As electronic devices continue to evolve toward higher power densities,faster speeds,and smaller form factors,the demand for high-performance electronic packaging materials has become increasingly critical.These mater...As electronic devices continue to evolve toward higher power densities,faster speeds,and smaller form factors,the demand for high-performance electronic packaging materials has become increasingly critical.These materials serve as the physical and functional interface between semiconductor components and their operating environment,impacting the overall reliability,thermal management,mechanical protection,and electrical performance of modern electronic systems.This study investigates the development,formulation,and performance evaluation of advanced packaging materials,focusing on polymer-based composites,metal and ceramic matrix systems,and nanomaterial-enhanced formulations.A comprehensive analysis of key performance metrics-including thermal conductivity,electrical insulation,mechanical robustness,and environmental resistance-is presented,alongside strategies for material optimization through interface engineering and processing innovations.Furthermore,the study explores cutting-edge integration technologies such as 3D packaging compatibility,low-temperature co-firing,and high-density interconnects.The findings provide critical insights into the structure-property-processing relationships that define the effectiveness of next-generation packaging materials and offer a roadmap for material selection and system integration in high-reliability electronic applications.展开更多
The extensive use of polymeric materials in single-use packaging has driven the need to develop biodegradable alternatives.This study investigates the incorporation of graphene oxide(GO)and Moringa oleifera seed oil(M...The extensive use of polymeric materials in single-use packaging has driven the need to develop biodegradable alternatives.This study investigates the incorporation of graphene oxide(GO)and Moringa oleifera seed oil(MOSO)into a gelatin matrix to create polymer films and evaluate their potential as active packaging materials.The properties of these films were evaluated using structural,thermal,mechanical,optical,and physicochemical methods to determine their suitability for food packaging applications.The results showed that GO and MOSO were homogeneously dispersed in the gelatin matrix,forming colloidal particles(around 5μm in diameter).The addition of GO increased opacity by approximately 20 times the base value while MOSO affected light transmittance without impacting opacity.Mechanical properties were affected differently,GO acted as a crosslinking agent reducing elongation and increasing tensile strength at break,on the other hand MOSO acted as a plasticizer,making films more plastic increasing elongation a 30%.These effects counteracted each other,and similar behavior was recorded in differential scanning calorimetry.The films exhibited an improved water vapor resistance,which is crucial for food packaging.These findings indicate that the incorporation of GO and MOSO into a gelatin matrix may produce biodegradable polymer films with enhanced properties,suitable for active packaging in the food industry.展开更多
The 2025(15th)China Daily Chemical Industry Forum(CDCIF 2025)and its concurrent event,the 2025 China International Premium Exhibition for Personal Care Ingredients,Packaging&Machinery(IPE 2025)concluded successful...The 2025(15th)China Daily Chemical Industry Forum(CDCIF 2025)and its concurrent event,the 2025 China International Premium Exhibition for Personal Care Ingredients,Packaging&Machinery(IPE 2025)concluded successfully in Guangzhou from September 22nd to 24th.Hosted by the China Research Institute of Daily Chemical(RIDCI),and organized by the China Information Center of Daily Chemical Industry and Productivity Promotion Center of Surfactant and Detergent,the event gathered nearly 600 representatives from government departments,industry associations,and leading enterprises.展开更多
Chimeric antigen receptor natural killer(CAR-NK)cell therapy is an alternative immunotherapy that provides robust tumor-eliminating effects without inducing life-threatening toxicities and graft-versus-host disease.CA...Chimeric antigen receptor natural killer(CAR-NK)cell therapy is an alternative immunotherapy that provides robust tumor-eliminating effects without inducing life-threatening toxicities and graft-versus-host disease.CAR-NK cell therapy has enabled the development of“off-the-shelf”products that bypass the lengthy and expensive cell manufacturing process1.展开更多
The continuous increase in petroleum-based plastic food packaging has led to numerous environmental concerns.One effort to reduce the use of plastic packaging in food is through preservation using biopolymer-based pac...The continuous increase in petroleum-based plastic food packaging has led to numerous environmental concerns.One effort to reduce the use of plastic packaging in food is through preservation using biopolymer-based packaging.Among the many types of biopolymers,chitosan is widely used and researched due to its non-toxic,antimicrobial,and antifungal properties.Chitosan is widely available since it is a compound extracted from seafood waste,especially shrimps and crabs.The biodegradability and biocompatibility of chitosan also showed good potential for various applications.These characteristics and propertiesmake chitosan an attractive biopolymer to be implemented as food packaging in films and coatings.Chitosan has been tested in maintaining and increasing the shelf life of food,especially seafood such as fish and shrimp,and post-harvest products such as fruits and vegetables.In addition to its various advantages,the properties and characteristics of chitosan need to be improved to produce optimal preservation.The properties and characteristics of chitosan are improved by adding various types of additive materials such as biopolymers,plant extracts,essential oils,and metal nanoparticles.Research shows that material additives and nanotechnology can improve the quality of chitosan-based food packaging for various types of food by enhancing mechanical properties,thermal stability,antimicrobial activity,and antioxidant activity.This review provides a perspective on the recent development and properties enhancement of chitosan composite with additives and nanotechnology,as well as this material’s challenges and prospects as food packaging.展开更多
Interest in the use of cellulose nanomaterial’s continues to grow,both in research and industry,not only due to the abundance of raw materials,low toxicity and sustainability,but also due to the attractive physical a...Interest in the use of cellulose nanomaterial’s continues to grow,both in research and industry,not only due to the abundance of raw materials,low toxicity and sustainability,but also due to the attractive physical and chemical properties that make nanocelluloses useful for a wide range of end-use applications.Among the large number of potential uses,and nanocelluloses modification and processing strategies,the chosen topic of this review focuses exclusively on plant-derived cellulose microfibers/nanofibers(CNF)and cellulose nanocrystals(CNC)processed into 2D structures—nanopapers and nanofilms—fabricated as self-standing films or applied as coatings.The end uses considered are:combinationwith standard papers and cardboards for packaging,mendingmaterial for the conservation and protection of cellulosic heritage artifacts,and component-parts of complex designs of functional devices for energy harvesting and storage.In these contexts,nanocelluloses provide high mechanical and ecofriendly properties,transparency and tunable haze,as well as flexibility/bendability in the resulting films.All these characteristics make them extremely attractive to a market seeking for sustainable,light weight and low cost raw materials for the production of goods.General perspectives on the current advantages and disadvantages of using CNF and CNC in the selected areas are also reviewed.展开更多
