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Microstructures and properties of Al-50%SiC composites for electronic packaging applications 被引量:11
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作者 滕飞 余琨 +4 位作者 罗杰 房宏杰 史春丽 戴翌龙 熊汉青 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2016年第10期2647-2652,共6页
Al?50%SiC (volume fraction) composites containing different sizesofSiC particles (average sizesof 23, 38 and 75 μm) were prepared by powder metallurgy. The influences of SiC particle sizes and annealing on the p... Al?50%SiC (volume fraction) composites containing different sizesofSiC particles (average sizesof 23, 38 and 75 μm) were prepared by powder metallurgy. The influences of SiC particle sizes and annealing on the propertiesof the compositeswere investigated. The results show that SiC particles are distributed uniformly in the Al matrix. The coarse SiC particles result in higher coefficient of thermal expansion (CTE) and higher thermal conductivity (TC), while fine SiC particles decrease CTE and improve flexural strength of the composites. The morphology and size of SiC particles in the composite are not influenced by the annealing treatment at 400℃for 6h. However, the CTE and the flexural strength of annealed composites are decreased slightly, and the TCis improved. The TC, CTE and flexural strength of the Al/SiC composite with averageSiC particlesize of75 μm are 156 W/(m·K), 11.6×10^-6K^-1 and 229 MPa, respectively. 展开更多
关键词 Al-50%SiC composites powder metallurgy thermal properties flexural strength electronic packagingmaterial
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