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Design and R&D Progress of China Lead-Based Reactor for ADS Research Facility 被引量:32
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作者 Yican Wu 《Engineering》 SCIE EI 2016年第1期124-131,共8页
In 2011,the Chinese Academy of Sciences launched an engineering project to develop an acceleratordriven subcritical system(ADS)for nuclear waste transmutation.The China Lead-based Reactor(CLEAR),proposed by the Instit... In 2011,the Chinese Academy of Sciences launched an engineering project to develop an acceleratordriven subcritical system(ADS)for nuclear waste transmutation.The China Lead-based Reactor(CLEAR),proposed by the Institute of Nuclear Energy Safety Technology,was selected as the reference reactor for ADS development,as well as for the technology development of the Generation IV lead-cooled fast reactor.The conceptual design of CLEAR-I with 10 MW thermal power has been completed.KYLIN series lead-bismuth eutectic experimental loops have been constructed to investigate the technologies of the coolant,key components,structural materials,fuel assembly,operation,and control.In order to validate and test the key components and integrated operating technology of the lead-based reactor,the lead alloy-cooled non-nuclear reactor CLEAR-S,the lead-based zero-power nuclear reactor CLEAR-0,and the lead-based virtual reactor CLEAR-V are under realization. 展开更多
关键词 Accelerator-driven subcritical system (ADS) China lead-based Reactor (CLEAR) Lead-bismuth eutectic (LBE)Technology R&D
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Light and matter co-confined multi-photon lithography: an innovative way to break through the limits of traditional lithography
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作者 Jingyu Wang Zhanfeng Guo +3 位作者 Zhu Wang Zhengwei Liu Daixuan Wu He Tian 《Journal of Semiconductors》 2025年第3期1-4,共4页
In recent years, significant research efforts have been made to optimize the lithography processes. Liu et al.[1](Nat.Commun, 2024, https://doi.org/10.1038/s41467-024-46743-5)pioneered a new multi-photon lithography t... In recent years, significant research efforts have been made to optimize the lithography processes. Liu et al.[1](Nat.Commun, 2024, https://doi.org/10.1038/s41467-024-46743-5)pioneered a new multi-photon lithography technology in which light field and matter are co-confined, significantly exceeding the limitations of traditional lithography technology. In this news and views, we introduce this work to readers. 展开更多
关键词 lithography technology CONFINED
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Wafer-level perfect conformal contact lithography at the diffraction limit enabled by dry transferable photoresist
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作者 Yu Zhou Lei Chen +3 位作者 Zhiwen Shu Fu Fan Yueqiang Hu Huigao Duan 《International Journal of Extreme Manufacturing》 2025年第6期426-434,共9页
Lithography is a Key enabling technique in modern micro/nano scale technology.Achieving the optimal trade-off between resolution,throughput,and cost remains a central focus in the ongoing development.However,current l... Lithography is a Key enabling technique in modern micro/nano scale technology.Achieving the optimal trade-off between resolution,throughput,and cost remains a central focus in the ongoing development.However,current lithographic techniques such as direct-write,projection,and extreme ultraviolet lithography achieve higher resolution at the expense of increased complexity in optical systems or the use of shorter-wavelength light sources,thus raising the overall cost of production.Here,we present a cost-effective and wafer-level perfect conformal contact lithography at the diffraction limit.By leveraging a transferable photoresist,the technique ensures optimal contact between the mask and photoresist with zero-gap,facilitating the transfer of patterns at the diffraction limit while maintaining high fidelity and uniformity across large wafers.This technique applies to a wide range of complex surfaces,including non-conductive glass surfaces,flexible substrates,and curved surfaces.The proposed technique expands the potential of contact photolithography for novel device architectures and practic al manufacturing processes. 展开更多
关键词 perfect conformal contact lithography diffraction limit conformal pattern transfer large-aperture metalens