Petrochemical plastics are widely used for food protection and preservation;however,they exhibit poor biodegradability,resisting natural degradation through physical,chemical,or enzymatic processes.As a sustainable al...Petrochemical plastics are widely used for food protection and preservation;however,they exhibit poor biodegradability,resisting natural degradation through physical,chemical,or enzymatic processes.As a sustainable alternative to conventional plastic packaging,edible films offer effective barriers against moisture,gases,and microbial contamination while being biodegradable,biocompatible,and environmentally friendly.In this study,novel active food packaging materials(in film form)were developed by incorporating starch,carrageenan,nanocellulose(NC),Aloe vera,and hibiscus flower extract.The effects of varying the matrix composition(26.5–73.5 wt.%starch/carrageenan),NC concentration(2.77-17.07 wt.%),and particle type(fibers or crystals)on the film structure and characteristics were analyzed using various methods.Scanning electron microscopy demonstrated good homogeneity and effective dispersion of NC within the blendmatrix.An increased carrageenan content in the filmimproved wettability,moisture absorption,solubility,and water vapor permeability.The mechanical properties of the films were enhanced by NC incorporation and higher carrageenan content.The developed films also exhibited effective UV radiation barriers and biodegradability.Films with low carrageenan content(less than 33.3%)and high NC content(7%,10% crystals or 10%,15% fibers)exhibited optimal properties,including enhanced water resistance,hydrophobicity,and mechanical strength,along with reduced water vapor permeability.However,the high water solubility and moisture absorption(above 55% and 14%,respectively)indicated their unsuitability as packaging materials for food products with wet surfaces and high humidity.The results suggest that these films are well suited for use as edible food packaging for fruits and vegetables.展开更多
The food industry prioritizes food safety throughout the entire production process.This involves closely monitoring and evaluating all potential sources of biological or chemical contamination,starting from entering r...The food industry prioritizes food safety throughout the entire production process.This involves closely monitoring and evaluating all potential sources of biological or chemical contamination,starting from entering raw materials into the production chain and continuing to the final product.Biofilms on food surfaces or containers can harbor dangerous pathogens,such as Listeria monocytogenes.Therefore,it is essential to continuously manage microbial contamination on food contact surfaces to prevent foodborne infections.Recently,there has been increasing interest in using nanomaterials as surface coatings with antimicrobial properties in the food industry,especially since traditional disinfectants or antibiotics may contribute to developing resistance.However,the use of antibiofilm materials for long-term food storage remains underexplored,and there is a notable lack of focused reviews on nanomaterialbased antibiofilm coatings specifically for long-term food preservation.This review aims to consolidate recently reported nanoparticle-based antibiofilm food packaging materials.We discuss the effectiveness of various metal and metal oxide nanoparticles and biopolymer nanocomposites in combating biofilms.Additionally,we highlight the growing importance of biodegradable nanocomposite materials for antibiofilm food packaging.Furthermore,we explore the mechanisms of action,processing methods,and safety aspects of these nanomaterials being developed for food packaging applications.展开更多
Photoinitiators(PIs),as an important component of UV inks,are widely used in the printing of paper food packaging.Nevertheless,there is limited information concerning the identification of PIs in food packaging and th...Photoinitiators(PIs),as an important component of UV inks,are widely used in the printing of paper food packaging.Nevertheless,there is limited information concerning the identification of PIs in food packaging and their potential migration rules under natural storage condition.In this study,23 target PIs detected in paper food packaging were dominated by benzophenones(BZPs),followed by amine co-initiators(ACIs),thioxanthones(TXs)and phosphine oxides(POs).The concentration of ΣPIs ranged between 48.3 and 1.11×10^(5)ng/g.Meanwhile,the concentration ofΣPIs were found to be significantly higher in Corrugated paper compared to Polyethylene(PE)coated paper,Composite paper and White card paper.Benzophenone(BP)was found as the dominant PI congener in Corrugated paper,with the concentration ranging from 923-3.66×10^(4)ng/g.The migration quantity ofΣPIs increased in a time-dependent manner in the first 13 days and then eventually reached equilibrium.Low temperatures had a certain inhibitory effect on the migration of PIs from paper packaging to food.Under high exposure scenario,the EDIs of ΣPIs for children,adolescents,and adults were 31.4 ng/(kg bw·day),17.2 ng/(kg bw·day),and 14.4 ng/(kg bw·day),respectively,all of which did not exceed the reference dose,indicating that dietary intake of PIs does not pose any health risks to the human body.展开更多
The hurdle technology for food preservation effectively addresses the limitations of individual antimicrobial technologies by integrating their strengths.It can not only prolong the storage time of food but also maint...The hurdle technology for food preservation effectively addresses the limitations of individual antimicrobial technologies by integrating their strengths.It can not only prolong the storage time of food but also maintains its high quality.In this study,three antimicrobial and bactericidal technologies,namely soluble gas stabilization(SGS),modified atmosphere packaging(MAP),and cold plasma(CP),were applied to chilled chicken breasts.The packaging,total viable count(TVC),and physicochemical properties of chilled chicken breasts after treatments and storage at 4℃were monitored.The microbial diversity at the initial and end points of the storage time of each group was also analyzed.The results indicated that a 3−5 h SGS treatment can effectively increase the proportion of carbon dioxide in the MAP during the storage process of chilled chicken breasts,thereby alleviating the packaging collapse problem.Simultaneously,the effect of SGS,MAP,and CP combinational treatments significantly extended the storage time of chilled chicken breasts while maintaining the physicochemical qualities of samples.Compared to the control group,the TVC of chicken breast treated with SGS,MAP,and CP treatments decreased by 0.58(lg(CFU/g))at 0 day.The shelf life was extended by 5 days.After 8 days,the total volatile basic nitrogen(TVB-N)was 26.67 vs.19.50 mg/100 g,thiobarbituric acid reactive substances(TBARS)was 0.99 vs.0.72 mg MDA/kg,and TVC was 8.22 vs.6.52(lg(CFU/g)).High-throughput sequencing results showed that SGS and MAP treatments significantly reduce the proportion of Pseudomonas and Psychrobacter,which are sensitive to carbon dioxide,in the total bacterial genera.This study underscores the potential of integrating multiple antimicrobial technologies for effective food preservation.展开更多
