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Effect of Introducing Conductive Organic Carrier on Properties of Low-Temperature Conductive Silver Paste 被引量:1
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作者 Peng Chen Wentao Shi +1 位作者 Jian Wan Lu Huang 《Journal of Renewable Materials》 SCIE EI 2023年第2期1017-1029,共13页
The poly(epoxy-N-methylaniline)conductive organic carrier was used as the bonding phase of the low-temperature conductive silver paste.Then,this was mixed with different proportions of silver powder to prepare the low... The poly(epoxy-N-methylaniline)conductive organic carrier was used as the bonding phase of the low-temperature conductive silver paste.Then,this was mixed with different proportions of silver powder to prepare the low-temperature conductive silver paste.Afterwards,the effect of the conductive organic carrier on the properties of the low-temperature conductive silver paste was determined by IR,DMA and SEM.The results revealed that the prepared conductive paste has good conductivity,film-forming performance,printing performance,low-temperature curing performance,and anti-aging performance.When the mass percentage of the bonding phase/conductive phase was 40/60,the lowest volume resistivity of the conductive silver paste was 4.9×10^(−6)Ω⋅cm,and the conductivity was the best. 展开更多
关键词 Low temperature conductive silver paste poly(epoxy-N-methylaniline) volume resistivity conductivity
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Conformal and rapid micro-molding manufacturing of ultraviolet-curable silver paste on curved surfaces using digital light processing
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作者 Mei-Ling Yang Guo-Xiang Zhou +8 位作者 Ning Xie Kun-Peng Lin Yan-Zhao Zhang Zhe Zhao Yun-Peng He Yu-Hang Zhang Zhi-Hua Yang De-Chang Jia Yu Zhou 《Journal of Materials Science & Technology》 2025年第10期153-161,共9页
Electronic 3D printing possesses a remarkable molding ability and convenience in integrated circuits,flexible wearables,and individual automobile requirements.However,traditional 3D printing technology still struggles... Electronic 3D printing possesses a remarkable molding ability and convenience in integrated circuits,flexible wearables,and individual automobile requirements.However,traditional 3D printing technology still struggles to meet the demands of high precision and high efficiency in the process of fabricating a curved surface circuit,particularly achieving precise silver circuit molding on irregular substrates.Here,a high-precision and muti-scaled conformal manufacturing method for silver circuits is presented through the digital light processing(DLP)of ultraviolet-curable silver paste(UV-SP)with adjustable photocuring properties,enabling the successful preparation of micro-scaled conductive structure on the sharply skewed hook face.The minimum modeling