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Micropattern of core-shell Ag@MCS/PEGDA nanoparticles fabricated by femtosecond laser maskless optical projection lithography
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作者 Fan-Chun Bin Xin-Yi Wu +6 位作者 Jie Liu Xian-Zi Dong Teng Li Qi Duan Jian-Miao Zhang Katsumasa Fujita Mei-Ling Zheng 《International Journal of Extreme Manufacturing》 2025年第3期290-302,共13页
Chitosan(CS)-based nanocomposites have been studied in various fields,requiring a more facile and efficient technique to fabricate nanoparticles with customized structures.In this study,Ag@methacrylamide CS/poly(ethyl... Chitosan(CS)-based nanocomposites have been studied in various fields,requiring a more facile and efficient technique to fabricate nanoparticles with customized structures.In this study,Ag@methacrylamide CS/poly(ethylene glycol)diacrylate(Ag@MP)micropatterns are successfully fabricated by femtosecond laser maskless optical projection lithography(Fs-MOPL)for the first time.The formation mechanism of core-shell nanomaterial is demonstrated by the local surface plasmon resonances and the nucleation and growth theory.Amino and hydroxyl groups greatly affect the number of Ag@MP nanocomposites,which is further verified by replacing MCS with methacrylated bovine serum albumin and hyaluronic acid methacryloyl,respectively.Besides,the performance of the surface-enhanced Raman scattering,cytotoxicity,cell proliferation,and antibacterial was investigated on Ag@MP micropatterns.Therefore,the proposed protocol to prepare hydrogel core-shell micropattern by the home-built Fs-MOPL technique is prospective for potential applications in the biomedical and biotechnological fields,such as biosensors,cell imaging,and antimicrobial. 展开更多
关键词 femtosecond laser maskless optical projection lithography micropatterns Ag@MCS/PEGDA nanoparticles core-shell nanomaterials
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Precision Microenvironment-Driven Isothermal Annealing for the Self-Assembly of Perpendicular Block Copolymers in High-Resolution Lithography Applications
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作者 Xiaotong Zhao Yuanlang Hou +11 位作者 Hanxiao Lu Sisi Chen Hui Bai Hanzhe Miao Yuanyuan Guan Sibo Fu Meng Su Xiangshun Geng Ming Lei Yi Yang Yanlin Song Tian-Ling Ren 《Chinese Physics Letters》 2025年第11期375-382,共8页
Block copolymer(BCP) nanolithography offers potential beyond traditional photolithographic limits, yet reliably producing low-defect, perpendicular domains remains challenging. We introduce a microenvironmentdriven is... Block copolymer(BCP) nanolithography offers potential beyond traditional photolithographic limits, yet reliably producing low-defect, perpendicular domains remains challenging. We introduce a microenvironmentdriven isothermal annealing method for directed self-assembly of BCP thin films. By annealing films at stable temperature in a quasi-sealed, inert-gas chamber, our approach promotes highly uniform perpendicular lamellar nanopatterns over large areas, effectively mitigating environmental fluctuations and emulating solvent-vapor annealing without solvent exposure. Resulting BCP structures demonstrate enhanced spatial coherence and notably low defect density. Furthermore, we successfully transfer these nanopatterns into precise metal nano-line arrays,confirming the method's capability for high-fidelity pattern replication. This scalable, solvent-free technique provides a robust, reliable route for high-resolution nanopatterning in advanced semiconductor manufacturing. 展开更多
关键词 photolithographic limits isothermal annealing method mitigating environmental fluctuations e block copolymer bcp annealing films high resolution lithography isothermal annealing microenvironment driven
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A Kernel-Based Convolution Method to Calculate Sparse Aerial Image Intensity for Lithography Simulation 被引量:3
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作者 史峥 王国雄 +2 位作者 严晓浪 陈志锦 高根生 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2003年第4期357-361,共5页