Nano-twinned copper(nt-Cu),with a preferred orientation,is highly promising as interconnect materials in high-density advanced packaging due to its considerable mechanical strength,excellent electrical conductivity,an...Nano-twinned copper(nt-Cu),with a preferred orientation,is highly promising as interconnect materials in high-density advanced packaging due to its considerable mechanical strength,excellent electrical conductivity,and resistance to thermal migration.However,its application is impeded by sulfur-containing byproducts from the electroplating process,exacerbating the formation of Kirkendall voids within solder joints during thermal aging.Herein,through the incorporation of Zinc(Zn)into the nt-Cu layer,we develop a nt-Cu/Zn composite structure.Our findings provide the first definitive confirmation of the mechanism by which sulfur atoms migrate to the Cu_(3)Sn/nt-Cu interface through interstitial diffusion,thereby reducing the activation energy for vacancy formation.We further demonstrate that Zn effectively an-choring sulfur atoms,forming ZnS within the nt-Cu layer during heat treatment,which increases the vacancy formation energy and inhibits the development of Kirkendall voids.Remarkably,no Kirkendall voids are observed in the modified interconnects even after prolonged aging at 150℃ for 1000 h.The nt-Cu/Zn composite metallization layers significantly decrease the growth rate of interfacial intermetallic compounds by 33.6% and enhance the shear strength of solder interconnections to 228.9%.This research underscores the potential of nt-Cu in advanced electronic packaging,offering new pathways for improving the power density and reliability of electronic devices.展开更多
Cu nanoparticles exhibit excellent properties as high-temperature-resistant,conductive,heat-dissipating,and connecting materials.However,their susceptibility to oxidation poses a major challenge to the production of h...Cu nanoparticles exhibit excellent properties as high-temperature-resistant,conductive,heat-dissipating,and connecting materials.However,their susceptibility to oxidation poses a major challenge to the production of high-quality sintered bodies in the air,severely limiting their widespread adoption in power electronics packaging.This study presents a novel approach to the synthesis of Cu nanoparticles capped with oleylamine ligands.By employing a simple solvent-cleaning process,effective control of the density of oleylamine ligands on particle surfaces was achieved,resulting in high-performance Cu nanoparticles with both oxidation resistance and air-sintering susceptibility.Moreover,through our research,the solvent-cleaning mechanism was clarified,a model for the oleylamine ligand decomposition was developed,the air-sintering behavior of Cu nanoparticles was analyzed,and the impacts of both the sintered bodies and interfaces on the sintering performance were explained.Additionally,Cu nanoparticles subjected to 5 cleaning rounds followed by sintering at 280℃and 5 MPa in air were confirmed to be able to produce the highest shear strength(49.2±3.51 MPa)and lowest resistivity(6.15±0.32μΩ·cm).Based on these results,flexible capacitive pressure sensors with Cu sintered electrodes were fabricated and demonstrated a stable pressure-capacitance response over the temperature range of 25-250℃.These findings underscore the impressive robustness and durability of sintered structures and the potential for high-temperature applications of oleylamine-capped Cu nanoparticles.Our study provides reliable application demonstrations for the low-cost manufacture of high-performance power electronics packaging structures that can operate in high-current-density,high-heat-flow-density,high-temperature,and high-stress environments.展开更多
Based on the concept of sustainable design,we are committed to seeking innovative solutions and designinga complete express packaging recycling machine.The device consists of a vibration device,a compression device,a ...Based on the concept of sustainable design,we are committed to seeking innovative solutions and designinga complete express packaging recycling machine.The device consists of a vibration device,a compression device,a winding device and an electronic control system to promote the recycling of resources and environmental protection.This device can further improve the recycling efficiency and feasibility.It provides new ideas and solutions for the express industry and promotes the development of sustainable design in the field of express packaging recycling and reuse devices.展开更多
The present study monitored bacterial succession,physicochemical properties,and volatile organic compounds(VOCs)changes in smoked chicken legs with modified atmosphere packaging(MAP,60% CO_(2) and 40%N_(2))during a 25...The present study monitored bacterial succession,physicochemical properties,and volatile organic compounds(VOCs)changes in smoked chicken legs with modified atmosphere packaging(MAP,60% CO_(2) and 40%N_(2))during a 25-day storage period at 4℃.After 15 days of storage,S erratia proteamaculans and Pseudomonas fragi became the predominant bacteria.Furthermore,physicochemical properties changed significantly,as evidenced by an increase in thiobarbituric acid reactive substances and b*(yellowness)value,and a decrease in hardness.A total of 65 VOCs were identified during storage.Correlation between bacterial succession and quality indicators(including VOCs and physicochemical properties)allowed the identification of 26 core dominant bacteria,including S.proteamaculans,Psychrobacter alimentarius,Pseudomonas putida,and Pseudomonas poae,which were positively related to spoilage VOCs(e.g.,1-octen-3-ol,1-pentanol,and 3-methyl-1-butanol)and could be defined as specific spoilage organisms(SSOs).The results of this study provide a systematic approach to predict SSOs in smoked chicken legs during storage,which can also provide a basis for product safety.展开更多
Modern warfare demands weapons capable of penetrating substantial structures,which presents sig-nificant challenges to the reliability of the electronic devices that are crucial to the weapon's perfor-mance.Due to...Modern warfare demands weapons capable of penetrating substantial structures,which presents sig-nificant challenges to the reliability of the electronic devices that are crucial to the weapon's perfor-mance.Due to miniaturization of electronic components,it is challenging to directly measure or numerically predict the mechanical response of small-sized critical interconnections in board-level packaging structures to ensure the mechanical reliability of electronic devices in projectiles under harsh working conditions.To address this issue,an indirect measurement method using the Bayesian regularization-based load identification was proposed in this study based on finite element(FE)pre-dictions to estimate the load applied on critical interconnections of board-level packaging structures during the process of projectile penetration.For predicting the high-strain-rate penetration process,an FE model was established with elasto-plastic constitutive models of the representative packaging ma-terials(that is,solder material and epoxy molding compound)in which material constitutive parameters were calibrated against the experimental results by using the split-Hopkinson pressure bar.As the impact-induced dynamic bending of the printed circuit board resulted in an alternating tensile-compressive loading on the solder joints during penetration,the corner solder joints in the edge re-gions experience the highest S11 and strain,making them more prone to failure.Based on FE predictions at different structural scales,an improved Bayesian method based on augmented Tikhonov regulariza-tion was theoretically proposed to address the issues of ill-posed matrix inversion and noise sensitivity in the load identification at the critical solder joints.By incorporating a wavelet thresholding technique,the method resolves the problem of poor load identification accuracy at high noise levels.The proposed method achieves satisfactorily small relative errors and high correlation coefficients in identifying the mechanical response of local interconnections in board-level packaging structures,while significantly balancing the smoothness of response curves with the accuracy of peak identification.At medium and low noise levels,the relative error is less than 6%,while it is less than 10%at high noise levels.The proposed method provides an effective indirect approach for the boundary conditions of localized solder joints during the projectile penetration process,and its philosophy can be readily extended to other scenarios of multiscale analysis for highly nonlinear materials and structures under extreme loading conditions.展开更多
