Efficient thermal management is critical to the reliability and performance of nanoscale electronic and photonic devices,particularly those incorporating multilayer structures.In this study,non-equilibrium molecular d...Efficient thermal management is critical to the reliability and performance of nanoscale electronic and photonic devices,particularly those incorporating multilayer structures.In this study,non-equilibrium molecular dynamics simulations were conducted to systematically investigate the effects of temperature,penetration depth,and Si layer thickness on the interfacial thermal resistance(ITR)in nanometer-scale Mo/Si multilayers,widely employed in extreme ultraviolet lithography.The results indicate that:(i)temperature variations exert a negligible influence on the ITR of amorphous Mo/Si interfaces,which remains stable across the range of 200-900 K;(ii)increasing penetration depth enhances the overlap of phonon density of states,thereby significantly reducing ITR;(iii)the ITR decreases with increasing Si thickness up to4.2 nm due to quasi-ballistic phonon transport,but rises again as phonon scattering becomes more pronounced at larger thicknesses.This study provides quantitative insights into heat transfer mechanisms at amorphous interfaces and also offers a feasible strategy for tailoring interfacial thermal transport through structural design.展开更多
In view of the M_(n+1)AX_(n)(MAX)phase coatings benefting the adaptive passivation flm for good corrosion resistance and high electronic density of states for excellent electrical conductivity,here,we reported the Cr_...In view of the M_(n+1)AX_(n)(MAX)phase coatings benefting the adaptive passivation flm for good corrosion resistance and high electronic density of states for excellent electrical conductivity,here,we reported the Cr_(2)Al C MAX phase coatings with different preferred orientations by a homemade technique consisting of vacuum arc and magnetron sputtering.The dependence of surface and interface microstructural evolution upon the corrosion and electrochemical properties of deposited coating was focused.Results showed that all the Cr_(2)Al C coatings with different phase orientations greatly improved the performance of stainless steel(SS)316 L substrate.Specifcally,the lowest value of interface contact resistance(ICR)reached to 3.16 mΩcm^(2)and the lowest corrosion current density was 2×10^(-2)μA cm^(-2),which were much better than those of bare SS316L.The combined studies of electrochemical properties and theoretical calculations demonstrated that the Cr_(2)Al C coatings with preferred(103)orientation were easier to form oxide passivation flm on their surface to increase the corrosion resistance.展开更多
Effective thermal transport across solid-solid interfaces which is essential in thermal interface materials(TIMs),necessitates both optimal thixotropy and high thermal conductivity.The role of filler surface modificat...Effective thermal transport across solid-solid interfaces which is essential in thermal interface materials(TIMs),necessitates both optimal thixotropy and high thermal conductivity.The role of filler surface modification,a fundamental aspect of TIM fabrication,in the influence of these properties is not fully understood.This study employs the use of a silane coupling agent(SCA)to modify alumina,integrating experimental approaches with molecular dynamics simulations,to elucidate the interface effects on thixotropy and thermal conductivity in polydimethylsiloxane(PDMS)-based TIMs.Our findings reveal that the variations of SCAs modify both interface binding energy and transition layer thickness.The interface binding energy restricts macromolecular segmental relaxation near the interface,hindering desirable thixotropy and bond line thickness.On the contrary,the thickness of the transition layer at the interface positively influences thermal conductivity,facilitating the transport of phonons between the polymer and filler.Consequently,selecting an optimal SCA allows a balance between traditionally conflicting goals of high thermal conductivity and minimal bond line thickness,achieving an impressively low interface thermal resistance of just 2.45-4.29 K·mm^(2)·W^(-1)at275.8 kPa.展开更多
All-solid-state lithium ion batteries(ASSLIBs)have attracted much attention due to their high safety and increased energy density,which have become a substitute to conventional liquid electrolyte batteries[1].The deve...All-solid-state lithium ion batteries(ASSLIBs)have attracted much attention due to their high safety and increased energy density,which have become a substitute to conventional liquid electrolyte batteries[1].The development of high-performance solid electrolyte is the key to the development of solid-state battery technology.Solid-state electrolyte(SSE)materials should have high ionic conductivity,poor electronic conductivity,wide electrochemical window,and low electrode and electrolyte interface resistance.展开更多