depth and width of the cured silver paste can be well controlled to 10 and 88µm,respectively.Compared with traditional printing technology,the printing efficiency of complex patterns has increased by over 70%.The printed silver circuit demonstrates an exceptionally high electrical conductivity,reaching as high as 1.16×10^(7) S/m.Additionally,the UV-SP exhibits significant manufacturing efficiency and superior molding resolution compared to conventional direct ink writing and inkjet printing techniques,thereby contributing to the attainment of high precision and efficiency of conformal and micro-molding manufacturing in sensors,communication antennas,and other electronic devices based on curved substrates. 展开更多
关键词 Digital light processing Ultraviolet-curable silver paste Conformal manufacturing silver circuits High precision
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Study on the performance of silver paste sintered sealing joints for hermetic packaging 被引量:3
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作者 Lin Liting Zhang Yongfei Li Xin 《China Welding》 CAS 2022年第1期29-36,共8页
The traditional hermetic packaging methods,which require high temperatures and high voltages,would have adverse effects on electronics devices.Based on current-assisted sintering technology,we proposed a new hermetic ... The traditional hermetic packaging methods,which require high temperatures and high voltages,would have adverse effects on electronics devices.Based on current-assisted sintering technology,we proposed a new hermetic packaging method using silver paste.Comparing the microstructure of the joints sintered with different currents,we found that with the increasing sintering current from 4.7 kA to 5.3 kA,the density of the joint increases,which improves the hermeticity and bonding strength of the joints.The results of thermal cycling tests showed that the sealing joints sintered at 4.7 kA with larger porosity are more prone to fail because pores tend to be sources of defects under thermal cycling.After 250 ℃ high thermal storage,there is the coarsening of the pores and the delamination near the Ag/Au interface,degrading the sealing performance of the sintered joint.Besides,the sealing joints sintered at 5.3 kA exhibit superior reliability when exposed to high temperatures. 展开更多
关键词 silver paste electric-current-assisted sintering hermetic package reliability
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PREPARATION OF SILVER POWDER FOR CONDUCTIVE PASTE 被引量:1
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作者 Chai, Liyuan Zhong, Haiyun Wu, Huiyun(Department of Nonferrous Metallurgy,Central South Universigy of technology, Changsha 410083, China) 《中国有色金属学会会刊:英文版》 CSCD 1994年第1期33-36,共4页
PREPARATIONOFSILVERPOWDERFORCONDUCTIVEPASTEChai,Liyuan;Zhong,Haiyun;Wu,Huiyun(DepartmentofNonferrousMetallur... PREPARATIONOFSILVERPOWDERFORCONDUCTIVEPASTEChai,Liyuan;Zhong,Haiyun;Wu,Huiyun(DepartmentofNonferrousMetallurgy,CentralSouthUn... 展开更多