Laser debonding technology has been widely used in advanced chip packaging,such as fan-out integration,2.5D/3D ICs,and MEMS devices.Typically,laser debonding of bonded pairs(R/R separation)is typically achieved by com...Laser debonding technology has been widely used in advanced chip packaging,such as fan-out integration,2.5D/3D ICs,and MEMS devices.Typically,laser debonding of bonded pairs(R/R separation)is typically achieved by completely removing the material from the ablation region within the release material layer at high energy densities.However,this R/R separation method often results in a significant amount of release material and carbonized debris remaining on the surface of the device wafer,severely reducing product yields and cleaning efficiency for ultra-thin device wafers.Here,we proposed an interfacial separation strategy based on laser-induced hot stamping effect and thermoelastic stress wave,which enables stress-free separation of wafer bonding pairs at the interface of the release layer and the adhesive layer(R/A separation).By comprehensively analyzing the micro-morphology and material composition of the release material,we elucidated the laser debonding behavior of bonded pairs under different separation modes.Additionally,we calculated the ablation threshold of the release material in the case of wafer bonding and established the processing window for different separation methods.This work offers a fresh perspective on the development and application of laser debonding technology.The proposed R/A interface separation method is versatile,controllable,and highly reliable,and does not leave release materials and carbonized debris on device wafers,demonstrating strong industrial adaptability,which greatly facilitates the application and development of advanced packaging for ultra-thin chips.展开更多
With the growing demands for food safety,quality,and environmental protection,active food packaging is playing an increasingly vital role in the food industry.Traditional food packaging primarily protects products and...With the growing demands for food safety,quality,and environmental protection,active food packaging is playing an increasingly vital role in the food industry.Traditional food packaging primarily protects products and facilitates transportation.Active food packaging,however,not only fulfills these fundamental functions but also actively interacts with the food or its environment to extend shelf life and enhance food safety.From current research advancements and market applications,active food packaging demonstrates the following prominent development trends.展开更多
In the article“Recent Advancements in Nanocomposites-Based Antibiofilm Food Packaging”by Bandana Padhan et al.(Journal of Polymer Materials,2025,Vol.42,No.2,pp.411–433.doi:10.32604/jpm.2024.059156),originally publi...In the article“Recent Advancements in Nanocomposites-Based Antibiofilm Food Packaging”by Bandana Padhan et al.(Journal of Polymer Materials,2025,Vol.42,No.2,pp.411–433.doi:10.32604/jpm.2024.059156),originally published online on December 9,2024,and formally included in Vol.42,No.2(published on July 11,2025).展开更多
This study aims to the factors influencing consumer intention to purchase eco-friendly,small-packaged agricultural products using the Theory of Planned Behavior(TPB).With increasing demand for sustainable consumption,...This study aims to the factors influencing consumer intention to purchase eco-friendly,small-packaged agricultural products using the Theory of Planned Behavior(TPB).With increasing demand for sustainable consumption,eco-friendly food packaging has become a critical focus within the circular economy.This study was conducted in Seoul,South Korea,a key marketplace for consumer trends,and surveyed 200 respondents to examine key TPB components—attitude,subjective norms,and perceived behavioral control—along with additional factors shaping sustainable purchasing behavior.The findings indicate that perceived behavioral control is the predictor of purchase intention(β=0.510,p<0.001),followed by attitude(β=0.236,p<0.05)and subjective norms(β=0.199,p<0.05).Moreover,the results suggest that while social influences play a role,individuals who perceive fewer barriers and have a stronger personal attitude toward sustainability are more likely to adopt eco-friendly purchasing behaviors.These results highlight the importance of consumer autonomy and confidence in making eco-friendly choices,suggesting that increasing accessibility and affordability of sustainable packaging can drive adoption.Despite social influences,urban consumers prioritize personal values and perceived control over purchasing behavior.The study might contribute to sustainability literature by offering insights into eco-conscious consumer behavior and implications for marketing strategies that promote sustainable agricultural products.Future research should explore cross-cultural comparisons and additional psychological determinants to enhance the understanding of sustainable consumption patterns.展开更多
The electronic packaging box with high silicon aluminum-base alloy was prepared by semi-solid thixoforming technique.The flow characteristic of the Si phase was analyzed.The microstructures of different parts of the b...The electronic packaging box with high silicon aluminum-base alloy was prepared by semi-solid thixoforming technique.The flow characteristic of the Si phase was analyzed.The microstructures of different parts of the box were observed by optical microscopy and scanning electron microscopy,and the thermophysical and mechanical properties of the box were tested.The results show that there exists the segregation phenomenon between the primary Si phase and the liquid phase during thixoforming,the liquid phase flows from the box,and the primary Si phase accumulates at the bottom of the box.The volume fraction of primary Si phase decreases gradually from the bottom to the walls.Accordingly,the thermal conductivities of bottom center and walls are 107.6 and 131.5 W/（m·K）,the coefficients of thermal expansion（CTE） are 7.9×10-6 and 10.6×10-6 K-1,respectively.The flexural strength increases slightly from 167 to 180 MPa.The microstructures and properties of the box show gradient distribution overall.展开更多
文摘As electronic devices continue to evolve toward higher power densities,faster speeds,and smaller form factors,the demand for high-performance electronic packaging materials has become increasingly critical.These materials serve as the physical and functional interface between semiconductor components and their operating environment,impacting the overall reliability,thermal management,mechanical protection,and electrical performance of modern electronic systems.This study investigates the development,formulation,and performance evaluation of advanced packaging materials,focusing on polymer-based composites,metal and ceramic matrix systems,and nanomaterial-enhanced formulations.A comprehensive analysis of key performance metrics-including thermal conductivity,electrical insulation,mechanical robustness,and environmental resistance-is presented,alongside strategies for material optimization through interface engineering and processing innovations.Furthermore,the study explores cutting-edge integration technologies such as 3D packaging compatibility,low-temperature co-firing,and high-density interconnects.The findings provide critical insights into the structure-property-processing relationships that define the effectiveness of next-generation packaging materials and offer a roadmap for material selection and system integration in high-reliability electronic applications.