The high energy density and stability of solid-state lithium metal batteries(SSLMBs)have garnered great attention.Garnet-type oxides,especially Li_(6.4)La_(3)Zr_(1.4)Ta_(0.6)O_(12)(LLZTO),with high ionic conductivity,...The high energy density and stability of solid-state lithium metal batteries(SSLMBs)have garnered great attention.Garnet-type oxides,especially Li_(6.4)La_(3)Zr_(1.4)Ta_(0.6)O_(12)(LLZTO),with high ionic conductivity,wide electrochemical window,and stability to Li metal anode,are promising solid-state electrolyte(SSEs)materials for SSLMBs.However,Li/LLZTO interface issues including high interface resistance,inhomogeneous Li deposition,and Li dendrite growth have hindered the practical application of SSLMBs.Herein,a multi-functional Li–SnF_(2) composite anode with Li,LiF,and Li-Sn alloy was specifically designed and prepared.The composite anode improves the wettability to LLZTO,constructing an intimate contact interface between it and LLZTO.Meanwhile,ionic/electronic conductive paths in situ formed at the interface can effectively uniform Li deposition and suppress Li dendrite.The solid-state symmetric cell exhibits low interface resistance(11Ω·cm^(2)) and high critical current density(1.3 mA·cm^(−2))at 25℃.The full SSLMB based on LiFePO_(4) or LiNi_(0.5)Co_(0.2)Mn_(0.3)O_(2) cathode also shows stable cycling performance and high rate capability.This work provides a new composite anode strategy for achieving high-energy density and high-safety SSLMBs.展开更多
Effective thermal management is quite urgent for electronics owing to their ever-growing integration degree,operation frequency and power density,and the main strategy of thermal management is to remove excess energy ...Effective thermal management is quite urgent for electronics owing to their ever-growing integration degree,operation frequency and power density,and the main strategy of thermal management is to remove excess energy from electronics to outside by thermal conductive materials.Compared to the conventional thermal management materials,flexible thermally conductive films with high in-plane thermal conductivity,as emerging candidates,have aroused greater interest in the last decade,which show great potential in thermal management applications of next-generation devices.However,a comprehensive review of flexible thermally conductive films is rarely reported.Thus,we review recent advances of both intrinsic polymer films and polymer-based composite films with ultrahigh in-plane thermal conductivity,with deep understandings of heat transfer mechanism,processing methods to enhance thermal conductivity,optimization strategies to reduce interface thermal resistance and their potential applications.Lastly,challenges and opportunities for the future development of flexible thermally conductive films are also discussed.展开更多
The direct-current simulation burning method was used to investigate the burn-resistant behavior of Ti14 titanium alloy.The results show that Ti14 alloy exhibits a better burn resistance than TC4 alloy（Ti-6A1-4V）.Cu...The direct-current simulation burning method was used to investigate the burn-resistant behavior of Ti14 titanium alloy.The results show that Ti14 alloy exhibits a better burn resistance than TC4 alloy（Ti-6A1-4V）.Cu is observed to preferentially migrate to the surface of Ti14 alloy during the burning reaction,and the burned product contains Cu,Cu2O,and TiO2.An oxide layer mainly comprising loose TiO2 is observed beneath the burned product.Meanwhile,Ti2Cu precipitates at grain boundaries near the interface of the oxide layer,preventing the contact between O2 and Ti and forming a rapid diffusion layer near the matrix interface.Consequently,a multiple-layer structure with a Cu-enriched layer（burned product）/Cu-lean layer（oxide layer）/Cu-enriched layer（rapid diffusion layer） configuration is formed in the burn heat-affected zone of Ti14 alloy;this multiple-layer structure is beneficial for preventing O2 diffusion.Furthermore,although A1 can migrate to form A12O3 on the surface of TC4 alloy,the burn-resistant ability of TC4 is unimproved because the Al2O3 is discontinuous and not present in sufficient quantity.展开更多
