404104)。
文摘Phase change thermal interface materials(PC-TIMs)have emerged as a promising solution to address the increasing thermal management challenges in electronic devices.This is attributed to their dual mechanisms of latent heat absorption and phase change-induced interfacial wettability.This review explores the fundamental principles,material innovations,and diverse applications of PC-TIMs.The heat transfer enhancement mechanisms are first underlined with key factors such as thermal carrier mismatch at the microscale and contact geometry at the macroscale,emphasizing the importance of material selection and design for optimizing thermal performance.Section 2 focuses on corresponding experimental approaches provided,including intrinsic thermal conductivity improvements and interfacial heat transfer optimization.Section 3 discusses common methods such as physical adsorption via porous materials,chain-crosslinked network designs,and core-shell structures,and their effects on leakage prevention,heat transfer enhancement,and application flexibility.Furthermore,the extended applications of PC-TIMs in thermal energy storage are explored in Section 4,suggesting their potential in diverse technological fields.The current challenges in interfacial heat transfer research and the prospect of PC-TIMs are also discussed.The data-driven machine learning technologies will play an increasingly important role in addressing material development and performance prediction.
