In order to gain comprehensive knowledge of an arbitrary unknown quantum state,one feasible way is to reconstruct it,which can be realized by finding a series of quantum operations that can refactor the unitary evolut...In order to gain comprehensive knowledge of an arbitrary unknown quantum state,one feasible way is to reconstruct it,which can be realized by finding a series of quantum operations that can refactor the unitary evolution producing the unknown state.We design an adaptive framework that can reconstruct unknown quantum states at high fidelities,which utilizes SWAP test,parameterized quantum circuits(PQCs)and layerwise learning strategy.We conduct benchmarking on the framework using numerical simulations and reproduce states of up to six qubits at more than 96%overlaps with original states on average using PQCs trained by our framework,revealing its high applicability to quantum systems of different scales theoretically.Moreover,we perform experiments on a five-qubit IBM Quantum hardware to reconstruct random unknown single qubit states,illustrating the practical performance of our framework.For a certain reconstructing fidelity,our method can effectively construct a PQC of suitable length,avoiding barren plateaus of shadow circuits and overuse of quantum resources by deep circuits,which is of much significance when the scale of the target state is large and there is no a priori information on it.This advantage indicates that it can learn credible information of unknown states with limited quantum resources,giving a boost to quantum algorithms based on parameterized circuits on near-term quantum processors.展开更多
Traditional quantum circuit scheduling approaches underutilize the inherent parallelism of quantum computation in the Noisy Intermediate-Scale Quantum(NISQ)era,overlook the inter-layer operations can be further parall...Traditional quantum circuit scheduling approaches underutilize the inherent parallelism of quantum computation in the Noisy Intermediate-Scale Quantum(NISQ)era,overlook the inter-layer operations can be further parallelized.Based on this,two quantum circuit scheduling optimization approaches are designed and integrated into the quantum circuit compilation process.Firstly,we introduce the Layered Topology Scheduling Approach(LTSA),which employs a greedy algorithm and leverages the principles of topological sorting in graph theory.LTSA allocates quantum gates to a layered structure,maximizing the concurrent execution of quantum gate operations.Secondly,the Layerwise Conflict Resolution Approach(LCRA)is proposed.LCRA focuses on utilizing directly executable quantum gates within layers.Through the insertion of SWAP gates and conflict resolution checks,it minimizes conflicts and enhances parallelism,thereby optimizing the overall computational efficiency.Experimental findings indicate that LTSA and LCRA individually achieve a noteworthy reduction of 51.1%and 53.2%,respectively,in the number of inserted SWAP gates.Additionally,they contribute to a decrease in hardware gate overhead by 14.7%and 15%,respectively.Considering the intricate nature of quantum circuits and the temporal dependencies among different layers,the amalgamation of both approaches leads to a remarkable 51.6%reduction in inserted SWAP gates and a 14.8%decrease in hardware gate overhead.These results underscore the efficacy of the combined LTSA and LCRA in optimizing quantum circuit compilation.展开更多
Sandwich materials are widely used in marine structures because of their excellent comprehensive properties.However,the solution of bimodulus is challenging.Therefore,the theoretical and numerical approximation method...Sandwich materials are widely used in marine structures because of their excellent comprehensive properties.However,the solution of bimodulus is challenging.Therefore,the theoretical and numerical approximation methods for the analysis of load-bearing characteristics of bimodulus sandwich structures are put forward comprehensively in this paper.Based on the superposition principle,a theoretical method for calculating the neutral surface position of bimodulus sandwich plate is derived,and the corresponding bending control equation is obtained.The proposed theoretical approximation method can fully consider the sawtooth deformation between the plate and the core,as well as the sawtooth deformation inside the core at the tension–compression interface.Moreover,a finite element model is established for complex sandwich structures to analyze the influence of bimodulus.Numerical examples show that the theoretical approximation model proposed in this paper has higher calculation accuracy.展开更多
