The continuous miniaturization and high-power development of electronic devices have given rise to severe interface thermal issues,which urgently demand highly thermally conductive thermal interface materials(TIMs)to ...The continuous miniaturization and high-power development of electronic devices have given rise to severe interface thermal issues,which urgently demand highly thermally conductive thermal interface materials(TIMs)to eliminate excessive heat accumulation and ensure the normal operation of devices[1].展开更多
文摘The continuous miniaturization and high-power development of electronic devices have given rise to severe interface thermal issues,which urgently demand highly thermally conductive thermal interface materials(TIMs)to eliminate excessive heat accumulation and ensure the normal operation of devices[1].
