Currently most light emitting diode （LED） components are made with individual chip packaging technology. The main manufacturing processes follow conventional chip-based IC packaging. In the past several years, there...Currently most light emitting diode （LED） components are made with individual chip packaging technology. The main manufacturing processes follow conventional chip-based IC packaging. In the past several years, there has been an uprising trend in the IC industry to migrate from chip-based packaging to wafer level packaging （WLP）. Therefore, there is a need for LEDs to catch up. This paper introduces advanced LED WLP technologies. The contents cover key enabling processes such as preparation of silicon sub-mount wafer, implementation of interconnection, deposition of phosphor, wafer level encapsulation, and their integration. The emphasis is placed on how to achieve high throughput, low cost manufacturing through WLE展开更多
文摘Currently most light emitting diode （LED） components are made with individual chip packaging technology. The main manufacturing processes follow conventional chip-based IC packaging. In the past several years, there has been an uprising trend in the IC industry to migrate from chip-based packaging to wafer level packaging （WLP）. Therefore, there is a need for LEDs to catch up. This paper introduces advanced LED WLP technologies. The contents cover key enabling processes such as preparation of silicon sub-mount wafer, implementation of interconnection, deposition of phosphor, wafer level encapsulation, and their integration. The emphasis is placed on how to achieve high throughput, low cost manufacturing through WLE