Thermal effects are incorporated into developed discrete layer mechanics for two-dimensional cylindrical shells structures. Finite element equations are developed according to layerwise theory of laminated structure. ...Thermal effects are incorporated into developed discrete layer mechanics for two-dimensional cylindrical shells structures. Finite element equations are developed according to layerwise theory of laminated structure. Following the layerwise theory, a variable kinematic model that incorporates mechanics and thermal conditions is also presented. The new element has a field of displacement compatible with the cylindrical shell element or plate and it can be used as a rigid element for this structural element.ln the laminate model construction, adjacent layers are arranged as bonded layers. The layer has a unique constant thickness that can be different to each layer. The fiber reinforced is used and the fibers in a laminate may be oriented arbitrarily. The shear stress is adopted equal to zero because the thin thickness, on the other hand, the normal stress is maintained in order to ensure the compatibility of stress in material. The previously authors of this methods neglect the implications of thermal effects on cylindrical shells structures. Thermal effects become important when the structure has to operate in either extremely hot or cold temperature environments. These extreme conditions may severely affect the response of structure in two distinct ways： （1） induction of thermal stresses due to differences in the coefficients of thermal expansion between the various composite plies and layers and （2） temperature dependence of the elastic properties. Only a limited amount of work has been reported concerning this topic. All in all, the main contribution of this work is the consideration of this kinematic for cylindrical shells that incorporate mechanics and thermal conditions. In addition, numerical results are presented to demonstrate the capability of the current formulation to represent the behavior of cylindrical shells with these characteristics.展开更多
Laminated composites are widely used in many engineering industries such as aircraft, spacecraft, boat hulls, racing car bodies, and storage tanks. We analyze the 3D deformations of a multilayered, linear elastic, ani...Laminated composites are widely used in many engineering industries such as aircraft, spacecraft, boat hulls, racing car bodies, and storage tanks. We analyze the 3D deformations of a multilayered, linear elastic, anisotropic rectangular plate subjected to arbitrary boundary conditions on one edge and simply supported on other edge. The rectangular laminate consists of anisotropic and homogeneous laminae of arbitrary thicknesses. This study presents the elastic analysis of laminated composite plates subjected to sinusoidal mechanical loading under arbitrary boundary conditions. Least square finite element solutions for displacements and stresses are investigated using a mathematical model, called a state-space model, which allows us to simultaneously solve for these field variables in the composite structure’s domain and ensure that continuity conditions are satisfied at layer interfaces. The governing equations are derived from this model using a numerical technique called the least-squares finite element method (LSFEM). These LSFEMs seek to minimize the squares of the governing equations and the associated side conditions residuals over the computational domain. The model is comprised of layerwise variables such as displacements, out-of-plane stresses, and in- plane strains, treated as independent variables. Numerical results are presented to demonstrate the response of the laminated composite plates under various arbitrary boundary conditions using LSFEM and compared with the 3D elasticity solution available in the literature.展开更多
The serious warpage issues of ultrathin chip-on-flex(UTCOF) assembly induced by mismatched thermal stresses have greatly affected the mechanical stability and reliability of emerging ultrathin chip packaging technolog...The serious warpage issues of ultrathin chip-on-flex(UTCOF) assembly induced by mismatched thermal stresses have greatly affected the mechanical stability and reliability of emerging ultrathin chip packaging technology. Currently, a theoretical prediction as a convenient and straightforward approach is still lacked for describing effectively the thermal-mechanical behavior of UTCOF during the adhesive curing and cooling process. In consideration of the adhesive thickness approximating to ultrathin chip and flexible substrate thickness, we develop a layerwise-model of ultrathin chip-adhesive-flex structure under plain strain condition, where the behavior of thick adhesive bonding can be described precisely through increasing the subdivided mathematical plies. Further, the analytical results show that the concave and convex forms of ultrathin chip warpage yield at the end of the curing and cooling process respectively. Meanwhile, the effects of its structure dimensions and material properties are also revealed for discussing a way to relieve the extent of ultrathin chip warpage. Additionally, in order to verify the validity of the theoretical prediction, we also introduce the corresponding numerical technique and experimental method. These results suggest that a kind of rigid and ultrathin flexible substrate such as metal foil should be adopted for small warpage of ultrathin assembly.展开更多
