Industrial intelligence and secure interconnection serve as the foundational platform and critical information infrastructure for new industrialization,carrying significant strategic importance.They not only function ...Industrial intelligence and secure interconnection serve as the foundational platform and critical information infrastructure for new industrialization,carrying significant strategic importance.They not only function as the core engine driving the transformation and upgrading of the manufacturing sector and ensuring stable socioeconomic operation but are also vital to enhancing national technological competitiveness and safeguarding industrial security.展开更多
With the rapid development of network technologies,a large number of deployed edge devices and information systems generate massive amounts of data which provide good support for the advancement of data-driven intelli...With the rapid development of network technologies,a large number of deployed edge devices and information systems generate massive amounts of data which provide good support for the advancement of data-driven intelligent models.However,these data often contain sensitive information of users.Federated learning(FL),as a privacy preservation machine learning setting,allows users to obtain a well-trained model without sending the privacy-sensitive local data to the central server.Despite the promising prospect of FL,several significant research challenges need to be addressed before widespread deployment,including network resource allocation,model security,model convergence,etc.In this paper,we first provide a brief survey on some of these works that have been done on FL and discuss the motivations of the Communication Networks(CNs)and FL to mutually enable each other.We analyze the support of network technologies for FL,which requires frequent communication and emphasizes security,as well as the studies on the intelligence of many network scenarios and the improvement of network performance and security by the methods based on FL.At last,some challenges and broader perspectives are explored.展开更多
Salt deposits in China predominantly originate from lake deposits,characterized by thin salt beds interspersed with numerous interlayers,collectively termed bedded salt formations.Historically,the solution mining prac...Salt deposits in China predominantly originate from lake deposits,characterized by thin salt beds interspersed with numerous interlayers,collectively termed bedded salt formations.Historically,the solution mining practices have adopted the layered solution mining approach,inspired by coal mining techniques.However,this approach fails to account for the unique challenges of salt solution mining.Practical implementation is inefficient,costs escalate post-construction,and cavern geometry is constrained by salt beds thickness.Additionally,resource loss in abandoned beds and stability risks in adjacent mining zones remain unresolved.This study investigates mining scheme selection for low-grade salt deposits in Huai'an Salt Basin,introducing a continuous solution mining method that traverses multiple interlayers.Through comprehensive analysis of plastic deformation in caverns and surrounding rock,volume shrinkage rates,and economic costs comparing continuous and layered solution mining approaches,the results demonstrate that:(1)In the layered solution mining with horizontal interconnected wells scheme,plastic deformation zones propagate unevenly,posing interlayer connectivity risks.Concurrently,roof subsidence and floor heave destabilize the structure;(2)the continuous solution mining with horizontal interconnected wells scheme reduces plastic deformation zones to 3.4%of cavern volume,with volumetric shrinkage below 17%,markedly improving stability;(3)Economically,the continuous solution mining scheme generates caverns 2.43 times larger than the layered solution mining,slashing unit volume costs to 41.1%while enhancing resource recovery and long-term viability.The continuous method demonstrates distinct economic advantages and achieves higher resource utilization efficiency in solution mining compared to layered mining.Furthermore,its superior cavern stability presents strong potential for large-scale implementation.展开更多
Nano-twinned copper(nt-Cu),with a preferred orientation,is highly promising as interconnect materials in high-density advanced packaging due to its considerable mechanical strength,excellent electrical conductivity,an...Nano-twinned copper(nt-Cu),with a preferred orientation,is highly promising as interconnect materials in high-density advanced packaging due to its considerable mechanical strength,excellent electrical conductivity,and resistance to thermal migration.However,its application is impeded by sulfur-containing byproducts from the electroplating process,exacerbating the formation of Kirkendall voids within solder joints during thermal aging.Herein,through the incorporation of Zinc(Zn)into the nt-Cu layer,we develop a nt-Cu/Zn composite structure.Our findings provide the first definitive confirmation of the mechanism by which sulfur atoms migrate to the Cu_(3)Sn/nt-Cu interface through interstitial diffusion,thereby reducing the activation energy for vacancy formation.We further demonstrate that Zn effectively an-choring sulfur atoms,forming ZnS within the nt-Cu layer during heat treatment,which increases the vacancy formation energy and inhibits the development of Kirkendall voids.Remarkably,no Kirkendall voids are observed in the modified interconnects even after prolonged aging at 150℃ for 1000 h.The nt-Cu/Zn composite metallization layers significantly decrease the growth rate of interfacial intermetallic compounds by 33.6% and enhance the shear strength of solder interconnections to 228.9%.This research underscores the potential of nt-Cu in advanced electronic packaging,offering new pathways for improving the power density and reliability of electronic devices.展开更多
High-density interconnect(HDI)soft electronics that can integrate multiple individual functions into one miniaturized monolithic system is promising for applications related to smart healthcare,soft robotics,and human...High-density interconnect(HDI)soft electronics that can integrate multiple individual functions into one miniaturized monolithic system is promising for applications related to smart healthcare,soft robotics,and human-machine interactions.However,despite the recent advances,the development of three-dimensional(3D)soft electronics with both high resolution and high integration is still challenging because of the lack of efficient manufacturing methods to guarantee interlayer alignment of the high-density vias and reliable interlayer electrical conductivity.Here,an advanced 3D laser printing pathway,based on femtosecond laser direct writing(FLDW),is demonstrated for preparing liquid metal(LM)-based any layer HDI soft electronics.FLDW technology,with the characteristics of high spatial resolution and high precision,allows the maskless fabrication of high-resolution embedded LM microchannels and high-density vertical interconnect accesses for 3D integrated circuits.High-aspect-ratio blind/through LM microstructures are formed inside the elastomer due to the supermetalphobicity induced during laser ablation.The LM-based HDI circuit featuring high resolution(~1.5μm)and high integration(10-layer electrical interconnection)is achieved for customized soft electronics,including various customized multilayer passive electric components,soft multilayer circuit,and cross-scale multimode sensors.The 3D laser printing method provides a versatile approach for developing chip-level soft electronics.展开更多
