We propose an ultra-simple dual-channel configuration for simultaneously evaluating two branches of a multifunctional integrated optic chip(MFIOC). In the configuration, the MFIOC is employed as a beam splitter to con...We propose an ultra-simple dual-channel configuration for simultaneously evaluating two branches of a multifunctional integrated optic chip(MFIOC). In the configuration, the MFIOC is employed as a beam splitter to construct the demodulation interferometer together with a 2 × 2 fiber coupler. Interference happens between polarization modes traveling through different channels of the MFIOC. The cross-couplings of each channel are respectively characterized by the interference peaks which distribute on opposite sides of the central interference peak. Temperature responses of the MFIOC are experimentally measured from-40°C to 80°C. Results show that the proposed configuration can achieve simultaneous dual-channel transient measurements with resolution of-90 d B and dynamic range of 90 d B. In addition, the two channels of the configuration have consistent measuring performance, and the two branches of the MFIOC have different responses to temperature variation.展开更多
Direct wafer bonding allows polished semiconductor wafers to be joined together without the use of a binder.It has a wide range of applications in integrated circuit fabrication,micro-electro-mechanical systems(MEMS)p...Direct wafer bonding allows polished semiconductor wafers to be joined together without the use of a binder.It has a wide range of applications in integrated circuit fabrication,micro-electro-mechanical systems(MEMS)packaging and multifunctional chip integration.Chip deflection and strain energy can be used to assess the bonding quality,and impurities have an important effect on the bonding quality.In this paper,a mathematical model and a finite element model of wafer bonding are established.The effects of different impurity distributions(Cluster,Complex,Face,Line)on the bonding quality of wafers are investigated,and the results show that the curvature and thickness of the wafer as well as the distribution of the impurity particles jointly determine the strain energy of the wafer under a certain pressure.Among them,the impurity particle surface distribution has the greatest influence on the wafer bonding quality.Finite element simulations verified the correctness of the proposed model.This work provides a theoretical basis for studying the effect of impurity distribution on wafer bonding performance.展开更多
基金the National Natural Science Foundation of China (Grants Nos. 61227013, 61307104,61422505)the Program for New Century Excellent Talents in University (NCET-12-0623)+2 种基金the National Key Scientific Instrument and Equipment Development Project (No. 2013YQ040815)the Specialized Research Fund for the Doctoral Program of Higher Education (No. 20122304110022)the Heilongjiang Provincial Natural Science Foundation (No. ZD201205)
文摘We propose an ultra-simple dual-channel configuration for simultaneously evaluating two branches of a multifunctional integrated optic chip(MFIOC). In the configuration, the MFIOC is employed as a beam splitter to construct the demodulation interferometer together with a 2 × 2 fiber coupler. Interference happens between polarization modes traveling through different channels of the MFIOC. The cross-couplings of each channel are respectively characterized by the interference peaks which distribute on opposite sides of the central interference peak. Temperature responses of the MFIOC are experimentally measured from-40°C to 80°C. Results show that the proposed configuration can achieve simultaneous dual-channel transient measurements with resolution of-90 d B and dynamic range of 90 d B. In addition, the two channels of the configuration have consistent measuring performance, and the two branches of the MFIOC have different responses to temperature variation.
基金supported by the National Key R&D Program of China(No.2022YFB3207100)the Hubei Provincial Strategic Scientist Training Plan(No.2022EJD009)the Fundamental Research Funds for the Central Universities(No.2042023kf1041).
文摘Direct wafer bonding allows polished semiconductor wafers to be joined together without the use of a binder.It has a wide range of applications in integrated circuit fabrication,micro-electro-mechanical systems(MEMS)packaging and multifunctional chip integration.Chip deflection and strain energy can be used to assess the bonding quality,and impurities have an important effect on the bonding quality.In this paper,a mathematical model and a finite element model of wafer bonding are established.The effects of different impurity distributions(Cluster,Complex,Face,Line)on the bonding quality of wafers are investigated,and the results show that the curvature and thickness of the wafer as well as the distribution of the impurity particles jointly determine the strain energy of the wafer under a certain pressure.Among them,the impurity particle surface distribution has the greatest influence on the wafer bonding quality.Finite element simulations verified the correctness of the proposed model.This work provides a theoretical basis for studying the effect of impurity distribution on wafer bonding performance.
