大联大控股宣布,其旗下诠鼎推出基于MicroVision技术的3D深度感测激光扫描技术在智能家居领域的应用解决方案。该技术为新一代激光扫描系统,利用MicroVision独家专利的激光扫描投影技术,加上红外线激光与光二极管,利用时间飞行技术(Time...大联大控股宣布,其旗下诠鼎推出基于MicroVision技术的3D深度感测激光扫描技术在智能家居领域的应用解决方案。该技术为新一代激光扫描系统,利用MicroVision独家专利的激光扫描投影技术,加上红外线激光与光二极管,利用时间飞行技术(Time of Flight),搭配自行开发的ToF芯片与演算法。展开更多
Advanced testing methods for the dynamics of mechanical microdevices are necessary to develop reliable, marketable microelectromechanical systems. A system for measuring the nanometer motions of microscopic structures...Advanced testing methods for the dynamics of mechanical microdevices are necessary to develop reliable, marketable microelectromechanical systems. A system for measuring the nanometer motions of microscopic structures has been demonstrated. Stop-action images of a target have been obtained with computer microvision, microscopic interferometry, and stroboscopic illuminator. It can be developed for measuring the in-plane-rigid-body motions, surface shapes, out-of-plane motions and deformations of microstructures. A new algorithm of sub-pixel step length correlation template matching is proposed to extract the in-plane displacement from vision images. Hariharan five-step phase-shift interferometry algorithm and unwrapping algorithms are adopted to measure the out-of-plane motions. It is demonstrated that the system can measure the motions of solder wetting in surface mount technology(SMT).展开更多
文摘大联大控股宣布,其旗下诠鼎推出基于MicroVision技术的3D深度感测激光扫描技术在智能家居领域的应用解决方案。该技术为新一代激光扫描系统,利用MicroVision独家专利的激光扫描投影技术,加上红外线激光与光二极管,利用时间飞行技术(Time of Flight),搭配自行开发的ToF芯片与演算法。
文摘Advanced testing methods for the dynamics of mechanical microdevices are necessary to develop reliable, marketable microelectromechanical systems. A system for measuring the nanometer motions of microscopic structures has been demonstrated. Stop-action images of a target have been obtained with computer microvision, microscopic interferometry, and stroboscopic illuminator. It can be developed for measuring the in-plane-rigid-body motions, surface shapes, out-of-plane motions and deformations of microstructures. A new algorithm of sub-pixel step length correlation template matching is proposed to extract the in-plane displacement from vision images. Hariharan five-step phase-shift interferometry algorithm and unwrapping algorithms are adopted to measure the out-of-plane motions. It is demonstrated that the system can measure the motions of solder wetting in surface mount technology(SMT).