Propelled by the rise of artificial intelligence,cloud services,and data center applications,next-generation,low-power,local-oscillator-less,digital signal processing(DSP)-free,and short-reach coherent optical communi...Propelled by the rise of artificial intelligence,cloud services,and data center applications,next-generation,low-power,local-oscillator-less,digital signal processing(DSP)-free,and short-reach coherent optical communication has evolved into an increasingly prominent area of research in recent years.Here,we demonstrate DSP-free coherent optical transmission by analog signal processing in frequency synchronous optical network(FSON)architecture,which supports polarization multiplexing and higher-order modulation formats.The FSON architecture that allows the numerous laser sources of optical transceivers within a data center can be quasi-synchronized by means of a tree-distributed homology architecture.In conjunction with our proposed pilot-tone assisted Costas loop for an analog coherent receiver,we achieve a record dual-polarization 224-Gb/s 16-QAM 5-km mismatch transmission with reset-free carrier phase recovery in the optical domain.Our proposed DSP-free analog coherent detection system based on the FSON makes it a promising solution for next-generation,low-power,and high-capacity coherent data center interconnects.展开更多
Interconnection planning involving bi-directional converters(BdCs)is crucial for enhancing the reliability and robustness of hybrid alternating current(AC)/direct current(DC)microgrid clusters with high penetrations o...Interconnection planning involving bi-directional converters(BdCs)is crucial for enhancing the reliability and robustness of hybrid alternating current(AC)/direct current(DC)microgrid clusters with high penetrations of renewable energy resources(RESs).However,challenges such as the non-convex nature of BdC efficiency and renewable energy uncertainty complicate the planning process.To address these issues,this paper proposes a tri-level BdC-based planning framework that incorporates dynamic BdC efficiency and a data-correlated uncertainty set(DcUS)derived from historical data patterns.The proposed framework employs a least-squares approximation to linearize BdC efficiency and constructs the DcUS to balance computational efficiency and solution robustness.Additionally,a fully parallel column and constraint generation algorithm is developed to solve the model efficiently.Numerical simulations on a practical hybrid AC/DC microgrid system demonstrate that the proposed method reduces interconnection costs by up to 21.8%compared to conventional uncertainty sets while ensuring robust operation under all considered scenarios.These results highlight the computational efficiency,robustness,and practicality of the proposed approach,making it a promising solution for modern power systems.展开更多
As the development of single-junction solar cells reaches a bottleneck,tandem solar cells have emerged as a critical pathway to further enhance power conversion efficiency.Among them,monolithic perovskite/silicon hete...As the development of single-junction solar cells reaches a bottleneck,tandem solar cells have emerged as a critical pathway to further enhance power conversion efficiency.Among them,monolithic perovskite/silicon heterojunction tandem solar cells are currently the fastest-growing technology,achieving the highest efficiencies at relatively low costs.The intercon-necting layer,which connects the two sub-cells,plays a crucial role in tandem cell performance.It collects electrons and holes from the respective sub-cells and facilitates recombination and tunneling at the interface.Therefore,the properties of the inter-connecting layer are pivotal to the overall device performance.In this work,we applied statistical analysis and machine learn-ing algorithms to systematically analyze the interconnecting layer.A comprehensive dataset on interconnecting layer parame-ters was established,and predictive modeling was performed using Lasso linear regression,random forest,and multilayer per-ceptron(a type of neural network).The analysis revealed key feature importance for experimental parameters,providing valu-able insights into the application of interconnecting layers in perovskite/silicon heterojunction tandem solar cells.The final opti-mized interconnecting layer can achieve a proof-of-concept efficiency of 38.17%,providing guidance and direction for the devel-opment of monolithic perovskite/silicon tandem solar cells.展开更多
Permanent Magnet Synchronous Motors(PMSMs)are widely employed in high-performance drive applications due to their superior efficiency and dynamic capabilities.However,their control remains challenging owing to nonline...Permanent Magnet Synchronous Motors(PMSMs)are widely employed in high-performance drive applications due to their superior efficiency and dynamic capabilities.However,their control remains challenging owing to nonlinear dynamics,parameter variations,and unmeasurable external disturbances,particularly load torquefluctuations.This study proposes an enhanced Interconnection and Damp-ing Assignment Passivity-Based Control(IDA-PBC)scheme,formulated within the port-controlled Hamiltonian(PCH)framework,to address these limitations.A nonlinear disturbance observer is embedded to estimate and compensate,in real time,for lumped mis-matched disturbances arising from parameter uncertainties and external loads.Additionally,aflatness-based control strategy is employed to generate the desired current references within the nonlinear drive system,ensuring accurate tracking of time-varying speed commands.This integrated approach preserves the system’s energy-based structure,enabling systematic stability analysis while enhancing robustness.The proposed control architecture also maintains low complexity with a limited number of tunable parameters,facilitating practical implementation.Simulation and experimental results under various operating conditions demonstrate the effectiveness and robustness of the proposed method.Comparative analysis with conventional proportional-integral(PI)control and standard IDA-PBC strategies confirms its capability to handle disturbances and maintain dynamic performance.展开更多