Stacking faults(SFs)are often present in silicon carbide(SiC)and affect its thermal and heat-transport properties.However,it is unclear how SFs influence thermal transport.Using non-equilibrium molecular dynamics and ...Stacking faults(SFs)are often present in silicon carbide(SiC)and affect its thermal and heat-transport properties.However,it is unclear how SFs influence thermal transport.Using non-equilibrium molecular dynamics and lattice dynamics simulations,we studied phonon transport in SiC materials with an SF.Compared to perfect SiC materials,the SF can reduce thermal conductivity.This is caused by the additional interface thermal resistance(ITR)of SF,which is difficult to capture by the previous phenomenological models.By analyzing the spectral heat flux,we find that SF reduces the contribution of low-frequency(7.5 THz-12 THz)phonons to the heat flux,which can be attributed to SF reducing the phonon lifetime and group velocity,especially in the low-frequency range.The SF hinders phonon transport and results in an effective interface thermal resistance around the SF.Our results provide insight into the microscopic mechanism of the effect of defects on heat transport and have guiding significance for the regulation of the thermal conductivity of materials.展开更多
An anti-laser-ablation coating using TiO_(2)as pigment and potassium silicate as binder(abbreviated as KS-T)was deposited on the aluminum alloy substrate by an air spray process.Factors influencing the reflectance of ...An anti-laser-ablation coating using TiO_(2)as pigment and potassium silicate as binder(abbreviated as KS-T)was deposited on the aluminum alloy substrate by an air spray process.Factors influencing the reflectance of KS-T coating,including particle size,pigment volume concentration and coating thickness,were investigated.The reflectance of prepared KS-T coating could be up to 96.8%at the laser wavelength of 1064 nm.A three-dimensional finite element model based on the heat-conduction equation was developed to simulate the distribution of transient temperature filed.By monitoring the temperature variation at the backside center of aluminum alloy substrate during laser irradiation and comparing with the simulation results,it is found that KS-T coating could effectively protect the substrate from laser ablation.The simulation results demonstrated reflectance decrease of samples after a period of irradiation.The possible reasons for the reflectance decrease were proposed.The calculation results also showed that an obvious temperature drop emerged at the coating/substrate interface when interface thermal resistance(ITR)was considered.Eventually heat flux was prevented from flowing to the substrate and aluminum alloy kept a low temperature.展开更多
Effective thermal management has become extremely urgent for electronics due to the massive heat originated from the ever-rising power density.With the merits of high thermal conductivity,good chemical stability and d...Effective thermal management has become extremely urgent for electronics due to the massive heat originated from the ever-rising power density.With the merits of high thermal conductivity,good chemical stability and desirable mechanical properties,carbon nanotubes(CNTs)are considered to have great potential to be widely used in heat dissipation devices.This article describes the progress on thermal conductivity of CNT-reinforced composites,aligned CNT materials(aligned CNT arrays,films/buckypapers and fibers)as high thermal conductors,experimental and theoretical results of CNT-substrate interface resistance,and utilizations of CNTs in the passive heat dissipation(natural convection,heat radiation,and phase-change heat transfer).Finally,the challenges and prospects are discussed to provide some hints in the future studies.It is believed that CNTs can play an important role in thermal management of electronics,especially in the portable electronic devices.展开更多
Employing quasi-solid-state gel polymer electrolyte(GPE)instead of the liquid counterpart has been regarded as a promising strategy for improving the electrochemical performance of Li metal batteries.However,the poor ...Employing quasi-solid-state gel polymer electrolyte(GPE)instead of the liquid counterpart has been regarded as a promising strategy for improving the electrochemical performance of Li metal batteries.However,the poor and uneven interfacial contact between Li metal anode and GPE could cause large interfacial resistance and electrochemical Li stripping/plating inhomogeneity,deteriorating the electrochemical performance.Herein,we proposed that the functional component of composite anode could work as the catalyst to promote the in situ polymerization reaction,and we experimentally realized the integration of polymerized-dioxolane electrolyte and Li/Li_(22)Sn_(5)/LiF composite electrode with low interfacial resistance and good stability by in situ catalyzation polymerization.Thus,the reaction kinetics and stability of metallic Li anode were significantly enhanced.As a demonstration,symmetric cell using such a GPE-Li/Li_(22)Sn_(5)/LiF integration achieved stable cycling beyond 250 cycles with small potential hysteresis of 25 mV at 1 mA·cm^(−2)and 1 mAh·cm^(−2),far outperforming the counterpart regular GPE on pure Li.Paired with LiNi0.5Co0.3Mn0.2O2,the full cell with the GPE-Li/Li_(22)Sn_(5)/LiF integration maintained 85.7%of the original capacity after 100 cycles at 0.5 C(1 C=200 mA·g^(−1)).Our research provides a promising strategy for reducing the resistance between GPE and Li metal anode,and realizes Li metal batteries with enhance electrochemical performance.展开更多