Optical proximity correction (OPC) systems require an accurate and fast way to predict how patterns will be transferred to the wafer.Based on Gabor's 'reduction to principal waves',a partially coherent ima... Optical proximity correction (OPC) systems require an accurate and fast way to predict how patterns will be transferred to the wafer.Based on Gabor's 'reduction to principal waves',a partially coherent imaging system can be represented as a superposition of coherent imaging systems,so an accurate and fast sparse aerial image intensity calculation algorithm for lithography simulation is presented based on convolution kernels,which also include simulating the lateral diffusion and some mask processing effects via Gaussian filter.The simplicity of this model leads to substantial computational and analytical benefits.Efficiency of this method is also shown through simulation results. 展开更多
关键词 lithography simulation optical proximity correction convolution kernels
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A New Method to Retrieve Proximity Effect Parameters in Electron-Beam Lithography 被引量:2
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作者 康晓辉 李志刚 +2 位作者 刘明 谢常青 陈宝钦 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2005年第3期455-459,共5页
A new method for determining proximity parameters α,β ,and η in electron beam lithography is introduced on the assumption that the point exposure spread function is composed of two Gaussians.A single line i... A new method for determining proximity parameters α,β ,and η in electron beam lithography is introduced on the assumption that the point exposure spread function is composed of two Gaussians.A single line is used as test pattern to determine proximity effect parameters and the normalization approach is adopted in experimental data transaction in order to eliminate the need of measuring exposure clearing dose of the resist.Furthermore,the parameters acquired by this method are successfully used for proximity effect correction in electron beam lithography on the same experimental conditions. 展开更多
关键词 electron beam lithography proximity effect electron-beam proximity correction
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Fabrication of Silicon Crystal-Facet-Dependent Nanostructures by Electron-Beam Lithography
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作者 杨香 韩伟华 +2 位作者 王颖 张杨 杨富华 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2008年第6期1057-1061,共5页
Silicon crystal-facet-dependent nanostructures have been successfully fabricated on a (100)-oriented silicon-oninsulator wafer using electron-beam lithography and the silicon anisotropic wet etching technique. This ... Silicon crystal-facet-dependent nanostructures have been successfully fabricated on a (100)-oriented silicon-oninsulator wafer using electron-beam lithography and the silicon anisotropic wet etching technique. This technique takes advantage of the large difference in etching properties for different crystallographic planes in alkaline solution. The minimum size of the trapezoidal top for those Si nanostructures can be reduced to less than 10nm. Scanning electron microscopy (SEM) and atomic force microscopy (AFM) observations indicate that the etched nanostructures have controllable shapes and smooth surfaces. 展开更多
关键词 silicon nanostructure anisotropic wet etching electron-beam lithography
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Nano-Level Electron Beam Lithography
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作者 刘明 陈宝钦 +1 位作者 王云翔 张建宏 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2003年第1期24-28,共5页
The JEOL JBX-5000LS is a vector type machine.The system hardware features an ion-pumped column,a LaB 6 electron emitter,25kV and 50kV accelerating voltage,and a turbo-pumped sample chamber.The resolution,stability,st... The JEOL JBX-5000LS is a vector type machine.The system hardware features an ion-pumped column,a LaB 6 electron emitter,25kV and 50kV accelerating voltage,and a turbo-pumped sample chamber.The resolution,stability,stitching and overlay of this system are evaluated.The system can write complex patterns at dimensions down to 30nm.The demonstrated overlay accuracy of this system is better than 40nm. 展开更多
关键词 electron beam lithography system RESOLUTION overlay accuracy
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Realization of 193 nm DUV laser through direct frequency doubling with GaN-based UVA laser diode and ABF crystal
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作者 Feng Liang Fangfang Zhang +2 位作者 Jing Yang Degang Zhao Shilie Pan 《Journal of Semiconductors》 2026年第1期2-4,共3页