基金the University of Cartagena for funding through the Strengthening Project Acta 048-2023.
文摘The extensive use of polymeric materials in single-use packaging has driven the need to develop biodegradable alternatives.This study investigates the incorporation of graphene oxide(GO)and Moringa oleifera seed oil(MOSO)into a gelatin matrix to create polymer films and evaluate their potential as active packaging materials.The properties of these films were evaluated using structural,thermal,mechanical,optical,and physicochemical methods to determine their suitability for food packaging applications.The results showed that GO and MOSO were homogeneously dispersed in the gelatin matrix,forming colloidal particles(around 5μm in diameter).The addition of GO increased opacity by approximately 20 times the base value while MOSO affected light transmittance without impacting opacity.Mechanical properties were affected differently,GO acted as a crosslinking agent reducing elongation and increasing tensile strength at break,on the other hand MOSO acted as a plasticizer,making films more plastic increasing elongation a 30%.These effects counteracted each other,and similar behavior was recorded in differential scanning calorimetry.The films exhibited an improved water vapor resistance,which is crucial for food packaging.These findings indicate that the incorporation of GO and MOSO into a gelatin matrix may produce biodegradable polymer films with enhanced properties,suitable for active packaging in the food industry.
文摘The 2025(15th)China Daily Chemical Industry Forum(CDCIF 2025)and its concurrent event,the 2025 China International Premium Exhibition for Personal Care Ingredients,Packaging&Machinery(IPE 2025)concluded successfully in Guangzhou from September 22nd to 24th.Hosted by the China Research Institute of Daily Chemical(RIDCI),and organized by the China Information Center of Daily Chemical Industry and Productivity Promotion Center of Surfactant and Detergent,the event gathered nearly 600 representatives from government departments,industry associations,and leading enterprises.
基金supported by grants from the Noncommunicable Chronic Diseases-National Science and Technology Major Project(Grant No.2023ZD0501300)Science Technology Department of Zhejiang Province(Grant No.2021C03117)+2 种基金National Natural Science Foundation of China(Grant No.82350104 and 82170219)Natural Science Foundation of Zhejiang Province,China(Grant No.LY23H080004 and LY24H080001)Medical Health Science and Technology Project of Zhejiang Provincial Health Commission(Grant No.2021KY199)。
文摘Chimeric antigen receptor natural killer(CAR-NK)cell therapy is an alternative immunotherapy that provides robust tumor-eliminating effects without inducing life-threatening toxicities and graft-versus-host disease.CAR-NK cell therapy has enabled the development of“off-the-shelf”products that bypass the lengthy and expensive cell manufacturing process1.
基金Penelitian Tesis Magister(PTM)Research Grant from Indonesian Government Kemdikbudristek with contract number 036/E5/PG.02.00.PL/2024.PPM1 2024 Research Grant from Faculty of Industrial Technology,ITB.
文摘The continuous increase in petroleum-based plastic food packaging has led to numerous environmental concerns.One effort to reduce the use of plastic packaging in food is through preservation using biopolymer-based packaging.Among the many types of biopolymers,chitosan is widely used and researched due to its non-toxic,antimicrobial,and antifungal properties.Chitosan is widely available since it is a compound extracted from seafood waste,especially shrimps and crabs.The biodegradability and biocompatibility of chitosan also showed good potential for various applications.These characteristics and propertiesmake chitosan an attractive biopolymer to be implemented as food packaging in films and coatings.Chitosan has been tested in maintaining and increasing the shelf life of food,especially seafood such as fish and shrimp,and post-harvest products such as fruits and vegetables.In addition to its various advantages,the properties and characteristics of chitosan need to be improved to produce optimal preservation.The properties and characteristics of chitosan are improved by adding various types of additive materials such as biopolymers,plant extracts,essential oils,and metal nanoparticles.Research shows that material additives and nanotechnology can improve the quality of chitosan-based food packaging for various types of food by enhancing mechanical properties,thermal stability,antimicrobial activity,and antioxidant activity.This review provides a perspective on the recent development and properties enhancement of chitosan composite with additives and nanotechnology,as well as this material’s challenges and prospects as food packaging.
基金funded by Consejo Nacional de Investigaciones Cientificas y Tecnicas(CONICET,Argentina),grant number PIP 0991by Universidad Nacional de Mar del Plata(UNMdP,Argentina),grant number 15/G686-ING690/23.