Effective manipulations of thermal expansion and conductivity are significant for improving operational performances of protective coatings,thermoelectric,and radiators.This work uncovers determinant mechanisms of the...Effective manipulations of thermal expansion and conductivity are significant for improving operational performances of protective coatings,thermoelectric,and radiators.This work uncovers determinant mechanisms of the thermal expansion and conductivity of symbiotic ScTaO_(4)/SmTaO_(4) composites as thermal/environmental barrier coatings(T/EBCs),and we consider the effects of interface stress and thermal resistance.The weak bonding and interface stress among composite grains manipulate coefficient of thermal expansion(CTE)stretching from 6.4×10^(−6) to 10.7×10^(−6) K^(−1) at 1300℃,which gets close to that of substrates in T/EBC systems.The multiscale effects,including phonon scattering at the interface,mitigation of the phonon speed(vp),and lattice point defects,synergistically depress phonon thermal transports,and we estimate the proportions of different parts.The interface thermal resistance(R)reduces the thermal conductivity(k)by depressing phonon speed and scattering phonons because of different acoustic properties and weak bonding between symbiotic ScTaO_(4) and SmTaO_(4) ceramics in the composites.This study proves that CTE of tantalates can be artificially regulated to match those of different substrates to expand their applications,and the uncovered multiscale effects can be used to manipulate thermal transports of various materials.展开更多
Heat conduction in multi-layer and composite materials is one of the fundamental heat transfer problems in many industrial applications.Due to different materials types,interface conditions,and various geometries of t...Heat conduction in multi-layer and composite materials is one of the fundamental heat transfer problems in many industrial applications.Due to different materials types,interface conditions,and various geometries of these laminates,the heat conduction mechanism is more complicated than that of one-layer isotropic media.Analytical solutions are the best ways to study and understand such problems in depth.In this study,different existing analytical solutions for heat conduction in multi-layer and composite materials are reviewed and classified in rectangular,cylindrical,spherical,and conical coordinates.Applied boundary conditions,internal heat source,and thermal contact resistance as the most critical parameters in the solution complexity investigated in the literature,are discussed and summarized in different tables.Various types of multi-layer structures such as isotropic,anisotropic,orthotropic,and reinforced laminates are included in this study.It is found that although more than half a century has passed since the beginning of the research on heat transfer in multi-layer composites,new researches that can help with a better understanding in this area are still being offered.The challenges and shortcomings in this area are also discussed to guide future researches.展开更多
This study focuses on modeling the effects of deep hole traps, mainly the effect of the substrate（backgating effect） in a GaAs transistor MESFT. This effect is explained by the existence, at the interface, of a spac...This study focuses on modeling the effects of deep hole traps, mainly the effect of the substrate（backgating effect） in a GaAs transistor MESFT. This effect is explained by the existence, at the interface, of a space charge zone. Any modulation in this area leads to response levels trapping the holes therein to the operating temperature. We subsequently developed a model treating the channel substrate interface as an N–P junction, allowing us to deduce the time dependence of the component parameters of the total resistance R ds, the pinch-off voltage V P, channel resistance, fully open R co and the parasitic series resistance R S to bind the effect trap holes H1and H0. When compared with the experimental results, the values of the R DS（t S/ model for both traps show that there is an agreement between theory and experiment; it has inferred parameter traps, namely the density and the time constant of the trap. This means that a space charge region exists at the channel–substrate interface and that the properties can be approximated to an N–P junction.展开更多