关键词 SUSPENSION mixture KAg(CN)2 LUMINOUS silver FLAKE powder silver paste
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Stretchable Strain Sensors Fabricated by Screen Printing of Silver Paste on the Surface Modified Transparent Elastomeric Polyurethane Films
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作者 Chang Gyu Lee Bo Seok Kwon +5 位作者 Hyun Min Nam Duck Min Seo Jinwoo Park Hyuc Hwangbo Lee Soon Park Su Yong Nam 《Materials Sciences and Applications》 2018年第13期1008-1020,共13页
Strain sensors for human-motion detection must offer high stretchability, high sensitivity, fast response, and high recovery speed. In this study, we choose silver paste as a sensing material and use a screen printing... Strain sensors for human-motion detection must offer high stretchability, high sensitivity, fast response, and high recovery speed. In this study, we choose silver paste as a sensing material and use a screen printing method to fabricate the strain sensor based upon an electrical-resistance mechanism. After curing elastomeric polyurethane film with a thickness of 150 μm on PET film, the polyester resin mixed with blocked isocyanate curing agent was coated as a masking layer to reduce the film’s stickiness. The effect of the polyester masking layer upon the silver paste screen printing process was examined using a rolling-ball-tack test, TGA analysis of polyester resins, and cured silver-electrode films. The cost-effective strain sensor fabricated by using silver paste and screen printing processes on the stretchable-polyurethane-substrate film showed high sensitivity and fast response in a strain range of up to 100%. 展开更多
关键词 STRETCHABLE Strain Sensor SCREEN PRINTING silver paste
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Silver Paste Using Reactive Monomolecular Layer
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作者 Shogo Onishi Yuji Ohkubo Kazufumi Ogawa 《材料科学与工程(中英文版)》 2010年第3期1-6,共6页
关键词 导电银浆 单分子层 傅立叶变换红外光谱仪 反应 X射线光电子能谱 电阻测量 电子能谱测量 环氧基团
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An investigation of gamma ray mass attenuation from 80.1 to 834.86 keV for fabric coating pastes used in textile sector 被引量:1
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作者 Alev Erenler Tuncay Bayram +2 位作者 Yusuf Demirel Erhan Cengiz Rıza Bayrak 《Nuclear Science and Techniques》 SCIE CAS CSCD 2020年第6期52-59,共8页