文摘Interest in the use of cellulose nanomaterial’s continues to grow,both in research and industry,not only due to the abundance of raw materials,low toxicity and sustainability,but also due to the attractive physical and chemical properties that make nanocelluloses useful for a wide range of end-use applications.Among the large number of potential uses,and nanocelluloses modification and processing strategies,the chosen topic of this review focuses exclusively on plant-derived cellulose microfibers/nanofibers(CNF)and cellulose nanocrystals(CNC)processed into 2D structures—nanopapers and nanofilms—fabricated as self-standing films or applied as coatings.The end uses considered are:combinationwith standard papers and cardboards for packaging,mendingmaterial for the conservation and protection of cellulosic heritage artifacts,and component-parts of complex designs of functional devices for energy harvesting and storage.In these contexts,nanocelluloses provide high mechanical and ecofriendly properties,transparency and tunable haze,as well as flexibility/bendability in the resulting films.All these characteristics make them extremely attractive to a market seeking for sustainable,light weight and low cost raw materials for the production of goods.General perspectives on the current advantages and disadvantages of using CNF and CNC in the selected areas are also reviewed.
基金funded by the Russian Federation represented by the Ministry of Science and Higher Education,Russia,grant number 075-15-2022-1231 on 18.10.2022National Research Foundation(NRF),South Africa,grant number 150508Brazilian National Council for Scientific and Technological Development(CNPq),Brazil,grant number 440057/2022-1.
文摘Petrochemical plastics are widely used for food protection and preservation;however,they exhibit poor biodegradability,resisting natural degradation through physical,chemical,or enzymatic processes.As a sustainable alternative to conventional plastic packaging,edible films offer effective barriers against moisture,gases,and microbial contamination while being biodegradable,biocompatible,and environmentally friendly.In this study,novel active food packaging materials(in film form)were developed by incorporating starch,carrageenan,nanocellulose(NC),Aloe vera,and hibiscus flower extract.The effects of varying the matrix composition(26.5–73.5 wt.%starch/carrageenan),NC concentration(2.77-17.07 wt.%),and particle type(fibers or crystals)on the film structure and characteristics were analyzed using various methods.Scanning electron microscopy demonstrated good homogeneity and effective dispersion of NC within the blendmatrix.An increased carrageenan content in the filmimproved wettability,moisture absorption,solubility,and water vapor permeability.The mechanical properties of the films were enhanced by NC incorporation and higher carrageenan content.The developed films also exhibited effective UV radiation barriers and biodegradability.Films with low carrageenan content(less than 33.3%)and high NC content(7%,10% crystals or 10%,15% fibers)exhibited optimal properties,including enhanced water resistance,hydrophobicity,and mechanical strength,along with reduced water vapor permeability.However,the high water solubility and moisture absorption(above 55% and 14%,respectively)indicated their unsuitability as packaging materials for food products with wet surfaces and high humidity.The results suggest that these films are well suited for use as edible food packaging for fruits and vegetables.
文摘The food industry prioritizes food safety throughout the entire production process.This involves closely monitoring and evaluating all potential sources of biological or chemical contamination,starting from entering raw materials into the production chain and continuing to the final product.Biofilms on food surfaces or containers can harbor dangerous pathogens,such as Listeria monocytogenes.Therefore,it is essential to continuously manage microbial contamination on food contact surfaces to prevent foodborne infections.Recently,there has been increasing interest in using nanomaterials as surface coatings with antimicrobial properties in the food industry,especially since traditional disinfectants or antibiotics may contribute to developing resistance.However,the use of antibiofilm materials for long-term food storage remains underexplored,and there is a notable lack of focused reviews on nanomaterialbased antibiofilm coatings specifically for long-term food preservation.This review aims to consolidate recently reported nanoparticle-based antibiofilm food packaging materials.We discuss the effectiveness of various metal and metal oxide nanoparticles and biopolymer nanocomposites in combating biofilms.Additionally,we highlight the growing importance of biodegradable nanocomposite materials for antibiofilm food packaging.Furthermore,we explore the mechanisms of action,processing methods,and safety aspects of these nanomaterials being developed for food packaging applications.
基金supported by the National Natural Science Foundation of China(Nos.22106169,22136006,and 22021003)。
文摘Photoinitiators(PIs),as an important component of UV inks,are widely used in the printing of paper food packaging.Nevertheless,there is limited information concerning the identification of PIs in food packaging and their potential migration rules under natural storage condition.In this study,23 target PIs detected in paper food packaging were dominated by benzophenones(BZPs),followed by amine co-initiators(ACIs),thioxanthones(TXs)and phosphine oxides(POs).The concentration of ΣPIs ranged between 48.3 and 1.11×10^(5)ng/g.Meanwhile,the concentration ofΣPIs were found to be significantly higher in Corrugated paper compared to Polyethylene(PE)coated paper,Composite paper and White card paper.Benzophenone(BP)was found as the dominant PI congener in Corrugated paper,with the concentration ranging from 923-3.66×10^(4)ng/g.The migration quantity ofΣPIs increased in a time-dependent manner in the first 13 days and then eventually reached equilibrium.Low temperatures had a certain inhibitory effect on the migration of PIs from paper packaging to food.Under high exposure scenario,the EDIs of ΣPIs for children,adolescents,and adults were 31.4 ng/(kg bw·day),17.2 ng/(kg bw·day),and 14.4 ng/(kg bw·day),respectively,all of which did not exceed the reference dose,indicating that dietary intake of PIs does not pose any health risks to the human body.
基金supported by the National Natural Science Foundation of China(32272252)the China Agriculture Research System(CARS-41)funded by the Chinese Ministry of Agriculture and Rural Affairs and Wens Fifth Five R&D Major Project(WENS-2020-1-ZDZX-007).
文摘The hurdle technology for food preservation effectively addresses the limitations of individual antimicrobial technologies by integrating their strengths.It can not only prolong the storage time of food but also maintains its high quality.In this study,three antimicrobial and bactericidal technologies,namely soluble gas stabilization(SGS),modified atmosphere packaging(MAP),and cold plasma(CP),were applied to chilled chicken breasts.The packaging,total viable count(TVC),and physicochemical properties of chilled chicken breasts after treatments and storage at 4℃were monitored.The microbial diversity at the initial and end points of the storage time of each group was also analyzed.The results indicated that a 3−5 h SGS treatment can effectively increase the proportion of carbon dioxide in the MAP during the storage process of chilled chicken breasts,thereby alleviating the packaging collapse problem.Simultaneously,the effect of SGS,MAP,and CP combinational treatments significantly extended the storage time of chilled chicken breasts while maintaining the physicochemical qualities of samples.Compared to the control group,the TVC of chicken breast treated with SGS,MAP,and CP treatments decreased by 0.58(lg(CFU/g))at 0 day.The shelf life was extended by 5 days.After 8 days,the total volatile basic nitrogen(TVB-N)was 26.67 vs.19.50 mg/100 g,thiobarbituric acid reactive substances(TBARS)was 0.99 vs.0.72 mg MDA/kg,and TVC was 8.22 vs.6.52(lg(CFU/g)).High-throughput sequencing results showed that SGS and MAP treatments significantly reduce the proportion of Pseudomonas and Psychrobacter,which are sensitive to carbon dioxide,in the total bacterial genera.This study underscores the potential of integrating multiple antimicrobial technologies for effective food preservation.