This study focused on meeting the stringent stability requirements of tubular segmented-in-series solid oxide fuel cells(SOFCs) in reducing and oxidizing atmospheres.To address this challenge,a bi-layer perovskite cer...This study focused on meeting the stringent stability requirements of tubular segmented-in-series solid oxide fuel cells(SOFCs) in reducing and oxidizing atmospheres.To address this challenge,a bi-layer perovskite ceramic interconnect was designed by controlling the oxygen partial pressure,because of the strong correlation between the conductivity of strontium-doped lanthanum titanate(LST) and the oxygen partial pressure.The LST powder was prepared using solid-phase and sol-gel methods,and their influence on particle size and sintering behavior was compared.LST/lanthanum strontium manganite(LSM) bi-layer ceramic interconnects with varying thicknesses were fabricated through screen printing and co-sintering.The results demonstrate favorable interfacial bonding and excellent chemical compatibility between the ceramic layers.The conductivity of the bi-layer interconnect exhibits a temperature-dependent behavior,peaking at 550℃.Simulation calculations and research findings validate that the co nductivity of the bi-layer interconnect is determined by the thickness of the LSM layer and the oxygen partial pressure at the interconnect interface.Optimal conductivity is achieved with a bilayer interconnect consisting of approximately 15 μm of LST and 4 μm of LSM.This can be attributed to the efficient regulation of oxygen partial pressure at the interface,effectively mitigating LSM decomposition caused by low oxygen partial pressure and the subsequent reduction in conductivity.These results provide valuable fundamental data and methodology for the development of high-performance interconnects for tubular segmented-in-series SOFCs.展开更多
The interconnect temperature of very large scale integration（VLSI） circuits keeps rising due to self-heating and substrate temperature, which can increase the delay and power dissipation of interconnect wires. The t...The interconnect temperature of very large scale integration（VLSI） circuits keeps rising due to self-heating and substrate temperature, which can increase the delay and power dissipation of interconnect wires. The thermal vias are regarded as a promising method to improve the temperature performance of VLSI circuits. In this paper, the extra thermal vias were used to decrease the delay and power dissipation of interconnect wires of VLSI circuits. Two analytical models were presented for interconnect temperature, delay and power dissipation with adding extra dummy thermal vias. The influence of the number of thermal vias on the delay and power dissipation of interconnect wires was analyzed and the optimal via separation distance was investigated. The experimental results show that the adding extra dummy thermal vias can reduce the interconnect average temperature, maximum temperature, delay and power dissipation. Moreover, this method is also suitable for clock signal wires with a large root mean square current.展开更多
In this article, we report the preparation of a three-dimensional（3D） interconnected mesoporous anatase TiO2-SiO2 nanocomposite. The nanocomposite was obtained by using an ordered two-dimensional（2D） hexagonal mes...In this article, we report the preparation of a three-dimensional（3D） interconnected mesoporous anatase TiO2-SiO2 nanocomposite. The nanocomposite was obtained by using an ordered two-dimensional（2D） hexagonal mesoporous anatase 70 TiO2-30 SiO2-950 nanocomposite（crystallized at 950 °C for 2 h） as a precursor, NaO H as an etchant of SiO2 via a ＂creating mesopores in the pore walls＂ approach. Our strategy adopts mild conditions of creating pores such as diluted NaO H solution, appropriate temperature and solid/liquid ratio, etc. aiming at ensuring the integrities of mesopores architecture and anatase nanocrystals. XRD, TEM and N2 sorption techniques have been used to systematically investigate the physico-chemical properties of the nanocomposites. The results show that the intrawall mesopores are highly dense and uniform（average pore size 3.6 nm）, and highly link the initial mesochannels in a 3D manner while retaining mesostructural integrity. There is no significant change to either crystallinity or size of the anatase nanocrystals before and after creating the intrawall mesopores. The photocatalytic degradation rates of rhodamine B（RhB, 0.303 min^–1） and methylene blue（MB, 0.757 min^–1） dyes on the resultant nanocomposite are very high, which are 5.1 and 5.3 times that of the precursor; even up to 16.5 and 24.1 times that of Degussa P25 photocatalyst, respectively. These results clearly demonstrate that the 3D interconnected mesopores structure plays an overwhelming role to the increments of activities. The 3D mesoporous anatase TiO2-SiO2 nanocomposite exhibits unexpected-high degradation activities to RhB and MB in the mesoporous metal oxide-based materials reported so far. Additionally, the nanocomposite is considerably stable and reusable. We believe that this method would pave the way for the preparation of other 3D highly interconnected mesoporous metal oxide-based materials with ultra-high performance.展开更多
Texture and grain boundary character distribution of Cu interconnects with different line width for as-deposited and annealed conditions were measured by EBSD. All specimens appear mixed texture and （111） texture is...Texture and grain boundary character distribution of Cu interconnects with different line width for as-deposited and annealed conditions were measured by EBSD. All specimens appear mixed texture and （111） texture is the dominate component.As-deposited interconnects undergo the phenomenon of self-annealing at RT,in which some abnormally large grains are found. Lower aspect ratio of lines and anneal treatment procured larger grains and stronger （111） texture. Meanwhile, the intensity proportion of other textures with lower strain energy to （111） texture is decreased. As-deposited specimens reveal （111）（112？ and （111） （231） components, （111） （110） component appeared and （111） （112？ and （111） （231） components were developed during the annealing process. High angle boundaries are dominant in all specimens, boundaries with a misorientation of 55°-60° and ∑3 ones in higher proportion, followed by lower boundaries with a misorientation of 35°-40° and 29 boundaries. As the aspect ratio of lines and anneal treatment increase,there is a gradual in- crement in ∑3 boundaries and a decrease in ∑9 boundaries.展开更多
Process variations can reduce the accuracy in estimation of interconnect performance. This work presents a process variation based stochastic model and proposes an effective analytical method to estimate interconnect ...Process variations can reduce the accuracy in estimation of interconnect performance. This work presents a process variation based stochastic model and proposes an effective analytical method to estimate interconnect delay. The technique decouples the stochastic interconnect segments by an improved decoupling method. Combined with a polynomial chaos expression （PCE）, this paper applies the stochastic Galerkin method （SGM） to analyze the system response. A finite representation of interconnect delay is then obtained with the complex approximation method and the bisection method. Results from the analysis match well with those from SPICE. Moreover, the method shows good computational efficiency, as the running time is much less than the SPICE simulation＇s.展开更多
