InA1N/GaN high-electron mobility transistors （HEMTs） with a gate length of 100 nm and oxygen plasma treatment were fabricated. A Si/Ti/A1/Ni/Au ohmic contact was also used to reduce the contact resistance. DC and RF...InA1N/GaN high-electron mobility transistors （HEMTs） with a gate length of 100 nm and oxygen plasma treatment were fabricated. A Si/Ti/A1/Ni/Au ohmic contact was also used to reduce the contact resistance. DC and RF characteristics of the devices were measured. The fabricated devices show a maximum drain current density of 2.18 A/mm at VGs = 2 V, a low on-resistance （Ron） of 1.49 x2.mm and low gate leakage current. An excellent frequency response was also obtained. The current cut-off frequency （fT） is 81 GHz and the maximum oscillation frequency is 138 GHz, respectively.展开更多
基金supported by the National Natural Science Foundation of China(No.61306113)
文摘InA1N/GaN high-electron mobility transistors （HEMTs） with a gate length of 100 nm and oxygen plasma treatment were fabricated. A Si/Ti/A1/Ni/Au ohmic contact was also used to reduce the contact resistance. DC and RF characteristics of the devices were measured. The fabricated devices show a maximum drain current density of 2.18 A/mm at VGs = 2 V, a low on-resistance （Ron） of 1.49 x2.mm and low gate leakage current. An excellent frequency response was also obtained. The current cut-off frequency （fT） is 81 GHz and the maximum oscillation frequency is 138 GHz, respectively.