基金supported by the National Natural Science Foundation of China(Grant No.52206092)the National Key R&D Program of China(Grant No.2024YFF0508900)+1 种基金the Big Data Computing Center of Southeast Universitythe Center for Fundamental and Interdisciplinary Sciences of Southeast University。
文摘Efficient thermal management is critical to the reliability and performance of nanoscale electronic and photonic devices,particularly those incorporating multilayer structures.In this study,non-equilibrium molecular dynamics simulations were conducted to systematically investigate the effects of temperature,penetration depth,and Si layer thickness on the interfacial thermal resistance(ITR)in nanometer-scale Mo/Si multilayers,widely employed in extreme ultraviolet lithography.The results indicate that:(i)temperature variations exert a negligible influence on the ITR of amorphous Mo/Si interfaces,which remains stable across the range of 200-900 K;(ii)increasing penetration depth enhances the overlap of phonon density of states,thereby significantly reducing ITR;(iii)the ITR decreases with increasing Si thickness up to4.2 nm due to quasi-ballistic phonon transport,but rises again as phonon scattering becomes more pronounced at larger thicknesses.This study provides quantitative insights into heat transfer mechanisms at amorphous interfaces and also offers a feasible strategy for tailoring interfacial thermal transport through structural design.
基金fnancially supported by the National Science Found for Distinguished Young Scholars of China(No.52025014)the National Science and Technology Major Project(No.2017VII-0012–0108)+1 种基金the National Science Foundation of China(Nos.51901238 and 52101109)the Natural Science Foundation of Ningbo(Nos.202003N4350 and 202003N4025)。
文摘In view of the M_(n+1)AX_(n)(MAX)phase coatings benefting the adaptive passivation flm for good corrosion resistance and high electronic density of states for excellent electrical conductivity,here,we reported the Cr_(2)Al C MAX phase coatings with different preferred orientations by a homemade technique consisting of vacuum arc and magnetron sputtering.The dependence of surface and interface microstructural evolution upon the corrosion and electrochemical properties of deposited coating was focused.Results showed that all the Cr_(2)Al C coatings with different phase orientations greatly improved the performance of stainless steel(SS)316 L substrate.Specifcally,the lowest value of interface contact resistance(ICR)reached to 3.16 mΩcm^(2)and the lowest corrosion current density was 2×10^(-2)μA cm^(-2),which were much better than those of bare SS316L.The combined studies of electrochemical properties and theoretical calculations demonstrated that the Cr_(2)Al C coatings with preferred(103)orientation were easier to form oxide passivation flm on their surface to increase the corrosion resistance.
基金financially supported by the National Natural Science Foundation of China(Nos.52373042 and 52103091)the National Key Research and Development Project of China(No.2022YFB3806900)the International Visiting Program for Excellent Young Scholars of SCU。
文摘Effective thermal transport across solid-solid interfaces which is essential in thermal interface materials(TIMs),necessitates both optimal thixotropy and high thermal conductivity.The role of filler surface modification,a fundamental aspect of TIM fabrication,in the influence of these properties is not fully understood.This study employs the use of a silane coupling agent(SCA)to modify alumina,integrating experimental approaches with molecular dynamics simulations,to elucidate the interface effects on thixotropy and thermal conductivity in polydimethylsiloxane(PDMS)-based TIMs.Our findings reveal that the variations of SCAs modify both interface binding energy and transition layer thickness.The interface binding energy restricts macromolecular segmental relaxation near the interface,hindering desirable thixotropy and bond line thickness.On the contrary,the thickness of the transition layer at the interface positively influences thermal conductivity,facilitating the transport of phonons between the polymer and filler.Consequently,selecting an optimal SCA allows a balance between traditionally conflicting goals of high thermal conductivity and minimal bond line thickness,achieving an impressively low interface thermal resistance of just 2.45-4.29 K·mm^(2)·W^(-1)at275.8 kPa.