The effects of adjacent metal layers and space between metal lines on the temperature rise of multilevel ULSI interconnect lines are investigated by modeling a three-layer interconnect. The heat dissipation of various...The effects of adjacent metal layers and space between metal lines on the temperature rise of multilevel ULSI interconnect lines are investigated by modeling a three-layer interconnect. The heat dissipation of various metallization technologies concerning the metal and low-k dielectric employment is simulated in detail. The Joule heat generated in the interconnect is transferred mainly through the metal lines in each metal layer and through the path with the smallest thermal resistance in each Ield layer. The temperature rises of Al metallization are approximately pAl/pCu times higher than those of Cu metallization under the same conditions. In addition, a thermal problem in 0.13μm globe interconnects is studied for the worst case, in which there are no metal lines in the lower interconnect layers. Several types of dummy metal heat sinks are investigated and compared with regard to thermal efficiency,influence on parasitic capacitance,and optimal application by combined thermal and electrical simula- tion.展开更多
As develops in deep sub micron designs,the interconnect crosstalk becomes much more serious.Espe cially, the coupling inductance can not be ignored in gigahertz designs.So shield insertion is an efficient techniq...As develops in deep sub micron designs,the interconnect crosstalk becomes much more serious.Espe cially, the coupling inductance can not be ignored in gigahertz designs.So shield insertion is an efficient technique to reduce the inductive noise.In this paper,the characteristics of on chip mutual inductance (as well as self) for coplanar,micro stripline and stripline structures are introduced first.Then base on the coplanar interconnect structures,the effective coupling K eff model and the RLC explicit noise model are proposed respectively.The results of experiments show that these two models both have high fidelity.展开更多
The future energy policy,long-term energy supply plan,and necessity of power system interconnection are discussed considering the climate change agreement and national carbon neutrality policy.Although several studies...The future energy policy,long-term energy supply plan,and necessity of power system interconnection are discussed considering the climate change agreement and national carbon neutrality policy.Although several studies have been conducted on power system interconnection related projects,a few reviews have been performed related to the Greenhouse Gas Convention in North-East Asian(NEA)regions.Therefore,the future directions and possible scenarios on power system interconnection are studied by combining the issues by comprehensively considering carbon neutrality policy according to the perspective of Korea.展开更多
We propose an improved statistical approach for modeling interconnect slew that takes into account the scattering effect of a nanoscale wire. We first propose a simple, closed-form scattering effect resistivity model,...We propose an improved statistical approach for modeling interconnect slew that takes into account the scattering effect of a nanoscale wire. We first propose a simple, closed-form scattering effect resistivity model, considering the effects of both width and thickness. Then we use this model to derive statistical expressions of the slew metrics using the SS2M model. We find that the delay and slew can be greatly increased when considering the scattering effect. The proposed statistical SS2M model has an average error of 4.16% with respect to SPICE Monte Carlo simulations, with an average error of standard deviation of only 3.06%.展开更多
To solve the load balancing problem in a triplet-based hierarchical interconnection network（THIN） system, a dynamic load balancing （DLB）algorithm--THINDLBA, which adopts multicast tree （MT）technology to improve ...To solve the load balancing problem in a triplet-based hierarchical interconnection network（THIN） system, a dynamic load balancing （DLB）algorithm--THINDLBA, which adopts multicast tree （MT）technology to improve the efficiency of interchanging load information, is presented. To support the algorithm, a complete set of DLB messages and a schema of maintaining DLB information in each processing node are designed. The load migration request messages from the heavily loaded node （HLN）are spread along an MT whose root is the HLN. And the lightly loaded nodes（LLNs） covered by the MT are the candidate destinations of load migration; the load information interchanged between the LLNs and the HLN can be transmitted along the MT. So the HLN can migrate excess loads out as many as possible during a one time execution of the THINDLBA, and its load state can be improved as quickly as possible. To avoid wrongly transmitted or redundant DLB messages due to MT overlapping, the MT construction is restricted in the design of the THINDLBA. Through experiments, the effectiveness of four DLB algorithms are compared, and the results show that the THINDLBA can effectively decrease the time costs of THIN systems in dealing with large scale computeintensive tasks more than others.展开更多
For performance optimization such as placement,interconnect synthesis,and routing, an efficient and accurate interconnect delay metric is critical,even in design tools development like design for yield （DFY） and des...For performance optimization such as placement,interconnect synthesis,and routing, an efficient and accurate interconnect delay metric is critical,even in design tools development like design for yield （DFY） and design for manufacture （DFM）. In the nanometer regime, the recently proposed delay models for RLC interconnects based on statistical probability density function （PDF）interpretation such as PRIMO,H-gamma,WED and RLD bridge the gap between accuracy and efficiency. However, these models always require table look-up when operating. In this paper, a novel delay model based on the Birnbaum-Saunders distribution （BSD） is presented. BSD can accomplish interconnect delay estimation fast and accurately without table look-up operations. Furthermore, it only needs the first two moments to match. Experimental results in 90nm technology show that BSD is robust, easy to implement,efficient,and accurate.展开更多
文摘Industrial intelligence and secure interconnection serve as the foundational platform and critical information infrastructure for new industrialization,carrying significant strategic importance.They not only function as the core engine driving the transformation and upgrading of the manufacturing sector and ensuring stable socioeconomic operation but are also vital to enhancing national technological competitiveness and safeguarding industrial security.
