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Effects of temperature gradient on the interface microstructure and diffusion of diffusion couples:Phase-field simulation 被引量:1
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作者 李永胜 吴兴超 +2 位作者 刘苇 侯志远 梅浩杰 《Chinese Physics B》 SCIE EI CAS CSCD 2015年第12期445-451,共7页
The temporal interface microstructures and diffusions in the diffusion couples with the mutual interactions of the temperature gradient, concentration difference and initial aging time of the alloys are studied by pha... The temporal interface microstructures and diffusions in the diffusion couples with the mutual interactions of the temperature gradient, concentration difference and initial aging time of the alloys are studied by phase-field simulation, and the diffusion couples are produced by the initial aged spinodal alloys with different compositions. Temporal composition evolution and volume fraction of the separated phase indicate the element diffusion direction through the interface under the temperature gradient. The increased temperature gradient induces a wide single-phase region on two sides of the interface.The uphill diffusion proceeds through the interface, no matter whether the diffusion direction is up or down with respect to the temperature gradient. For an alloy with short initial aging time, phase transformation accompanying the interdiffusion results in the straight interface with the single-phase regions on both sides. Compared with the temperature gradient,composition difference of diffusion couple and initial aging time of the alloy show greater effects on diffusion and interface microstructure. 展开更多
关键词 interface diffusion temperature gradient phase-field
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Role of temperature gradient in liquid/solid phase solution-diffusion bonding
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作者 翟秋亚 徐锦锋 《China Welding》 EI CAS 2004年第2期86-90,共5页
The liquid-film solution-diffusion bonding of ZCuBe2.5 alloys was conducted using Cu-based alloy powders. The tensile strength of the joint is up to 318 MPa. With the increase of temperature gradient, the bonding time... The liquid-film solution-diffusion bonding of ZCuBe2.5 alloys was conducted using Cu-based alloy powders. The tensile strength of the joint is up to 318 MPa. With the increase of temperature gradient, the bonding time decreases and the interface migration velocity increases remarkably. The appropriate temperature gradient is 5-40 K/cm. Under fixed bonding time, the thickness of diffusion layer increases with the increase of temperature gradient, and this tendency becomes more remarkable with the prolonging of bonding time. 展开更多
关键词 solution-diffusion welding temperature gradient liquid/solid interface bonding time
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瞬时液相扩散连接非平面结合界面的研究现状 被引量:1
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作者 郭世敬 陈思杰 梁峰 《热加工工艺》 CSCD 北大核心 2009年第13期134-136,共3页
瞬时液相扩散连接非平面结合界面的形成可以提高焊接接头的强度,同时减少对等温凝固时间的要求。温度梯度下的瞬时液相扩散连接和双温工艺下的瞬时液相扩散连接可以形成非平面结合界面。前者是通过在连接处两侧加以不同的温度从而导致... 瞬时液相扩散连接非平面结合界面的形成可以提高焊接接头的强度,同时减少对等温凝固时间的要求。温度梯度下的瞬时液相扩散连接和双温工艺下的瞬时液相扩散连接可以形成非平面结合界面。前者是通过在连接处两侧加以不同的温度从而导致液相区域溶质浓度分布的不同来形成非平面的结合界面,后者是利用短时高温后再降至低温保温形成的过冷度致使连接过程在非平衡条件下结晶从而形成非平面结合界面。 展开更多
关键词 瞬时液相扩散连接 非平面结合界面 温度梯度 双温工艺
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