文摘All-solid-state lithium ion batteries(ASSLIBs)have attracted much attention due to their high safety and increased energy density,which have become a substitute to conventional liquid electrolyte batteries[1].The development of high-performance solid electrolyte is the key to the development of solid-state battery technology.Solid-state electrolyte(SSE)materials should have high ionic conductivity,poor electronic conductivity,wide electrochemical window,and low electrode and electrolyte interface resistance.
基金This study was financially supported by the National Natural Science Foundation of China(Nos.52177208,52171202,51971055 and 51871046)the National Safety Academic Fund(Nos.U1930208,U2030206 and U1730136).
文摘The high energy density and stability of solid-state lithium metal batteries(SSLMBs)have garnered great attention.Garnet-type oxides,especially Li_(6.4)La_(3)Zr_(1.4)Ta_(0.6)O_(12)(LLZTO),with high ionic conductivity,wide electrochemical window,and stability to Li metal anode,are promising solid-state electrolyte(SSEs)materials for SSLMBs.However,Li/LLZTO interface issues including high interface resistance,inhomogeneous Li deposition,and Li dendrite growth have hindered the practical application of SSLMBs.Herein,a multi-functional Li–SnF_(2) composite anode with Li,LiF,and Li-Sn alloy was specifically designed and prepared.The composite anode improves the wettability to LLZTO,constructing an intimate contact interface between it and LLZTO.Meanwhile,ionic/electronic conductive paths in situ formed at the interface can effectively uniform Li deposition and suppress Li dendrite.The solid-state symmetric cell exhibits low interface resistance(11Ω·cm^(2)) and high critical current density(1.3 mA·cm^(−2))at 25℃.The full SSLMB based on LiFePO_(4) or LiNi_(0.5)Co_(0.2)Mn_(0.3)O_(2) cathode also shows stable cycling performance and high rate capability.This work provides a new composite anode strategy for achieving high-energy density and high-safety SSLMBs.
基金funded by the National Natural Science Foundation of China (NNSFC grant nos. 52103034, 51873126, 52175331 and 52003170)Shandong Provincial Natural Science Foundation (ZR2021QE014, ZR2020ZD04)
文摘Effective thermal management is quite urgent for electronics owing to their ever-growing integration degree,operation frequency and power density,and the main strategy of thermal management is to remove excess energy from electronics to outside by thermal conductive materials.Compared to the conventional thermal management materials,flexible thermally conductive films with high in-plane thermal conductivity,as emerging candidates,have aroused greater interest in the last decade,which show great potential in thermal management applications of next-generation devices.However,a comprehensive review of flexible thermally conductive films is rarely reported.Thus,we review recent advances of both intrinsic polymer films and polymer-based composite films with ultrahigh in-plane thermal conductivity,with deep understandings of heat transfer mechanism,processing methods to enhance thermal conductivity,optimization strategies to reduce interface thermal resistance and their potential applications.Lastly,challenges and opportunities for the future development of flexible thermally conductive films are also discussed.
基金supported by the Major State Basic Research Development Program of China(No.2007CB613807)the National Natural Science Foundation of China(Nos.51201019 and 51401033)
文摘The direct-current simulation burning method was used to investigate the burn-resistant behavior of Ti14 titanium alloy.The results show that Ti14 alloy exhibits a better burn resistance than TC4 alloy（Ti-6A1-4V）.Cu is observed to preferentially migrate to the surface of Ti14 alloy during the burning reaction,and the burned product contains Cu,Cu2O,and TiO2.An oxide layer mainly comprising loose TiO2 is observed beneath the burned product.Meanwhile,Ti2Cu precipitates at grain boundaries near the interface of the oxide layer,preventing the contact between O2 and Ti and forming a rapid diffusion layer near the matrix interface.Consequently,a multiple-layer structure with a Cu-enriched layer（burned product）/Cu-lean layer（oxide layer）/Cu-enriched layer（rapid diffusion layer） configuration is formed in the burn heat-affected zone of Ti14 alloy;this multiple-layer structure is beneficial for preventing O2 diffusion.Furthermore,although A1 can migrate to form A12O3 on the surface of TC4 alloy,the burn-resistant ability of TC4 is unimproved because the Al2O3 is discontinuous and not present in sufficient quantity.