基金supported by National Key Research and Development Program of China(No.2023YFB2704200)Beijing Natural Science Foundation(No.4254064).
文摘With the rapid development of network technologies,a large number of deployed edge devices and information systems generate massive amounts of data which provide good support for the advancement of data-driven intelligent models.However,these data often contain sensitive information of users.Federated learning(FL),as a privacy preservation machine learning setting,allows users to obtain a well-trained model without sending the privacy-sensitive local data to the central server.Despite the promising prospect of FL,several significant research challenges need to be addressed before widespread deployment,including network resource allocation,model security,model convergence,etc.In this paper,we first provide a brief survey on some of these works that have been done on FL and discuss the motivations of the Communication Networks(CNs)and FL to mutually enable each other.We analyze the support of network technologies for FL,which requires frequent communication and emphasizes security,as well as the studies on the intelligence of many network scenarios and the improvement of network performance and security by the methods based on FL.At last,some challenges and broader perspectives are explored.
基金supported by the National Natural Science Foundation of China(Nos.42177124 and 41877277)Open Research Fund of State Key Laboratory of Geomechanics and Geotechnical Engineering,Institute of Rock and Soil Mechanics,Chinese Academy of Sciences(No.SKLGME022011)+2 种基金Fundamental Research Funds for the Central Universities(No.2024KYJD1011)Frontier Technologies R&D Program of Jiangsu(No.BF2024056)the Graduate Innovation Program of China University of Mining and Technology(No.KYCX25_3085)。
文摘Salt deposits in China predominantly originate from lake deposits,characterized by thin salt beds interspersed with numerous interlayers,collectively termed bedded salt formations.Historically,the solution mining practices have adopted the layered solution mining approach,inspired by coal mining techniques.However,this approach fails to account for the unique challenges of salt solution mining.Practical implementation is inefficient,costs escalate post-construction,and cavern geometry is constrained by salt beds thickness.Additionally,resource loss in abandoned beds and stability risks in adjacent mining zones remain unresolved.This study investigates mining scheme selection for low-grade salt deposits in Huai'an Salt Basin,introducing a continuous solution mining method that traverses multiple interlayers.Through comprehensive analysis of plastic deformation in caverns and surrounding rock,volume shrinkage rates,and economic costs comparing continuous and layered solution mining approaches,the results demonstrate that:(1)In the layered solution mining with horizontal interconnected wells scheme,plastic deformation zones propagate unevenly,posing interlayer connectivity risks.Concurrently,roof subsidence and floor heave destabilize the structure;(2)the continuous solution mining with horizontal interconnected wells scheme reduces plastic deformation zones to 3.4%of cavern volume,with volumetric shrinkage below 17%,markedly improving stability;(3)Economically,the continuous solution mining scheme generates caverns 2.43 times larger than the layered solution mining,slashing unit volume costs to 41.1%while enhancing resource recovery and long-term viability.The continuous method demonstrates distinct economic advantages and achieves higher resource utilization efficiency in solution mining compared to layered mining.Furthermore,its superior cavern stability presents strong potential for large-scale implementation.
基金financially supported by National Natural Science Foundation of China(No.U2241223)Pre-Research Foundation of China(No.909010203-202).
文摘Nano-twinned copper(nt-Cu),with a preferred orientation,is highly promising as interconnect materials in high-density advanced packaging due to its considerable mechanical strength,excellent electrical conductivity,and resistance to thermal migration.However,its application is impeded by sulfur-containing byproducts from the electroplating process,exacerbating the formation of Kirkendall voids within solder joints during thermal aging.Herein,through the incorporation of Zinc(Zn)into the nt-Cu layer,we develop a nt-Cu/Zn composite structure.Our findings provide the first definitive confirmation of the mechanism by which sulfur atoms migrate to the Cu_(3)Sn/nt-Cu interface through interstitial diffusion,thereby reducing the activation energy for vacancy formation.We further demonstrate that Zn effectively an-choring sulfur atoms,forming ZnS within the nt-Cu layer during heat treatment,which increases the vacancy formation energy and inhibits the development of Kirkendall voids.Remarkably,no Kirkendall voids are observed in the modified interconnects even after prolonged aging at 150℃ for 1000 h.The nt-Cu/Zn composite metallization layers significantly decrease the growth rate of interfacial intermetallic compounds by 33.6% and enhance the shear strength of solder interconnections to 228.9%.This research underscores the potential of nt-Cu in advanced electronic packaging,offering new pathways for improving the power density and reliability of electronic devices.