In the present study,we investigate several textile coating pastes used in the market based on their radiation protection capability for gamma rays.The gamma ray mass absorption coefficients of some coating pastes dop... In the present study,we investigate several textile coating pastes used in the market based on their radiation protection capability for gamma rays.The gamma ray mass absorption coefficients of some coating pastes doped with antimony,boron and silver elements have been investigated.It has been determined that the gamma ray mass attenuation coefficient decreases rapidly as the energy of the gamma rays increases.It was determined that the doping of the main printing paste with silver and antimony considerably increased the gamma ray absorption capability of main paste.However,the doping of the paste with boron reduces the mass absorption of gamma rays.In particular,the gamma ray mass absorption power of the main paste doped with silver and antimony was determined to be useful in the gamma energy range from 80 to 140keV.This indicates that the newly doped textile material may be considered for radiation protection in the case of low-energy gamma rays. 展开更多
关键词 Gamma ray absorption Radiation protection Printing pastes ANTIMONY silver
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A low-temperature emergency power source designed from warm pastes based on hydrogel
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作者 Chuanchao Sheng Wei Li +5 位作者 Sixie Yang Xiaowei Mu Xinyi Sun Hang Liu Haoshen Zhou Ping He 《Science Bulletin》 2025年第19期3173-3182,共10页
Outdoor activities like mountain marathons and field expeditions often occur in harsh environments where maintaining power and body temperature are crucial for survival.Warm pastes are commonly used to provide warmth ... Outdoor activities like mountain marathons and field expeditions often occur in harsh environments where maintaining power and body temperature are crucial for survival.Warm pastes are commonly used to provide warmth in cold conditions,but their potential as a portable power source has not been fully explored.This research develops an innovative approach to convert warm-paste chemical energy into electrical power for emergencies.By designing a hydrogel-based iron-air battery with a low-temperature-resistant electrolyte,we created a battery capable of operating in low temperatures.Experimental results showed the battery generating 0.98 V of voltage and 2.68 Ah of capacity.The battery can be manually assembled using original warm paste materials and connected in series to power electronic devices like mobile phones,providing a vital communication tool in emergencies.This breakthrough offers a promising solution for enhancing safety and survival during outdoor activities. 展开更多
关键词 Warm paste Hydrogel electrolyte Emergency power low-temperature
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纳米银粉在高性能银包铜浆料中的作用及其导电机理
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作者 张先阳 莫丽玢 +5 位作者 李鹤然 王光红 刁宏伟 周春兰 王文静 赵雷 《物理学报》 北大核心 2026年第5期340-350,共11页
