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Engineered Functional Surfaces by Laser Microprocessing for Biomedical Applications 被引量:6
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作者 Guoqing Hu Kai Guan +3 位作者 Libin Lu Jiaru Zhang Nie Lu Yingchun Guan 《Engineering》 SCIE EI 2018年第6期822-830,共9页
Metallic biomaterials are increasingly being used in various medical applications due to their high strength,fracture resistance,good electrical conductivity,and biocompatibility.However,their practical applications h... Metallic biomaterials are increasingly being used in various medical applications due to their high strength,fracture resistance,good electrical conductivity,and biocompatibility.However,their practical applications have been largely limited due to poor surface performance.Laser microprocessing is an advanced method of enhancing the surface-related properties of biomaterials.This work demonstrates the capability of laser microprocessing for biomedical metallic materials including magnesium and titanium alloys,with potential applications in cell adhesion and liquid biopsy.We investigate laser-material interaction,microstructural evolution,and surface performance,and analyze cell behavior and the surface-enhanced Raman scattering(SERS)effect.Furthermore,we explore a theoretical study on the laser microprocessing of metallic alloys that shows interesting results with potential applications.The results show that cells exhibit good adhesion behavior at the surface of the laser-treated surface,with a preferential direction based on the textured structure.A significant SERS enhancement of 6×10^3 can be obtained at the laser-textured surface during Raman measurement. 展开更多
关键词 LASER microprocessing FUNCTIONAL SURFACE METALLIC ALLOY Niocompatibility SERS
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Unifying the Software Process Spectrum 被引量:5
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作者 Mingshu Li Barry W.Boehm Leon J.Osterweil 《软件学报》 EI CSCD 北大核心 2006年第4期649-657,共9页
Software Process Workshop(SPW 2005)was held in Beijing on May 25-27,2005.This paper introduces the motivation of organizing such a workshop,as well as its theme and paper gathering and review;and summarizes the main c... Software Process Workshop(SPW 2005)was held in Beijing on May 25-27,2005.This paper introduces the motivation of organizing such a workshop,as well as its theme and paper gathering and review;and summarizes the main content and insights of 11 keynote speeches,30 regular papers in five sessions of“Process Content”,“Process Tools and Metrics”,“Process Management”,“Process Representation and Analysis”,and“Experience Reports”,8 software development support tools demonstration,and the ending panel“Where Are We Now?Where Should We Go Next?”. 展开更多
关键词 software process microprocess and macroprocess WORKSHOP
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KEY TECHNOLOGY FOR PRACTICAL 1-mm-DIAMETER ELECTROMAGNETIC MICROMOTOR
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作者 杨红红 张琛 《Journal of Shanghai Jiaotong university(Science)》 EI 2000年第2期94-98,共5页
A 1 mm diameter electromagnetic micromotor was developed as a crux component for MEMS application. The motor has a novel layer structure with a 1 mm diameter rotor in the middle of two stators with the same size. The ... A 1 mm diameter electromagnetic micromotor was developed as a crux component for MEMS application. The motor has a novel layer structure with a 1 mm diameter rotor in the middle of two stators with the same size. The stator uses multiple layers, slotless and concentrated planar winding. The rotor adopts multipolar permanent magnet with high performance. Ruby bearing is used to prolong operating lifetime of the micromotor. The stator winding, consisting of 6 layer coils, 42 turns, and 9 pairs, is fabricated with microprocessing techniques. The micromotor has long operation lifetime, its running speed is stable and controllable, and rotational direction can be easily reversed. Maximum achieved rotational speed of 18000 r/min with maximum output torque of 1.5 μ N·m has been obtained. This paper presented the key technology for developing this kind of micromotor including the design of structure, magnetic circuit, heat problem, friction improvement, microprocessing techniques, and so on. 展开更多
关键词 MM DIAMETER ELECTROMAGNETIC MICROMOTOR layer structure magnetic CIRCUIT heat resistance microprocessing technique Document code:A
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