基金supported by the National Science Foundation of China under the Grant Nos.12127806 and 62175195the International Joint Research Laboratory for Micro/Nano Manufacturing and Measurement Technologies。
文摘High-density interconnect(HDI)soft electronics that can integrate multiple individual functions into one miniaturized monolithic system is promising for applications related to smart healthcare,soft robotics,and human-machine interactions.However,despite the recent advances,the development of three-dimensional(3D)soft electronics with both high resolution and high integration is still challenging because of the lack of efficient manufacturing methods to guarantee interlayer alignment of the high-density vias and reliable interlayer electrical conductivity.Here,an advanced 3D laser printing pathway,based on femtosecond laser direct writing(FLDW),is demonstrated for preparing liquid metal(LM)-based any layer HDI soft electronics.FLDW technology,with the characteristics of high spatial resolution and high precision,allows the maskless fabrication of high-resolution embedded LM microchannels and high-density vertical interconnect accesses for 3D integrated circuits.High-aspect-ratio blind/through LM microstructures are formed inside the elastomer due to the supermetalphobicity induced during laser ablation.The LM-based HDI circuit featuring high resolution(~1.5μm)and high integration(10-layer electrical interconnection)is achieved for customized soft electronics,including various customized multilayer passive electric components,soft multilayer circuit,and cross-scale multimode sensors.The 3D laser printing method provides a versatile approach for developing chip-level soft electronics.
基金supported by the National Natural Science Foundation of China(Grant Nos.62405250 and 62471404)the China Postdoctoral Science Foundation(Grant No.2024M762955)+1 种基金the Key Project of Westlake Institute for Optoelectronics(Grant No.2023GD003)the Optical Com-munication and Sensing Laboratory,School of Engineering,Westlake University.
文摘Propelled by the rise of artificial intelligence,cloud services,and data center applications,next-generation,low-power,local-oscillator-less,digital signal processing(DSP)-free,and short-reach coherent optical communication has evolved into an increasingly prominent area of research in recent years.Here,we demonstrate DSP-free coherent optical transmission by analog signal processing in frequency synchronous optical network(FSON)architecture,which supports polarization multiplexing and higher-order modulation formats.The FSON architecture that allows the numerous laser sources of optical transceivers within a data center can be quasi-synchronized by means of a tree-distributed homology architecture.In conjunction with our proposed pilot-tone assisted Costas loop for an analog coherent receiver,we achieve a record dual-polarization 224-Gb/s 16-QAM 5-km mismatch transmission with reset-free carrier phase recovery in the optical domain.Our proposed DSP-free analog coherent detection system based on the FSON makes it a promising solution for next-generation,low-power,and high-capacity coherent data center interconnects.
基金supported by the National Natural Science Foundation of China(72271213)the Shenzhen Science and Technology Program(JCYJ20220530143800001 and RCYX20221008092927070)+1 种基金the Guangdong Basic and Applied Basic Research Foundation(2024A1515240024)the National Key Research and Development Program of China(2022YFB2403500).
文摘Interconnection planning involving bi-directional converters(BdCs)is crucial for enhancing the reliability and robustness of hybrid alternating current(AC)/direct current(DC)microgrid clusters with high penetrations of renewable energy resources(RESs).However,challenges such as the non-convex nature of BdC efficiency and renewable energy uncertainty complicate the planning process.To address these issues,this paper proposes a tri-level BdC-based planning framework that incorporates dynamic BdC efficiency and a data-correlated uncertainty set(DcUS)derived from historical data patterns.The proposed framework employs a least-squares approximation to linearize BdC efficiency and constructs the DcUS to balance computational efficiency and solution robustness.Additionally,a fully parallel column and constraint generation algorithm is developed to solve the model efficiently.Numerical simulations on a practical hybrid AC/DC microgrid system demonstrate that the proposed method reduces interconnection costs by up to 21.8%compared to conventional uncertainty sets while ensuring robust operation under all considered scenarios.These results highlight the computational efficiency,robustness,and practicality of the proposed approach,making it a promising solution for modern power systems.
基金support of the National Key Research and Development Program of China(Grant No.2023YFB4202503)Tianjin Science and Technology Project(Grant No.24ZXZSSS00120)+4 种基金the Joint Funds of the National Natural Science Foundation of China(Grant No.U21A2072)Yunnan Provincial Science and Technology Project at Southwest United Graduate School(Grant No.202302A0370009)the Overseas Expertise Introduction Project for Discipline Innovation of Higher Education of China(Grant No.B16027)the project of high-efficiency heterojunction solar cell technology and equipment industrialization(Grant No.TC220A04A-159)TCL science and technology innovation fund.Financial support was provided by the Haihe Laboratory of Sustainable Chemical Transformations,and the Fundamental Research Funds for the Central Universities,Nankai University.
