Realizing the accurate characterization for the dynamic damage process is a great challenge. Here we carry out testing simultaneously for dynamic monitoring and acoustic emission （AE） statistical analysis towards fi...Realizing the accurate characterization for the dynamic damage process is a great challenge. Here we carry out testing simultaneously for dynamic monitoring and acoustic emission （AE） statistical analysis towards fiber composites under mode-Ⅱ delamination damage. The load curve, AE relative energy, amplitude distribution, and amplitude spectrum are obtained and the delamination damage mechanism of the composites is investigated by the microscopic observation of a fractured specimen. The results show that the micro-damage accumulation around the crack tip region has a great effect on the evolutionary process of delamination. AE characteristics and amplitude spectrum represent the damage and the physical mechanism originating from the hierarchical microstructure. Our finding provides a novel aud feasible strategy to simultaneously evaluate the dynamic response and micro-damage mechanism for fiber composites.展开更多
An elastic-viscoplastic mechanics model is used to investigate asymptotically the mode Ⅲ dynamically propagating crack tip field in elastic-viscoplastic materials. The stress and strain fields at the crack tip posses...An elastic-viscoplastic mechanics model is used to investigate asymptotically the mode Ⅲ dynamically propagating crack tip field in elastic-viscoplastic materials. The stress and strain fields at the crack tip possess the same power-law singularity under a linear-hardening condition. The singularity exponent is uniquely determined by the viscosity coefficient of the material. Numerical results indicate that the motion parameter of the crack propagating speed has little effect on the zone structure at the crack tip. The hardening coefficient dominates the structure of the crack-tip field. However, the secondary plastic zone has little influence on the field. The viscosity of the material dominates the strength of stress and strain fields at the crack tip while it does have certain influence on the crack-tip field structure. The dynamic crack-tip field degenerates into the relevant quasi-static solution when the crack moving speed is zero. The corresponding perfectly-plastic solution is recovered from the linear-hardening solution when the hardening coefficient becomes zero.展开更多
With the rapid development of semiconductors,the number of materials needed to be polished sharply increases.The material properties vary significantly,posing challenges to chemical mechanical polishing(CMP).According...With the rapid development of semiconductors,the number of materials needed to be polished sharply increases.The material properties vary significantly,posing challenges to chemical mechanical polishing(CMP).Accordingly,the study aimed to classify the material removal mechanism.Based on the CMP and atomic force microscopy results,the six representative metals can be preliminarily classified into two groups,presumably due to different material removal modes.From the tribology perspective,the first group of Cu,Co,and Ni may mainly rely on the mechanical plowing effect.After adding H_(2)O_(2),corrosion can be first enhanced and then suppressed,affecting the surface mechanical strength.Consequently,the material removal rate(MRR)and the surface roughness increase and decrease.By comparison,the second group of Ta,Ru,and Ti may primarily depend on the chemical bonding effect.Adding H_(2)O_(2)can promote oxidation,increasing interfacial chemical bonds.Therefore,the MRR increases,and the surface roughness decreases and levels off.In addition,CMP can be regulated by tuning the synergistic effect of oxidation,complexation,and dissolution for mechanical plowing,while tuning the synergistic effect of oxidation and ionic strength for chemical bonding.The findings provide mechanistic insight into the material removal mechanism in CMP.展开更多
The previous research of precision grinding optical glasses with electrolytic in process dressing （ELID） technology mainly concentrated on the action of ELID and machining parameters when grinding, which aim at gene...The previous research of precision grinding optical glasses with electrolytic in process dressing （ELID） technology mainly concentrated on the action of ELID and machining parameters when grinding, which aim at generating very ＂smoothed＂ surfaces and reducing the subsurface damage. However, when grinding spectrosil 2000 and BK7 glass assisted with ELID technology, a deeply comparative study on material removal mechanism and the wheel wear behaviors have not been given yet. In this paper, the micro/nano indentation technique is initially applied for investigating the mechanical properties of optical glasses, whose results are then refereed to evaluate the machinability. In single grit diamond scratching on glasses, the scratching traces display four kinds of scratch characteristics according to different material removal modes. In normal grinding experiments, the result shows BK7 glass has a better machinability than that of spectrosil 2000, corresponding to what the micro/nano indentation vent revealed. Under the same grinding depth parameters, the smaller amplitude of acoustic emission （AE） raw signals, grinding force and grinding force ratio correspond to a better surface quality. While for these two kinds of glasses, with the increasing of grinding depth, the variation trends of the surface roughness, the force ratio, and the AE raw signals are contrary, which should be attributed to different material removal modes. Moreover, the SEM micrographs of used wheels surface indicate that diamond grains on the wheel surface after grinding BK7 glass are worn more severely than that of spectrosil 2000. The proposed research analyzes what happened in the grinding process with different material removal patterns, which can provide a basis for producing high-quality optical glasses and comprehensively evaluate the surface and subsurface integrity of optical glasses.展开更多
基金Supported by the Natural Science Foundation of Hebei Province under Grant No E2012201084the National University Students’ Innovative Training Program under Grant No 201410075004
文摘Realizing the accurate characterization for the dynamic damage process is a great challenge. Here we carry out testing simultaneously for dynamic monitoring and acoustic emission （AE） statistical analysis towards fiber composites under mode-Ⅱ delamination damage. The load curve, AE relative energy, amplitude distribution, and amplitude spectrum are obtained and the delamination damage mechanism of the composites is investigated by the microscopic observation of a fractured specimen. The results show that the micro-damage accumulation around the crack tip region has a great effect on the evolutionary process of delamination. AE characteristics and amplitude spectrum represent the damage and the physical mechanism originating from the hierarchical microstructure. Our finding provides a novel aud feasible strategy to simultaneously evaluate the dynamic response and micro-damage mechanism for fiber composites.