基金financially supported by National Natural Science Foundation of China(No.U2241223)Pre-Research Foundation of China(No.909010203-202).
文摘Nano-twinned copper(nt-Cu),with a preferred orientation,is highly promising as interconnect materials in high-density advanced packaging due to its considerable mechanical strength,excellent electrical conductivity,and resistance to thermal migration.However,its application is impeded by sulfur-containing byproducts from the electroplating process,exacerbating the formation of Kirkendall voids within solder joints during thermal aging.Herein,through the incorporation of Zinc(Zn)into the nt-Cu layer,we develop a nt-Cu/Zn composite structure.Our findings provide the first definitive confirmation of the mechanism by which sulfur atoms migrate to the Cu_(3)Sn/nt-Cu interface through interstitial diffusion,thereby reducing the activation energy for vacancy formation.We further demonstrate that Zn effectively an-choring sulfur atoms,forming ZnS within the nt-Cu layer during heat treatment,which increases the vacancy formation energy and inhibits the development of Kirkendall voids.Remarkably,no Kirkendall voids are observed in the modified interconnects even after prolonged aging at 150℃ for 1000 h.The nt-Cu/Zn composite metallization layers significantly decrease the growth rate of interfacial intermetallic compounds by 33.6% and enhance the shear strength of solder interconnections to 228.9%.This research underscores the potential of nt-Cu in advanced electronic packaging,offering new pathways for improving the power density and reliability of electronic devices.
基金supported by the Natural Science Foundation of Fujian Province(No.2022J01044)the Digital Twin and Intelligent Transportation Maintenance Engineering Research Centre of Genting Applied Technology R&D Platform at Xiamen City University.
文摘Cu nanoparticles exhibit excellent properties as high-temperature-resistant,conductive,heat-dissipating,and connecting materials.However,their susceptibility to oxidation poses a major challenge to the production of high-quality sintered bodies in the air,severely limiting their widespread adoption in power electronics packaging.This study presents a novel approach to the synthesis of Cu nanoparticles capped with oleylamine ligands.By employing a simple solvent-cleaning process,effective control of the density of oleylamine ligands on particle surfaces was achieved,resulting in high-performance Cu nanoparticles with both oxidation resistance and air-sintering susceptibility.Moreover,through our research,the solvent-cleaning mechanism was clarified,a model for the oleylamine ligand decomposition was developed,the air-sintering behavior of Cu nanoparticles was analyzed,and the impacts of both the sintered bodies and interfaces on the sintering performance were explained.Additionally,Cu nanoparticles subjected to 5 cleaning rounds followed by sintering at 280℃and 5 MPa in air were confirmed to be able to produce the highest shear strength(49.2±3.51 MPa)and lowest resistivity(6.15±0.32μΩ·cm).Based on these results,flexible capacitive pressure sensors with Cu sintered electrodes were fabricated and demonstrated a stable pressure-capacitance response over the temperature range of 25-250℃.These findings underscore the impressive robustness and durability of sintered structures and the potential for high-temperature applications of oleylamine-capped Cu nanoparticles.Our study provides reliable application demonstrations for the low-cost manufacture of high-performance power electronics packaging structures that can operate in high-current-density,high-heat-flow-density,high-temperature,and high-stress environments.
基金Yingkou Institute of Technology school level scientificresearch project(Grant:ZDIL202302).
文摘Based on the concept of sustainable design,we are committed to seeking innovative solutions and designinga complete express packaging recycling machine.The device consists of a vibration device,a compression device,a winding device and an electronic control system to promote the recycling of resources and environmental protection.This device can further improve the recycling efficiency and feasibility.It provides new ideas and solutions for the express industry and promotes the development of sustainable design in the field of express packaging recycling and reuse devices.
基金funded by the National Natural Science Foundation of China(U22A20547)the Major Science and Technology Projects of Heilongjiang Province(2021ZX12B05 and 2020ZX07B02)。
文摘The present study monitored bacterial succession,physicochemical properties,and volatile organic compounds(VOCs)changes in smoked chicken legs with modified atmosphere packaging(MAP,60% CO_(2) and 40%N_(2))during a 25-day storage period at 4℃.After 15 days of storage,S erratia proteamaculans and Pseudomonas fragi became the predominant bacteria.Furthermore,physicochemical properties changed significantly,as evidenced by an increase in thiobarbituric acid reactive substances and b*(yellowness)value,and a decrease in hardness.A total of 65 VOCs were identified during storage.Correlation between bacterial succession and quality indicators(including VOCs and physicochemical properties)allowed the identification of 26 core dominant bacteria,including S.proteamaculans,Psychrobacter alimentarius,Pseudomonas putida,and Pseudomonas poae,which were positively related to spoilage VOCs(e.g.,1-octen-3-ol,1-pentanol,and 3-methyl-1-butanol)and could be defined as specific spoilage organisms(SSOs).The results of this study provide a systematic approach to predict SSOs in smoked chicken legs during storage,which can also provide a basis for product safety.
基金supported by the National Natural Science Foundation of China(Grant Nos.52475166,52175148)the Regional Collaboration Project of Shanxi Province(Grant No.202204041101044).