The 193 nm deep-ultraviolet(DUV)laser plays a critical role in advanced semiconductor chip manufacturing[1,2],micro-nano material characterization[3,4]and biomedical analysis[5,6],due to its high spatial resolution an... The 193 nm deep-ultraviolet(DUV)laser plays a critical role in advanced semiconductor chip manufacturing[1,2],micro-nano material characterization[3,4]and biomedical analysis[5,6],due to its high spatial resolution and short wavelength.Efficient and compact 193 nm DUV laser source thus becomes a hot research area.Currently,193 nm Ar F excimer gas laser is widely employed in DUV lithography systems and serves as the enabling technology for 7 and 5 nm semiconductor fabrication. 展开更多
关键词 direct frequency doubling biomedical analysis due enabling technology duv lithography systems nm DUV laser ar f excimer gas laser advanced semiconductor chip nm semiconductor fabrication
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高光密度LED光源模组研发与技术创新
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作者 贾辰宇 《计算机应用文摘》 2026年第1期208-210,共3页
为优化传统LED芯片及封装产业链,文章基于高光密度纳米增透倒装LED芯片级封装模组研发项目提出一种自主创新倒装芯片与纳米增透芯片级封装(Chip-Scale Package,CSP)封装相结合的技术方案。采用倒装结构替代传统正装结构,并引入高反射率... 为优化传统LED芯片及封装产业链,文章基于高光密度纳米增透倒装LED芯片级封装模组研发项目提出一种自主创新倒装芯片与纳米增透芯片级封装(Chip-Scale Package,CSP)封装相结合的技术方案。采用倒装结构替代传统正装结构,并引入高反射率银镜以提升芯片出光效率;以CSP封装取代COB封装,突破光源间距受限的问题;在芯片端以荧光陶瓷替代传统荧光粉,使模组在150℃高温条件下仍能保持较高的荧光转换效率。该技术方案可有效提升光源性能,推动LED产业由价格驱动向技术驱动的高质量发展转变。 展开更多
关键词 LED芯片 倒装结构 纳米压印技术 CSP封装技术
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2-μm single longitudinal mode GaSb-based laterally coupled distributed feedback laser with regrowth-free shallow-etched gratings by interference lithography 被引量:9
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作者 杨成奥 张宇 +6 位作者 廖永平 邢军亮 魏思航 张立春 徐应强 倪海桥 牛智川 《Chinese Physics B》 SCIE EI CAS CSCD 2016年第2期181-185,共5页
We report a type-I Ga Sb-based laterally coupled distributed-feedback(LC-DFB) laser with shallow-etched gratings operating a continuous wave at room temperature without re-growth process. Second-order Bragg gratings... We report a type-I Ga Sb-based laterally coupled distributed-feedback(LC-DFB) laser with shallow-etched gratings operating a continuous wave at room temperature without re-growth process. Second-order Bragg gratings are fabricated alongside the ridge waveguide by interference lithography. Index-coupled LC-DFB laser with a cavity of 1500 μm achieves single longitudinal mode continuous-wave operation at 20℃ with side mode suppression ratio(SMSR) as high as 24 dB.The maximum single mode continuous-wave output power is about 10 mW at room temperature(uncoated facet). A low threshold current density of 230 A/cm^2 is achieved with differential quantum efficiency estimated to be 93 mW/A. The laser shows a good wavelength stability against drive current and working temperature. 展开更多
关键词 laterally coupled distributed feedback laser LC-DFB interference lithography GASB second-order Bragg grating
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The theoretic analysis of maskless surface plasmon resonant interference lithography by prism coupling 被引量:5
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作者 方亮 杜惊雷 +4 位作者 郭小伟 王景全 张志友 罗先刚 杜春雷 《Chinese Physics B》 SCIE EI CAS CSCD 2008年第7期2499-2503,共5页
The use of an attenuated total reflection-coupling mode of prism coated with metal film to excite the interference of the surface plasmon polaritons (SPPs) was proposed for periodic patterning with a resolution of s... The use of an attenuated total reflection-coupling mode of prism coated with metal film to excite the interference of the surface plasmon polaritons (SPPs) was proposed for periodic patterning with a resolution of subwavelength scale. High intensity of electric field can be obtained because of the coupling between SPPs and evanescence under a resonance condition, which can reduce exposure time and improve contrast. In this paper, several critical parameters for maskless surface plasmon resonant lithography are described, and the preliminary simulation based on a finite difference timedomain technique agrees well with the theoretical analysis, which demonstrates this scheme and provides the theoretical basis for further experiments. 展开更多
关键词 surface plasmon polaritons (SPPs) ENHANCEMENT interference lithography RESOLUTION
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Nanoimprint Lithography:A Processing Technique for Nanofabrication Advancement 被引量:5
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作者 Weimin Zhou Guoquan Min +4 位作者 Jing Zhang Yanbo Liu Jinhe Wang Yanping Zhang Feng Sun 《Nano-Micro Letters》 SCIE EI CAS 2011年第2期135-140,共6页