文摘An elastic-viscoplastic mechanics model is used to investigate asymptotically the mode Ⅲ dynamically propagating crack tip field in elastic-viscoplastic materials. The stress and strain fields at the crack tip possess the same power-law singularity under a linear-hardening condition. The singularity exponent is uniquely determined by the viscosity coefficient of the material. Numerical results indicate that the motion parameter of the crack propagating speed has little effect on the zone structure at the crack tip. The hardening coefficient dominates the structure of the crack-tip field. However, the secondary plastic zone has little influence on the field. The viscosity of the material dominates the strength of stress and strain fields at the crack tip while it does have certain influence on the crack-tip field structure. The dynamic crack-tip field degenerates into the relevant quasi-static solution when the crack moving speed is zero. The corresponding perfectly-plastic solution is recovered from the linear-hardening solution when the hardening coefficient becomes zero.
基金support by the National Natural Science Foundation of China(51975488 and 51991373)National Key R&D Program of China(2020YFA0711001)Fundamental Research Funds for the Central Universities(2682021CG011).
文摘With the rapid development of semiconductors,the number of materials needed to be polished sharply increases.The material properties vary significantly,posing challenges to chemical mechanical polishing(CMP).Accordingly,the study aimed to classify the material removal mechanism.Based on the CMP and atomic force microscopy results,the six representative metals can be preliminarily classified into two groups,presumably due to different material removal modes.From the tribology perspective,the first group of Cu,Co,and Ni may mainly rely on the mechanical plowing effect.After adding H_(2)O_(2),corrosion can be first enhanced and then suppressed,affecting the surface mechanical strength.Consequently,the material removal rate(MRR)and the surface roughness increase and decrease.By comparison,the second group of Ta,Ru,and Ti may primarily depend on the chemical bonding effect.Adding H_(2)O_(2)can promote oxidation,increasing interfacial chemical bonds.Therefore,the MRR increases,and the surface roughness decreases and levels off.In addition,CMP can be regulated by tuning the synergistic effect of oxidation,complexation,and dissolution for mechanical plowing,while tuning the synergistic effect of oxidation and ionic strength for chemical bonding.The findings provide mechanistic insight into the material removal mechanism in CMP.
基金supported by National Key Science and Technology Projects of China (Grant No. 2009ZX04001-101, Grant No. 2009ZX01001-151)New Century Excellent Talents in University of China (Grant No. NCET-07-0246)Pre-Research Project of General Armament Department of China (Grant No. 9140A18070209HT0138)
文摘The previous research of precision grinding optical glasses with electrolytic in process dressing （ELID） technology mainly concentrated on the action of ELID and machining parameters when grinding, which aim at generating very ＂smoothed＂ surfaces and reducing the subsurface damage. However, when grinding spectrosil 2000 and BK7 glass assisted with ELID technology, a deeply comparative study on material removal mechanism and the wheel wear behaviors have not been given yet. In this paper, the micro/nano indentation technique is initially applied for investigating the mechanical properties of optical glasses, whose results are then refereed to evaluate the machinability. In single grit diamond scratching on glasses, the scratching traces display four kinds of scratch characteristics according to different material removal modes. In normal grinding experiments, the result shows BK7 glass has a better machinability than that of spectrosil 2000, corresponding to what the micro/nano indentation vent revealed. Under the same grinding depth parameters, the smaller amplitude of acoustic emission （AE） raw signals, grinding force and grinding force ratio correspond to a better surface quality. While for these two kinds of glasses, with the increasing of grinding depth, the variation trends of the surface roughness, the force ratio, and the AE raw signals are contrary, which should be attributed to different material removal modes. Moreover, the SEM micrographs of used wheels surface indicate that diamond grains on the wheel surface after grinding BK7 glass are worn more severely than that of spectrosil 2000. The proposed research analyzes what happened in the grinding process with different material removal patterns, which can provide a basis for producing high-quality optical glasses and comprehensively evaluate the surface and subsurface integrity of optical glasses.