文摘Modern warfare demands weapons capable of penetrating substantial structures,which presents sig-nificant challenges to the reliability of the electronic devices that are crucial to the weapon's perfor-mance.Due to miniaturization of electronic components,it is challenging to directly measure or numerically predict the mechanical response of small-sized critical interconnections in board-level packaging structures to ensure the mechanical reliability of electronic devices in projectiles under harsh working conditions.To address this issue,an indirect measurement method using the Bayesian regularization-based load identification was proposed in this study based on finite element(FE)pre-dictions to estimate the load applied on critical interconnections of board-level packaging structures during the process of projectile penetration.For predicting the high-strain-rate penetration process,an FE model was established with elasto-plastic constitutive models of the representative packaging ma-terials(that is,solder material and epoxy molding compound)in which material constitutive parameters were calibrated against the experimental results by using the split-Hopkinson pressure bar.As the impact-induced dynamic bending of the printed circuit board resulted in an alternating tensile-compressive loading on the solder joints during penetration,the corner solder joints in the edge re-gions experience the highest S11 and strain,making them more prone to failure.Based on FE predictions at different structural scales,an improved Bayesian method based on augmented Tikhonov regulariza-tion was theoretically proposed to address the issues of ill-posed matrix inversion and noise sensitivity in the load identification at the critical solder joints.By incorporating a wavelet thresholding technique,the method resolves the problem of poor load identification accuracy at high noise levels.The proposed method achieves satisfactorily small relative errors and high correlation coefficients in identifying the mechanical response of local interconnections in board-level packaging structures,while significantly balancing the smoothness of response curves with the accuracy of peak identification.At medium and low noise levels,the relative error is less than 6%,while it is less than 10%at high noise levels.The proposed method provides an effective indirect approach for the boundary conditions of localized solder joints during the projectile penetration process,and its philosophy can be readily extended to other scenarios of multiscale analysis for highly nonlinear materials and structures under extreme loading conditions.
基金the National Natural Science Foundation of China(62174170)the Natural Science Foundation of Guangdong Province(2024A1515010123)+4 种基金the Shenzhen Science and Technology Program(20220807020526001)the Strategic Priority Research Program of the Chinese Academy of Sciences(XDB0670000)the Shenzhen Science and Technology Program(KJZD20230923114708018,KJZD20230923114710022)the Talent Support Project of Guangdong(2021TX06C101)the Shenzhen Basic Research(JCYJ20210324115406019).
文摘Laser debonding technology has been widely used in advanced chip packaging,such as fan-out integration,2.5D/3D ICs,and MEMS devices.Typically,laser debonding of bonded pairs(R/R separation)is typically achieved by completely removing the material from the ablation region within the release material layer at high energy densities.However,this R/R separation method often results in a significant amount of release material and carbonized debris remaining on the surface of the device wafer,severely reducing product yields and cleaning efficiency for ultra-thin device wafers.Here,we proposed an interfacial separation strategy based on laser-induced hot stamping effect and thermoelastic stress wave,which enables stress-free separation of wafer bonding pairs at the interface of the release layer and the adhesive layer(R/A separation).By comprehensively analyzing the micro-morphology and material composition of the release material,we elucidated the laser debonding behavior of bonded pairs under different separation modes.Additionally,we calculated the ablation threshold of the release material in the case of wafer bonding and established the processing window for different separation methods.This work offers a fresh perspective on the development and application of laser debonding technology.The proposed R/A interface separation method is versatile,controllable,and highly reliable,and does not leave release materials and carbonized debris on device wafers,demonstrating strong industrial adaptability,which greatly facilitates the application and development of advanced packaging for ultra-thin chips.
文摘With the growing demands for food safety,quality,and environmental protection,active food packaging is playing an increasingly vital role in the food industry.Traditional food packaging primarily protects products and facilitates transportation.Active food packaging,however,not only fulfills these fundamental functions but also actively interacts with the food or its environment to extend shelf life and enhance food safety.From current research advancements and market applications,active food packaging demonstrates the following prominent development trends.
文摘In the article“Recent Advancements in Nanocomposites-Based Antibiofilm Food Packaging”by Bandana Padhan et al.(Journal of Polymer Materials,2025,Vol.42,No.2,pp.411–433.doi:10.32604/jpm.2024.059156),originally published online on December 9,2024,and formally included in Vol.42,No.2(published on July 11,2025).
文摘This study aims to the factors influencing consumer intention to purchase eco-friendly,small-packaged agricultural products using the Theory of Planned Behavior(TPB).With increasing demand for sustainable consumption,eco-friendly food packaging has become a critical focus within the circular economy.This study was conducted in Seoul,South Korea,a key marketplace for consumer trends,and surveyed 200 respondents to examine key TPB components—attitude,subjective norms,and perceived behavioral control—along with additional factors shaping sustainable purchasing behavior.The findings indicate that perceived behavioral control is the predictor of purchase intention(β=0.510,p<0.001),followed by attitude(β=0.236,p<0.05)and subjective norms(β=0.199,p<0.05).Moreover,the results suggest that while social influences play a role,individuals who perceive fewer barriers and have a stronger personal attitude toward sustainability are more likely to adopt eco-friendly purchasing behaviors.These results highlight the importance of consumer autonomy and confidence in making eco-friendly choices,suggesting that increasing accessibility and affordability of sustainable packaging can drive adoption.Despite social influences,urban consumers prioritize personal values and perceived control over purchasing behavior.The study might contribute to sustainability literature by offering insights into eco-conscious consumer behavior and implications for marketing strategies that promote sustainable agricultural products.Future research should explore cross-cultural comparisons and additional psychological determinants to enhance the understanding of sustainable consumption patterns.
文摘The electronic packaging box with high silicon aluminum-base alloy was prepared by semi-solid thixoforming technique.The flow characteristic of the Si phase was analyzed.The microstructures of different parts of the box were observed by optical microscopy and scanning electron microscopy,and the thermophysical and mechanical properties of the box were tested.The results show that there exists the segregation phenomenon between the primary Si phase and the liquid phase during thixoforming,the liquid phase flows from the box,and the primary Si phase accumulates at the bottom of the box.The volume fraction of primary Si phase decreases gradually from the bottom to the walls.Accordingly,the thermal conductivities of bottom center and walls are 107.6 and 131.5 W/（m·K）,the coefficients of thermal expansion（CTE） are 7.9×10-6 and 10.6×10-6 K-1,respectively.The flexural strength increases slightly from 167 to 180 MPa.The microstructures and properties of the box show gradient distribution overall.