Nanoimprint lithography(NIL) is an emerging micro/nano-patterning technique,which is a high-resolution,high-throughput and yet simple fabrication process.According to International Technology Roadmap for Semiconductor... Nanoimprint lithography(NIL) is an emerging micro/nano-patterning technique,which is a high-resolution,high-throughput and yet simple fabrication process.According to International Technology Roadmap for Semiconductor(ITRS),NIL has emerged as the next generation lithography candidate for the22 nm and 16 nm technological nodes.In this paper,we present an overview of nanoimprint lithography.The classfication,research focus,critical issues,and the future of nanoimprint lithography are intensively elaborated.A pattern as small as 2.4 nm has been demonstrated.Full-wafer nanoimprint lithography has been completed on a 12-inch wafer.Recently,12.5 nm pattern resolution through soft molecular scale nanoimprint lithography has been achieved by EV Group,a leading nanoimprint lithography technology supplier. 展开更多
关键词 Nanoimprint lithography Soft molecular scale Nanofabrication
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Electro-Optically Switchable Optical True Delay Lines of Meter-Scale Lengths Fabricated on Lithium Niobate on Insulator Using Photolithography Assisted Chemo-Mechanical Etching 被引量:19
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作者 Jun-xia Zhou Ren-hong Gao +9 位作者 Jintian Lin Min Wang Wei Chu Wen-bo Li Di-feng Yin Li Deng Zhi-wei Fang Jian-hao Zhang Rong-bo Wu and Ya Cheng 《Chinese Physics Letters》 SCIE CAS CSCD 2020年第8期43-47,共5页
Optical true delay lines(OTDLs)of low propagation losses,small footprints and high tuning speeds and efficiencies are of critical importance for various photonic applications.Here,we report fabrication of electro-opti... Optical true delay lines(OTDLs)of low propagation losses,small footprints and high tuning speeds and efficiencies are of critical importance for various photonic applications.Here,we report fabrication of electro-optically switchable OTDLs on lithium niobate on insulator using photolithography assisted chemo-mechanical etching.Our device consists of several low-loss optical waveguides of different lengths which are consecutively connected by electro-optical switches to generate different amounts of time delay.The fabricated OTLDs show an ultra-low propagation loss of^0.03dB/cm for waveguide lengths well above 100 cm. 展开更多
关键词 lithography waveguide tuning
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High-refractive index acrylate polymers for applications in nanoimprint lithography 被引量:4
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作者 Yunhui Tang Stefano Cabrini +1 位作者 Jun Nie Carlos Pina-Hernandez 《Chinese Chemical Letters》 SCIE CAS CSCD 2020年第1期256-260,共5页
The development of polymeric optical materials with a higher refractive index,transparency in the visible spectrum region and easier processability is increasingly desirable for advanced optical applications such as m... The development of polymeric optical materials with a higher refractive index,transparency in the visible spectrum region and easier processability is increasingly desirable for advanced optical applications such as microlenses,image sensors,and organic light-emitting diodes.Most acrylates have a low refractive index(around 1.50)which does not meet the high perfo rmance requirements of advanced optical materials.In this research,three novel acrylates were synthesized via a facile one-step approach and used to fabricate optical transparent polymers.All of the polymers reveal good optical properties including high transparency(≥90%)in the visible spectrum region and high refractive index values(1.6363)at 550 nm.Moreover,nanostructures of these acrylate polymers with various feature sizes including nanogratings and photonic crystals were successfully fabricated using nanoimprint lithography.These results indicate that these acrylates can be used in a wide range of optical and optoelectronic devices where nanopatterned films with high refractive index and transparency are required. 展开更多
关键词 High refractive index ACRYLATE Facile synthesis NANOSTRUCTURE Nanoimprint lithography
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Current Status of Extreme Ultraviolet Lithography in Japan 被引量:2