基金Sichuan Science and Technology Program(Grant No.2023NSFSC0044)the National Natural Science Foundation of China(Grant No.51501119)+1 种基金the Fundamental Research Funds for the Central Universitiespartially supported by the High-Performance Computing Center at Sichuan University。
文摘Stacking faults(SFs)are often present in silicon carbide(SiC)and affect its thermal and heat-transport properties.However,it is unclear how SFs influence thermal transport.Using non-equilibrium molecular dynamics and lattice dynamics simulations,we studied phonon transport in SiC materials with an SF.Compared to perfect SiC materials,the SF can reduce thermal conductivity.This is caused by the additional interface thermal resistance(ITR)of SF,which is difficult to capture by the previous phenomenological models.By analyzing the spectral heat flux,we find that SF reduces the contribution of low-frequency(7.5 THz-12 THz)phonons to the heat flux,which can be attributed to SF reducing the phonon lifetime and group velocity,especially in the low-frequency range.The SF hinders phonon transport and results in an effective interface thermal resistance around the SF.Our results provide insight into the microscopic mechanism of the effect of defects on heat transport and have guiding significance for the regulation of the thermal conductivity of materials.
文摘An anti-laser-ablation coating using TiO_(2)as pigment and potassium silicate as binder(abbreviated as KS-T)was deposited on the aluminum alloy substrate by an air spray process.Factors influencing the reflectance of KS-T coating,including particle size,pigment volume concentration and coating thickness,were investigated.The reflectance of prepared KS-T coating could be up to 96.8%at the laser wavelength of 1064 nm.A three-dimensional finite element model based on the heat-conduction equation was developed to simulate the distribution of transient temperature filed.By monitoring the temperature variation at the backside center of aluminum alloy substrate during laser irradiation and comparing with the simulation results,it is found that KS-T coating could effectively protect the substrate from laser ablation.The simulation results demonstrated reflectance decrease of samples after a period of irradiation.The possible reasons for the reflectance decrease were proposed.The calculation results also showed that an obvious temperature drop emerged at the coating/substrate interface when interface thermal resistance(ITR)was considered.Eventually heat flux was prevented from flowing to the substrate and aluminum alloy kept a low temperature.
基金supported by the National Key Research&Development Program of China(No.2018YFA0208401).
文摘Effective thermal management has become extremely urgent for electronics due to the massive heat originated from the ever-rising power density.With the merits of high thermal conductivity,good chemical stability and desirable mechanical properties,carbon nanotubes(CNTs)are considered to have great potential to be widely used in heat dissipation devices.This article describes the progress on thermal conductivity of CNT-reinforced composites,aligned CNT materials(aligned CNT arrays,films/buckypapers and fibers)as high thermal conductors,experimental and theoretical results of CNT-substrate interface resistance,and utilizations of CNTs in the passive heat dissipation(natural convection,heat radiation,and phase-change heat transfer).Finally,the challenges and prospects are discussed to provide some hints in the future studies.It is believed that CNTs can play an important role in thermal management of electronics,especially in the portable electronic devices.
基金the National Natural Science Foundation of China(Nos.52272207 and 62204173)。
文摘Employing quasi-solid-state gel polymer electrolyte(GPE)instead of the liquid counterpart has been regarded as a promising strategy for improving the electrochemical performance of Li metal batteries.However,the poor and uneven interfacial contact between Li metal anode and GPE could cause large interfacial resistance and electrochemical Li stripping/plating inhomogeneity,deteriorating the electrochemical performance.Herein,we proposed that the functional component of composite anode could work as the catalyst to promote the in situ polymerization reaction,and we experimentally realized the integration of polymerized-dioxolane electrolyte and Li/Li_(22)Sn_(5)/LiF composite electrode with low interfacial resistance and good stability by in situ catalyzation polymerization.Thus,the reaction kinetics and stability of metallic Li anode were significantly enhanced.As a demonstration,symmetric cell using such a GPE-Li/Li_(22)Sn_(5)/LiF integration achieved stable cycling beyond 250 cycles with small potential hysteresis of 25 mV at 1 mA·cm^(−2)and 1 mAh·cm^(−2),far outperforming the counterpart regular GPE on pure Li.Paired with LiNi0.5Co0.3Mn0.2O2,the full cell with the GPE-Li/Li_(22)Sn_(5)/LiF integration maintained 85.7%of the original capacity after 100 cycles at 0.5 C(1 C=200 mA·g^(−1)).Our research provides a promising strategy for reducing the resistance between GPE and Li metal anode,and realizes Li metal batteries with enhance electrochemical performance.