采用高性能银包铜浆料进行金属化电极制备是晶硅异质结(silicon heterojunction,SHJ)等单结太阳电池、叠层太阳电池降本增效的有效手段,但受限于银包铜粉的粒径通常在较大的微米量级,银包铜浆料性能仍有待改善.本文通过将纳米银粉引入... 采用高性能银包铜浆料进行金属化电极制备是晶硅异质结(silicon heterojunction,SHJ)等单结太阳电池、叠层太阳电池降本增效的有效手段,但受限于银包铜粉的粒径通常在较大的微米量级,银包铜浆料性能仍有待改善.本文通过将纳米银粉引入银包铜浆料中,利用其优异的低温烧结活性来提升浆料的导电性能,并系统地分析了纳米银粉对浆料特性及SHJ电池性能的影响机理.研究发现,纳米银粉在浆料固化中因其更强的收缩效应,产生了对大粒径银包铜粉间隙改善的有利影响,降低了浆料体电阻率;但也同时在粉体和SHJ电池接触界面产生了新的孔隙,增大了浆料接触电阻率,由此还导致界面处的有机层相对较厚,降低了SHJ电池的开路电压.纳米银粉可以增强浆料的触变性,使得印刷电极的宽度减小,降低了遮光面积,从而增大了短路电流密度;印刷电极的高度增高,电极横截面积增大,提高了填充因子.最终,在银包铜浆料中纳米银粉添加量为15%时,所得电池转换效率与纯银电极相当,验证了银包铜浆料在降低SHJ电池等多类型太阳电池制造成本方面具备重要潜力. 展开更多
关键词 太阳电池 银包铜浆料 纳米银粉 导电机理
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不同粒径球形银粉互配应用对PERC背面银浆性能的影响
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作者 李加宁 夏粱 +3 位作者 辛芮 王记通 毛朝斌 游立 《船电技术》 2026年第2期61-63,68,共4页
光伏银浆需要有更加高效的性能表现以应对行业降本增效的持续需求。本文主要尝试在有机载体、玻璃粉种类及含量均不变化的情况下,通过不同粒径球形银粉互相掺杂的方式调节银浆烧结后的状态,从而优化PERC背面银浆的导电性能以及与电池片... 光伏银浆需要有更加高效的性能表现以应对行业降本增效的持续需求。本文主要尝试在有机载体、玻璃粉种类及含量均不变化的情况下,通过不同粒径球形银粉互相掺杂的方式调节银浆烧结后的状态,从而优化PERC背面银浆的导电性能以及与电池片的附着力。研究结果表明,由于小粒径银粉活性相对更高,在配方中取代20%的大粒径银粉时,可以提升银浆的烧结活性,烧结后得到更加致密的银电极,其附着力和导电性能可以同步得到优化;但当小粒径银粉继续增加时,会带来烧结后附着力整体恶化的问题。 展开更多
关键词 PERC背面银浆 银粉 致密度 互配 附着力
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先进电子封装导电浆料的制备与应用进展
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作者 李贤迪 张浩波 +2 位作者 柳浩阳 何海英 杨至灏 《当代化工研究》 2026年第3期38-40,共3页
随着宽禁带半导体(SiC/GaN)芯片在新能源汽车、5G基站和物联网等领域的快速发展,先进电子封装对互连材料提出更高要求:需实现低温加工与高温服役的兼容,同时具备优异的电/热导性能和高可靠性。传统焊料因熔点低、热导率不足及热机械疲... 随着宽禁带半导体(SiC/GaN)芯片在新能源汽车、5G基站和物联网等领域的快速发展,先进电子封装对互连材料提出更高要求:需实现低温加工与高温服役的兼容,同时具备优异的电/热导性能和高可靠性。传统焊料因熔点低、热导率不足及热机械疲劳问题难以满足需求,低温烧结银浆凭借低温连接、高熔点和高热导率已成为主流芯片互连材料。综述了先进封装导电浆料的最新进展,包括银颗粒多尺度/多形貌复配、有机载体优化、助剂与烧结工艺调控等关键机制。为应对银价高和离子迁移风险,分析了铜基浆料的抗氧化改性、低温烧结技术及银铜复合体系的成本控制策略。同时,通过颗粒工程、载体协同和新型助剂创新,导电浆料将进一步实现无压/低成本烧结,推动我国高端功率器件关键电子材料的自主化与可持续发展。 展开更多
关键词 先进封装 低温烧结银浆 铜基替代 银铜复合
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Overcoming the trade-off between curing temperature and conductivity for high-performance conductive silver pastes
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作者 Daqian Li Jingyan Yuan +4 位作者 Liangyong Chu Liming Shen Zhen Huang Lingjie Zhang Ningzhong Bao 《Frontiers of Materials Science》 2025年第4期51-63,共13页
The demand for low-temperature cured conductive silver pastes increases rapidly due to the development of advanced electronic fields,such as flexible electronics.Lowering curing temperatures of conductive silver paste... The demand for low-temperature cured conductive silver pastes increases rapidly due to the development of advanced electronic fields,such as flexible electronics.Lowering curing temperatures of conductive silver pastes is generally realized using low-boiling-point solvents.However,such solvents have a low viscosity,leading to the sedimentation of the conductive phase.Increasing the content of the highly viscous binder phase helps solve this issue,but it will lower the electric conductivity.Herein,the trade-off between curing temperature and conductivity of conductive silver pastes was overcome by applying nano-silver particles as the sedimentation inhibitor while bifunctional epoxidized cardol(E-Cardol),with flexible C15 side chains that can significantly enhance the toughness,as the binder.Experiments were performed to determine chemical compositions,reveal morphologies,and measure conductive resistivity values.Conductive silver pastes with a curing temperature of 140°C and a silver content of 65 wt.