文摘In order to gain comprehensive knowledge of an arbitrary unknown quantum state,one feasible way is to reconstruct it,which can be realized by finding a series of quantum operations that can refactor the unitary evolution producing the unknown state.We design an adaptive framework that can reconstruct unknown quantum states at high fidelities,which utilizes SWAP test,parameterized quantum circuits(PQCs)and layerwise learning strategy.We conduct benchmarking on the framework using numerical simulations and reproduce states of up to six qubits at more than 96%overlaps with original states on average using PQCs trained by our framework,revealing its high applicability to quantum systems of different scales theoretically.Moreover,we perform experiments on a five-qubit IBM Quantum hardware to reconstruct random unknown single qubit states,illustrating the practical performance of our framework.For a certain reconstructing fidelity,our method can effectively construct a PQC of suitable length,avoiding barren plateaus of shadow circuits and overuse of quantum resources by deep circuits,which is of much significance when the scale of the target state is large and there is no a priori information on it.This advantage indicates that it can learn credible information of unknown states with limited quantum resources,giving a boost to quantum algorithms based on parameterized circuits on near-term quantum processors.
基金funded by the Natural Science Foundation of Heilongjiang Province(Grant No.LH2022F035)the Cultivation Programme for Young Innovative Talents in Ordinary Higher Education Institutions of Heilongjiang Province(Grant No.UNPYSCT-2020212)the Cultivation Programme for Young Innovative Talents in Scientific Research of Harbin University of Commerce(Grant No.2023-KYYWF-0983).
文摘Traditional quantum circuit scheduling approaches underutilize the inherent parallelism of quantum computation in the Noisy Intermediate-Scale Quantum(NISQ)era,overlook the inter-layer operations can be further parallelized.Based on this,two quantum circuit scheduling optimization approaches are designed and integrated into the quantum circuit compilation process.Firstly,we introduce the Layered Topology Scheduling Approach(LTSA),which employs a greedy algorithm and leverages the principles of topological sorting in graph theory.LTSA allocates quantum gates to a layered structure,maximizing the concurrent execution of quantum gate operations.Secondly,the Layerwise Conflict Resolution Approach(LCRA)is proposed.LCRA focuses on utilizing directly executable quantum gates within layers.Through the insertion of SWAP gates and conflict resolution checks,it minimizes conflicts and enhances parallelism,thereby optimizing the overall computational efficiency.Experimental findings indicate that LTSA and LCRA individually achieve a noteworthy reduction of 51.1%and 53.2%,respectively,in the number of inserted SWAP gates.Additionally,they contribute to a decrease in hardware gate overhead by 14.7%and 15%,respectively.Considering the intricate nature of quantum circuits and the temporal dependencies among different layers,the amalgamation of both approaches leads to a remarkable 51.6%reduction in inserted SWAP gates and a 14.8%decrease in hardware gate overhead.These results underscore the efficacy of the combined LTSA and LCRA in optimizing quantum circuit compilation.
基金supported by the National Natural Science Foundation of China(51979213).
文摘Sandwich materials are widely used in marine structures because of their excellent comprehensive properties.However,the solution of bimodulus is challenging.Therefore,the theoretical and numerical approximation methods for the analysis of load-bearing characteristics of bimodulus sandwich structures are put forward comprehensively in this paper.Based on the superposition principle,a theoretical method for calculating the neutral surface position of bimodulus sandwich plate is derived,and the corresponding bending control equation is obtained.The proposed theoretical approximation method can fully consider the sawtooth deformation between the plate and the core,as well as the sawtooth deformation inside the core at the tension–compression interface.Moreover,a finite element model is established for complex sandwich structures to analyze the influence of bimodulus.Numerical examples show that the theoretical approximation model proposed in this paper has higher calculation accuracy.