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作者 Kazuya Ota, Iwao Nishiyama, Taro Ogawa, Ei Yano, Shinji Okazaki (ASET EUV Laboratory, Atsugi-Shi, Kanagawa 243-0198, 《光学精密工程》 EI CAS CSCD 2001年第5期424-429,共6页
ASET, Association of Super-advanced Electronics Technologies, has been taking the initiative in developing EUV lithography technology in Japan for the past three years. The aspherical mirror metrology using a visible ... ASET, Association of Super-advanced Electronics Technologies, has been taking the initiative in developing EUV lithography technology in Japan for the past three years. The aspherical mirror metrology using a visible light point diffraction interferometer (PDI), the wave front measurement using an at-wavelength PDI, and an at wavelength reflectometry for multilayers, various imaging simulations, multilayer coatings for the mask, the development of absorber materials for mask patterning, the mask substrate cleaning technique, and various photoresist processes have been developed. The visible light PDI employs a 0.5-μm pinhole as an aperture to generate an ideal spherical wave front and can measure a 0.3-N A mirror maximum. The at-wavelength PDI can measure the wave front error of the projection optics. The at-wavelength reflectometer can measure the reflectivity of multilayers and the round-robin test is taking place among ASET, the ALS in Lawrence Berkeley, and BESSY in Germany. The mask cleaning technique employs a supersonic hydro-cleaning technique. We have confirmed that the single layer resists can be used for EUV lithography. 展开更多
关键词 ULTRAVIOLET lithography aspherical mirrors ALIGNMENT SYSTEMS
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Structured mirror array for two-dimensional collimation of a chromium beam in atom lithography 被引量:2
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作者 张万经 马艳 +4 位作者 李同保 张萍萍 邓晓 陈晟 肖盛炜 《Chinese Physics B》 SCIE EI CAS CSCD 2013年第2期228-231,共4页
Direct-write atom lithography,one of the potential nanofabrication techniques,is restricted by some difficulties in producing optical masks for the deposition of complex structures.In order to make further progress,a ... Direct-write atom lithography,one of the potential nanofabrication techniques,is restricted by some difficulties in producing optical masks for the deposition of complex structures.In order to make further progress,a structured mirror array is developed to transversely collimate the chromium atomic beam in two dimensions.The best collimation is obtained when the laser red detunes by natural line-width of transition 7S3 → 7P40 of the chromium atom.The collimation ratio is 0.45 vertically(in x axis),and it is 0.55 horizontally(in y axis).The theoretical model is also simulated,and success of our structured mirror array is achieved. 展开更多
关键词 atom lithography structured mirror array laser Doppler cooling two-dimensional collimation
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An All-E-Beam Lithography Process for the Patterning of 2D Photonic Crystal Waveguide Devices
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作者 余和军 余金中 陈绍武 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2006年第11期1894-1899,共6页
We present an all-e-beam lithography (EBL) process for the patterning of photonic crystal waveguides. The whole device structures are exposed in two steps. Holes constituting the photonic crystal lattice and defects... We present an all-e-beam lithography (EBL) process for the patterning of photonic crystal waveguides. The whole device structures are exposed in two steps. Holes constituting the photonic crystal lattice and defects are first exposed with a small exposure step size (less than 10nm). With the introduction of the additional proximity effect to compensate the original proximity effect, the shape, size, and position of the holes can be well controlled. The second step is the exposure of the access waveguides at a larger step size (about 30nm) to improve the scan speed of the EBL. The influence of write-field stitching error can be alleviated by replacing the original waveguides with tapered waveguides at the joint of adjacent write-fields. It is found experimentally that a higher exposure efficiency is achieved with a larger step size;however,a larger step size requires a higher dose. 展开更多
关键词 photonic crystal e-beam lithography stitching problem proximity effect correction
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