文摘As the development of single-junction solar cells reaches a bottleneck,tandem solar cells have emerged as a critical pathway to further enhance power conversion efficiency.Among them,monolithic perovskite/silicon heterojunction tandem solar cells are currently the fastest-growing technology,achieving the highest efficiencies at relatively low costs.The intercon-necting layer,which connects the two sub-cells,plays a crucial role in tandem cell performance.It collects electrons and holes from the respective sub-cells and facilitates recombination and tunneling at the interface.Therefore,the properties of the inter-connecting layer are pivotal to the overall device performance.In this work,we applied statistical analysis and machine learn-ing algorithms to systematically analyze the interconnecting layer.A comprehensive dataset on interconnecting layer parame-ters was established,and predictive modeling was performed using Lasso linear regression,random forest,and multilayer per-ceptron(a type of neural network).The analysis revealed key feature importance for experimental parameters,providing valu-able insights into the application of interconnecting layers in perovskite/silicon heterojunction tandem solar cells.The final opti-mized interconnecting layer can achieve a proof-of-concept efficiency of 38.17%,providing guidance and direction for the devel-opment of monolithic perovskite/silicon tandem solar cells.
基金supported in part by an International Research Partnership“Electrical Engineering-Thai French Research Center(EE-TFRC)”under the project framework of the Lorraine Universite´d’Excellence(LUE)in cooperation between Universite´de Lorraine(France)and King Mongkut’s University of Technology North Bangkok(year 2021-2024/2025-28)by the National Research Council of Thailand(NRCT)under Research Team Promotion Grant(Senior Research Scholar Program)under Grant No.N42A 680561by the NSRF via the Program Management Unit for Human Resources&Institutional Development,Research and Innovation under Research project Grant No.B41G680025.
文摘Permanent Magnet Synchronous Motors(PMSMs)are widely employed in high-performance drive applications due to their superior efficiency and dynamic capabilities.However,their control remains challenging owing to nonlinear dynamics,parameter variations,and unmeasurable external disturbances,particularly load torquefluctuations.This study proposes an enhanced Interconnection and Damp-ing Assignment Passivity-Based Control(IDA-PBC)scheme,formulated within the port-controlled Hamiltonian(PCH)framework,to address these limitations.A nonlinear disturbance observer is embedded to estimate and compensate,in real time,for lumped mis-matched disturbances arising from parameter uncertainties and external loads.Additionally,aflatness-based control strategy is employed to generate the desired current references within the nonlinear drive system,ensuring accurate tracking of time-varying speed commands.This integrated approach preserves the system’s energy-based structure,enabling systematic stability analysis while enhancing robustness.The proposed control architecture also maintains low complexity with a limited number of tunable parameters,facilitating practical implementation.Simulation and experimental results under various operating conditions demonstrate the effectiveness and robustness of the proposed method.Comparative analysis with conventional proportional-integral(PI)control and standard IDA-PBC strategies confirms its capability to handle disturbances and maintain dynamic performance.
基金Project supported by the National Key Research and Development Program of China (2021YFB4001400)。
文摘This study focused on meeting the stringent stability requirements of tubular segmented-in-series solid oxide fuel cells(SOFCs) in reducing and oxidizing atmospheres.To address this challenge,a bi-layer perovskite ceramic interconnect was designed by controlling the oxygen partial pressure,because of the strong correlation between the conductivity of strontium-doped lanthanum titanate(LST) and the oxygen partial pressure.The LST powder was prepared using solid-phase and sol-gel methods,and their influence on particle size and sintering behavior was compared.LST/lanthanum strontium manganite(LSM) bi-layer ceramic interconnects with varying thicknesses were fabricated through screen printing and co-sintering.The results demonstrate favorable interfacial bonding and excellent chemical compatibility between the ceramic layers.The conductivity of the bi-layer interconnect exhibits a temperature-dependent behavior,peaking at 550℃.Simulation calculations and research findings validate that the co nductivity of the bi-layer interconnect is determined by the thickness of the LSM layer and the oxygen partial pressure at the interconnect interface.Optimal conductivity is achieved with a bilayer interconnect consisting of approximately 15 μm of LST and 4 μm of LSM.This can be attributed to the efficient regulation of oxygen partial pressure at the interface,effectively mitigating LSM decomposition caused by low oxygen partial pressure and the subsequent reduction in conductivity.These results provide valuable fundamental data and methodology for the development of high-performance interconnects for tubular segmented-in-series SOFCs.
基金Supported by the Guangdong Provincial Natural Science Foundation of China(2014A030313441)the Guangzhou Science and Technology Project(201510010169)+1 种基金the Guangdong Province Science and Technology Project(2016B090918071,2014A040401076)the National Natural Science Foundation of China(61072028)
文摘The interconnect temperature of very large scale integration（VLSI） circuits keeps rising due to self-heating and substrate temperature, which can increase the delay and power dissipation of interconnect wires. The thermal vias are regarded as a promising method to improve the temperature performance of VLSI circuits. In this paper, the extra thermal vias were used to decrease the delay and power dissipation of interconnect wires of VLSI circuits. Two analytical models were presented for interconnect temperature, delay and power dissipation with adding extra dummy thermal vias. The influence of the number of thermal vias on the delay and power dissipation of interconnect wires was analyzed and the optimal via separation distance was investigated. The experimental results show that the adding extra dummy thermal vias can reduce the interconnect average temperature, maximum temperature, delay and power dissipation. Moreover, this method is also suitable for clock signal wires with a large root mean square current.