文摘Thermal effects are incorporated into developed discrete layer mechanics for two-dimensional cylindrical shells structures. Finite element equations are developed according to layerwise theory of laminated structure. Following the layerwise theory, a variable kinematic model that incorporates mechanics and thermal conditions is also presented. The new element has a field of displacement compatible with the cylindrical shell element or plate and it can be used as a rigid element for this structural element.ln the laminate model construction, adjacent layers are arranged as bonded layers. The layer has a unique constant thickness that can be different to each layer. The fiber reinforced is used and the fibers in a laminate may be oriented arbitrarily. The shear stress is adopted equal to zero because the thin thickness, on the other hand, the normal stress is maintained in order to ensure the compatibility of stress in material. The previously authors of this methods neglect the implications of thermal effects on cylindrical shells structures. Thermal effects become important when the structure has to operate in either extremely hot or cold temperature environments. These extreme conditions may severely affect the response of structure in two distinct ways： （1） induction of thermal stresses due to differences in the coefficients of thermal expansion between the various composite plies and layers and （2） temperature dependence of the elastic properties. Only a limited amount of work has been reported concerning this topic. All in all, the main contribution of this work is the consideration of this kinematic for cylindrical shells that incorporate mechanics and thermal conditions. In addition, numerical results are presented to demonstrate the capability of the current formulation to represent the behavior of cylindrical shells with these characteristics.
文摘Laminated composites are widely used in many engineering industries such as aircraft, spacecraft, boat hulls, racing car bodies, and storage tanks. We analyze the 3D deformations of a multilayered, linear elastic, anisotropic rectangular plate subjected to arbitrary boundary conditions on one edge and simply supported on other edge. The rectangular laminate consists of anisotropic and homogeneous laminae of arbitrary thicknesses. This study presents the elastic analysis of laminated composite plates subjected to sinusoidal mechanical loading under arbitrary boundary conditions. Least square finite element solutions for displacements and stresses are investigated using a mathematical model, called a state-space model, which allows us to simultaneously solve for these field variables in the composite structure’s domain and ensure that continuity conditions are satisfied at layer interfaces. The governing equations are derived from this model using a numerical technique called the least-squares finite element method (LSFEM). These LSFEMs seek to minimize the squares of the governing equations and the associated side conditions residuals over the computational domain. The model is comprised of layerwise variables such as displacements, out-of-plane stresses, and in- plane strains, treated as independent variables. Numerical results are presented to demonstrate the response of the laminated composite plates under various arbitrary boundary conditions using LSFEM and compared with the 3D elasticity solution available in the literature.
基金supported by the National Natural Science Foundation of China (Grant Nos. 51475195, 51322507 & 91323303)National Science and Technology Support Program (Gant No. 2015BAF11B02)
文摘The serious warpage issues of ultrathin chip-on-flex(UTCOF) assembly induced by mismatched thermal stresses have greatly affected the mechanical stability and reliability of emerging ultrathin chip packaging technology. Currently, a theoretical prediction as a convenient and straightforward approach is still lacked for describing effectively the thermal-mechanical behavior of UTCOF during the adhesive curing and cooling process. In consideration of the adhesive thickness approximating to ultrathin chip and flexible substrate thickness, we develop a layerwise-model of ultrathin chip-adhesive-flex structure under plain strain condition, where the behavior of thick adhesive bonding can be described precisely through increasing the subdivided mathematical plies. Further, the analytical results show that the concave and convex forms of ultrathin chip warpage yield at the end of the curing and cooling process respectively. Meanwhile, the effects of its structure dimensions and material properties are also revealed for discussing a way to relieve the extent of ultrathin chip warpage. Additionally, in order to verify the validity of the theoretical prediction, we also introduce the corresponding numerical technique and experimental method. These results suggest that a kind of rigid and ultrathin flexible substrate such as metal foil should be adopted for small warpage of ultrathin assembly.