%were fabricated,exhibiting a resistivity of 3.10×10^(-5)Ω·cm,comparable to that of conventional low-temperature cured silver pastes with the silver content of 80 wt.%.Moreover,this silver paste also exhibited excellent adhesion performance and enhanced anti-folding property. 展开更多
关键词 low-temperature cured conductive silver paste electrical resistivity FLEXIBILITY epoxidized cardol anti-sedimentation
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全银体系国产化LTCC基板工艺的关键技术 被引量:2
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作者 马涛 张鹏飞 李靖巍 《电子工艺技术》 2025年第2期19-23,共5页
研究了全银体系国产化LTCC基板的填孔、烧结及化学镀镍钯金工艺。分析了浆料性能和掩模版参数对填孔工艺质量的影响,探讨了基板烧结平整性与收缩一致性的控制方案,并剖析了化学镀镍钯金工艺的影响因素。研究表明,填孔浆料的收缩率、触... 研究了全银体系国产化LTCC基板的填孔、烧结及化学镀镍钯金工艺。分析了浆料性能和掩模版参数对填孔工艺质量的影响,探讨了基板烧结平整性与收缩一致性的控制方案,并剖析了化学镀镍钯金工艺的影响因素。研究表明,填孔浆料的收缩率、触变性能以及掩模版的厚度和孔径均会显著影响填孔工艺质量;导体浆料的烧结收缩率、基板烧结温度及等静压工艺则直接关系基板的平整性和收缩一致性;LTCC材料特性及化学镀镍钯金工艺对表层金属化质量产生重要影响。 展开更多
关键词 银浆 LTCC 填孔 烧结 化学镀镍钯金
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银粉的形貌和粒径对可化学镀LTCC银面浆性能的影响
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作者 邓瑞 张京辉 +2 位作者 张浩宇 康建宏 林晓云 《电子元件与材料》 北大核心 2025年第11期1364-1370,共7页
银粉作为银浆的关键功能组分,对浆料应用性能起决定性作用。为开发满足低温共烧陶瓷(LTCC)化学镀工艺要求的银面浆,系统研究了银粉形貌与粒径对浆料印刷分辨率、表面粗糙度、方阻以及附着力的影响。结果表明:采用粒度D50为1.50μm、比... 银粉作为银浆的关键功能组分,对浆料应用性能起决定性作用。为开发满足低温共烧陶瓷(LTCC)化学镀工艺要求的银面浆,系统研究了银粉形貌与粒径对浆料印刷分辨率、表面粗糙度、方阻以及附着力的影响。结果表明:采用粒度D50为1.50μm、比表面积为0.89 m^(2)·g^(-1)的片状银粉制备的浆料综合性能最优,其印刷分辨率达到100μm,烧结后表面粗糙度小于1.2μm、方阻小于1.5 mΩ·□^(-1)、镀镍后附着力大于40 N,满足LTCC化学镀工艺的应用要求。 展开更多
关键词 银粉 银浆 低温共烧陶瓷 化学镀
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水性导电银浆溶剂优化设计及其综合性能研究
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作者 李伟 李冬辉 +1 位作者 王英慧 曹国俊 《功能材料》 北大核心 2025年第5期5035-5040,共6页
导电银浆主要由银粉、溶剂、树脂和添加剂组成,按溶剂性质可分为水性和油性导电银浆,而前者因绿色环保的特点使其在柔性电子技术领域具有极高的应用潜力。使用控制变量法对比实验,发现溶剂配比及种类不仅能提高银浆的导电性同时影响其... 导电银浆主要由银粉、溶剂、树脂和添加剂组成,按溶剂性质可分为水性和油性导电银浆,而前者因绿色环保的特点使其在柔性电子技术领域具有极高的应用潜力。使用控制变量法对比实验,发现溶剂配比及种类不仅能提高银浆的导电性同时影响其干燥速率和烧结温度,其中丙三醇能显著提高银浆导电性、乙醇会提高银浆自然干燥速率;最终确定导电银浆配比为n(银粉)∶n(树脂)∶n(溶剂)=125∶55∶53,水性溶剂的配比为n(乙醇)∶n(丙三醇)=161∶339,该银浆具有高导电性(ρ=2.25×10^(-5)Ω·cm)、粘附性(5B)、优良的综合性及绿色环保等特性,同时可实现RFID的应用。 展开更多
关键词 导电银浆 水性溶剂 银粉 射频识别 柔性电子
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银包铜粉制备与应用的研究进展 被引量:1
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作者 李明钢 汪根深 +2 位作者 孙德旺 陆冰沪 郭学益 《稀有金属材料与工程》 北大核心 2025年第5期1367-1376,共10页