基金Thanks for the supports from the National Natural Science Foundation of China(No.91960103)National Key Research and Development Program of China(No.2022YFB3708600)+1 种基金the Rare and Precious Metals Material Genetic Engineering Project of Yunnan Province(No.202102AB080019-1)the Top Innovative Talents of Graduate Students of Kunming University of Science and Technology。
文摘Effective manipulations of thermal expansion and conductivity are significant for improving operational performances of protective coatings,thermoelectric,and radiators.This work uncovers determinant mechanisms of the thermal expansion and conductivity of symbiotic ScTaO_(4)/SmTaO_(4) composites as thermal/environmental barrier coatings(T/EBCs),and we consider the effects of interface stress and thermal resistance.The weak bonding and interface stress among composite grains manipulate coefficient of thermal expansion(CTE)stretching from 6.4×10^(−6) to 10.7×10^(−6) K^(−1) at 1300℃,which gets close to that of substrates in T/EBC systems.The multiscale effects,including phonon scattering at the interface,mitigation of the phonon speed(vp),and lattice point defects,synergistically depress phonon thermal transports,and we estimate the proportions of different parts.The interface thermal resistance(R)reduces the thermal conductivity(k)by depressing phonon speed and scattering phonons because of different acoustic properties and weak bonding between symbiotic ScTaO_(4) and SmTaO_(4) ceramics in the composites.This study proves that CTE of tantalates can be artificially regulated to match those of different substrates to expand their applications,and the uncovered multiscale effects can be used to manipulate thermal transports of various materials.
基金financial support of the National Natural Science Foundation of China(No.52025061 and No.51961130386)the financial support from the Royal Society-Newton Advanced Fellowship grant(NAF\R1\191163).
文摘Heat conduction in multi-layer and composite materials is one of the fundamental heat transfer problems in many industrial applications.Due to different materials types,interface conditions,and various geometries of these laminates,the heat conduction mechanism is more complicated than that of one-layer isotropic media.Analytical solutions are the best ways to study and understand such problems in depth.In this study,different existing analytical solutions for heat conduction in multi-layer and composite materials are reviewed and classified in rectangular,cylindrical,spherical,and conical coordinates.Applied boundary conditions,internal heat source,and thermal contact resistance as the most critical parameters in the solution complexity investigated in the literature,are discussed and summarized in different tables.Various types of multi-layer structures such as isotropic,anisotropic,orthotropic,and reinforced laminates are included in this study.It is found that although more than half a century has passed since the beginning of the research on heat transfer in multi-layer composites,new researches that can help with a better understanding in this area are still being offered.The challenges and shortcomings in this area are also discussed to guide future researches.
文摘This study focuses on modeling the effects of deep hole traps, mainly the effect of the substrate（backgating effect） in a GaAs transistor MESFT. This effect is explained by the existence, at the interface, of a space charge zone. Any modulation in this area leads to response levels trapping the holes therein to the operating temperature. We subsequently developed a model treating the channel substrate interface as an N–P junction, allowing us to deduce the time dependence of the component parameters of the total resistance R ds, the pinch-off voltage V P, channel resistance, fully open R co and the parasitic series resistance R S to bind the effect trap holes H1and H0. When compared with the experimental results, the values of the R DS（t S/ model for both traps show that there is an agreement between theory and experiment; it has inferred parameter traps, namely the density and the time constant of the trap. This means that a space charge region exists at the channel–substrate interface and that the properties can be approximated to an N–P junction.
