CONSPECTUS:Solution-processed electronics have shown promise in cost-effective manufacturing,but face challenges in precisely and accurately placing electronic materials.Traditional methods,such as photolithography wi...CONSPECTUS:Solution-processed electronics have shown promise in cost-effective manufacturing,but face challenges in precisely and accurately placing electronic materials.Traditional methods,such as photolithography with photoresists,involve complex steps that can damage electronic materials.Alternatives such as orthogonal patterning and inkjet printing are limited by the difficulty of finding compatible chemicals that do not dissolve underlying layers,while nanoimprinting lacks compatibility with high-throughput processes and suffers from poor chemical robustness.Conventional photo-cross-linking approaches have used organic or polymeric agents to pattern electronic layers,but the consecutive application of photo-cross-linking processes for patterning and stacking of multiple electronic materials typically led to degradation of the intrinsic properties of the materials.展开更多
基金supported by the Samsung Research Funding&Incubation Center of Samsung Electronics under project number SRFC-MA1901-51by the National Research Foundation of Korea(NRF)grant funded by the Ministry of Science,ICT,and Future Planning under project number(NRF 2023R1A2C3006550,RS-2023-00244309).
文摘CONSPECTUS:Solution-processed electronics have shown promise in cost-effective manufacturing,but face challenges in precisely and accurately placing electronic materials.Traditional methods,such as photolithography with photoresists,involve complex steps that can damage electronic materials.Alternatives such as orthogonal patterning and inkjet printing are limited by the difficulty of finding compatible chemicals that do not dissolve underlying layers,while nanoimprinting lacks compatibility with high-throughput processes and suffers from poor chemical robustness.Conventional photo-cross-linking approaches have used organic or polymeric agents to pattern electronic layers,but the consecutive application of photo-cross-linking processes for patterning and stacking of multiple electronic materials typically led to degradation of the intrinsic properties of the materials.