银包铜粉是在铜表面包裹银的粉体材料,因其可替代银粉降低成本,在导电浆料等领域具有广阔的应用前景。本文介绍了银包铜粉的制备方法,包括机械球磨法、熔融雾化法和化学镀法。其中,化学镀法具有设备简单、成本较低的特点,已成为工业上... 银包铜粉是在铜表面包裹银的粉体材料,因其可替代银粉降低成本,在导电浆料等领域具有广阔的应用前景。本文介绍了银包铜粉的制备方法,包括机械球磨法、熔融雾化法和化学镀法。其中,化学镀法具有设备简单、成本较低的特点,已成为工业上应用最广泛的制备方法,重点阐述了化学镀法的原理及工艺,对比了置换法和还原法的异同。在此基础上,归纳总结了银包铜粉的包裹机理。此外,对银包铜粉在导电胶、电磁屏蔽涂料和导电油墨等领域的应用和研究进展进行了介绍,结合行业最新进展指出银包铜粉面临的技术挑战,亟需建立镀层厚度调控模型,来降低银含量的同时确保高抗氧化性。本综述可对银包铜粉制备及包裹机理的研究提供指导。 展开更多
关键词 银包铜粉 导电浆料 化学镀法 包裹机理
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钼铜载体与铝合金外壳的无压纳米银胶低温烧结强度 被引量:1
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作者 陈澄 尹红波 +3 位作者 王成 倪大海 谢璐 曾超林 《半导体技术》 CAS 北大核心 2025年第1期95-100,共6页
纳米银胶的烧结温度一般为250℃及以上,而在功率模块装配过程中,多温度梯度装配工艺要求纳米银胶的烧结温度不得超过217℃。使用800HT2V纳米银胶烧结钼铜载体与铝合金外壳,观察了不同烧结温度下纳米银胶装配后的微观形貌,测试了其装配... 纳米银胶的烧结温度一般为250℃及以上,而在功率模块装配过程中,多温度梯度装配工艺要求纳米银胶的烧结温度不得超过217℃。使用800HT2V纳米银胶烧结钼铜载体与铝合金外壳,观察了不同烧结温度下纳米银胶装配后的微观形貌,测试了其装配后剪切强度、热导率的变化,并进行了温度冲击试验。测试结果表明,烧结样品剪切强度均符合标准要求,随着烧结温度的升高,纳米银胶热导率及剪切强度明显提升,且在最高温度200℃下烧结充分,并形成致密的烧结体。在温度冲击试验后烧结样品的剪切强度均有一定程度的下降,最高温度150℃和175℃烧结的纳米银胶烧结样品剪切强度下降超过40%,而最高温度200℃烧结的样品剪切强度只下降21.2%。考虑到功率模块的长期可靠性,纳米银胶推荐使用最高温度200℃烧结。 展开更多
关键词 无压纳米银胶烧结 钼铜载体 铝合金外壳 剪切强度 热导率 可靠性
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铜银核壳粉末复合导电浆料的制备及其性能研究 被引量:1
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作者 温奇辉 张雪辉 +2 位作者 刘柏雄 曾龙飞 杨斌 《有色金属科学与工程》 北大核心 2025年第2期245-254,共10页
采用化学镀制备了银层分布均匀致密的铜银核壳粉末,以此为原料,系统探究了粉末含量、烧结温度和保温时间对导电浆料性能的影响。首先,改变铜银核壳粉末含量(指质量分数,下同)(65%~85%),发现随着粉末含量增加,导电浆料的导电性能显著提升... 采用化学镀制备了银层分布均匀致密的铜银核壳粉末,以此为原料,系统探究了粉末含量、烧结温度和保温时间对导电浆料性能的影响。首先,改变铜银核壳粉末含量(指质量分数,下同)(65%~85%),发现随着粉末含量增加,导电浆料的导电性能显著提升,但当含量达到一定阈值后,性能趋于稳定。其次,烧结温度优化结果表明,700℃为较优烧结温度,此时导电浆料具有最低的方阻和较优的表面形貌。过高的烧结温度会导致粉末异常长大,影响导电网络的致密性。保温时间优化结果表明,保温时间为15 min能够获得较优的固化效果,导电浆料具有最低的方阻和最致密的导电网络。这为高性能、低成本导电浆料的制备提供了技术途径和理论依据。 展开更多
关键词 铜银核壳粉末 导电浆料 烧结温度 保温时间 导电性能
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银包铜粉的湿化学置换-还原法制备研究
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作者 张树利 刘俊祎 朱国兴 《广州化工》 2025年第18期1-3,7,共4页
简要综述了银包铜粉的各种用途和制备意义,从热力学和理论计算上分析了其抗氧化性。在此基础上,介绍了银包铜粉的制备途径,详细讨论了湿化学置换-还原法。阐述了湿化学置换-还原法制备银包铜粉的原理;介绍了铜粉预处理方法,分析了其中... 简要综述了银包铜粉的各种用途和制备意义,从热力学和理论计算上分析了其抗氧化性。在此基础上,介绍了银包铜粉的制备途径,详细讨论了湿化学置换-还原法。阐述了湿化学置换-还原法制备银包铜粉的原理;介绍了铜粉预处理方法,分析了其中的各种反应过程及各种影响因素如配位剂体系和还原剂选择对银包铜粉的影响;举例说明了EDTA和烯胺混合配位剂体系中,银包铜的生成机制。最后,简要介绍了银包铜粉的抗氧化性能和导电性能的分析方法。通过梳理相关文献,明确了湿化学法制备银包铜粉的关键过程及需要注意的事项,对未来的研究方向进行了展望。 展开更多
关键词 银包铜粉 湿化学法制备 性能分析 太阳能利用 导电浆料
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高强度烧结银的纳米晶制备和膏体研究
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作者 李雨时 邓馨 +1 位作者 胡晓凯 闫海东 《电子元件与材料》 北大核心 2025年第8期875-881,共7页
为满足碳化硅功率模块的高温封装需求,制备了双粒径分布银颗粒作为互连材料。该材料以硝酸银为前驱体,通过调控盐酸成核剂用量、反应温度和反应时间,实现了在微米级银颗粒表面原位生长纳米银颗粒的可控制备。通过调控有机物的种类与用... 为满足碳化硅功率模块的高温封装需求,制备了双粒径分布银颗粒作为互连材料。该材料以硝酸银为前驱体,通过调控盐酸成核剂用量、反应温度和反应时间,实现了在微米级银颗粒表面原位生长纳米银颗粒的可控制备。通过调控有机物的种类与用量制备微纳米银复合膏体,通过烧结实验对比,研究了银膏在银基板间的烧结特性和微连接性能。当银膏烧结温度为300℃时,剪切强度最大达到88 MPa,达到了碳化硅器件封装要求,并且断口形貌内存在大量韧窝,判断为韧性断裂。机理分析发现,相比较于传统的单一形貌的银颗粒,双粒径结构通过纳米颗粒与微米颗粒的协同作用可提升连接强度,表现出更好的性能,为碳化硅功率模块的银烧结工艺提供了新的技术参考。 展开更多
关键词 微纳米银 烧结 界面互连 剪切强度 银膏
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