基金supported by the National Natural Science Foundation of China(21373056)the Science and Technology Commission of Shanghai Municipality(13DZ2275200)~~
文摘In this article, we report the preparation of a three-dimensional（3D） interconnected mesoporous anatase TiO2-SiO2 nanocomposite. The nanocomposite was obtained by using an ordered two-dimensional（2D） hexagonal mesoporous anatase 70 TiO2-30 SiO2-950 nanocomposite（crystallized at 950 °C for 2 h） as a precursor, NaO H as an etchant of SiO2 via a ＂creating mesopores in the pore walls＂ approach. Our strategy adopts mild conditions of creating pores such as diluted NaO H solution, appropriate temperature and solid/liquid ratio, etc. aiming at ensuring the integrities of mesopores architecture and anatase nanocrystals. XRD, TEM and N2 sorption techniques have been used to systematically investigate the physico-chemical properties of the nanocomposites. The results show that the intrawall mesopores are highly dense and uniform（average pore size 3.6 nm）, and highly link the initial mesochannels in a 3D manner while retaining mesostructural integrity. There is no significant change to either crystallinity or size of the anatase nanocrystals before and after creating the intrawall mesopores. The photocatalytic degradation rates of rhodamine B（RhB, 0.303 min^–1） and methylene blue（MB, 0.757 min^–1） dyes on the resultant nanocomposite are very high, which are 5.1 and 5.3 times that of the precursor; even up to 16.5 and 24.1 times that of Degussa P25 photocatalyst, respectively. These results clearly demonstrate that the 3D interconnected mesopores structure plays an overwhelming role to the increments of activities. The 3D mesoporous anatase TiO2-SiO2 nanocomposite exhibits unexpected-high degradation activities to RhB and MB in the mesoporous metal oxide-based materials reported so far. Additionally, the nanocomposite is considerably stable and reusable. We believe that this method would pave the way for the preparation of other 3D highly interconnected mesoporous metal oxide-based materials with ultra-high performance.
文摘Texture and grain boundary character distribution of Cu interconnects with different line width for as-deposited and annealed conditions were measured by EBSD. All specimens appear mixed texture and （111） texture is the dominate component.As-deposited interconnects undergo the phenomenon of self-annealing at RT,in which some abnormally large grains are found. Lower aspect ratio of lines and anneal treatment procured larger grains and stronger （111） texture. Meanwhile, the intensity proportion of other textures with lower strain energy to （111） texture is decreased. As-deposited specimens reveal （111）（112？ and （111） （231） components, （111） （110） component appeared and （111） （112？ and （111） （231） components were developed during the annealing process. High angle boundaries are dominant in all specimens, boundaries with a misorientation of 55°-60° and ∑3 ones in higher proportion, followed by lower boundaries with a misorientation of 35°-40° and 29 boundaries. As the aspect ratio of lines and anneal treatment increase,there is a gradual in- crement in ∑3 boundaries and a decrease in ∑9 boundaries.
文摘Process variations can reduce the accuracy in estimation of interconnect performance. This work presents a process variation based stochastic model and proposes an effective analytical method to estimate interconnect delay. The technique decouples the stochastic interconnect segments by an improved decoupling method. Combined with a polynomial chaos expression （PCE）, this paper applies the stochastic Galerkin method （SGM） to analyze the system response. A finite representation of interconnect delay is then obtained with the complex approximation method and the bisection method. Results from the analysis match well with those from SPICE. Moreover, the method shows good computational efficiency, as the running time is much less than the SPICE simulation＇s.
文摘The effects of adjacent metal layers and space between metal lines on the temperature rise of multilevel ULSI interconnect lines are investigated by modeling a three-layer interconnect. The heat dissipation of various metallization technologies concerning the metal and low-k dielectric employment is simulated in detail. The Joule heat generated in the interconnect is transferred mainly through the metal lines in each metal layer and through the path with the smallest thermal resistance in each Ield layer. The temperature rises of Al metallization are approximately pAl/pCu times higher than those of Cu metallization under the same conditions. In addition, a thermal problem in 0.13μm globe interconnects is studied for the worst case, in which there are no metal lines in the lower interconnect layers. Several types of dummy metal heat sinks are investigated and compared with regard to thermal efficiency,influence on parasitic capacitance,and optimal application by combined thermal and electrical simula- tion.
文摘As develops in deep sub micron designs,the interconnect crosstalk becomes much more serious.Espe cially, the coupling inductance can not be ignored in gigahertz designs.So shield insertion is an efficient technique to reduce the inductive noise.In this paper,the characteristics of on chip mutual inductance (as well as self) for coplanar,micro stripline and stripline structures are introduced first.Then base on the coplanar interconnect structures,the effective coupling K eff model and the RLC explicit noise model are proposed respectively.The results of experiments show that these two models both have high fidelity.
文摘The future energy policy,long-term energy supply plan,and necessity of power system interconnection are discussed considering the climate change agreement and national carbon neutrality policy.Although several studies have been conducted on power system interconnection related projects,a few reviews have been performed related to the Greenhouse Gas Convention in North-East Asian(NEA)regions.Therefore,the future directions and possible scenarios on power system interconnection are studied by combining the issues by comprehensively considering carbon neutrality policy according to the perspective of Korea.
基金Project supported by the National Natural Science Foundation of China(No.90307017)
文摘We propose an improved statistical approach for modeling interconnect slew that takes into account the scattering effect of a nanoscale wire. We first propose a simple, closed-form scattering effect resistivity model, considering the effects of both width and thickness. Then we use this model to derive statistical expressions of the slew metrics using the SS2M model. We find that the delay and slew can be greatly increased when considering the scattering effect. The proposed statistical SS2M model has an average error of 4.16% with respect to SPICE Monte Carlo simulations, with an average error of standard deviation of only 3.06%.
基金The National Natural Science Foundation of China(No.69973007).
文摘To solve the load balancing problem in a triplet-based hierarchical interconnection network（THIN） system, a dynamic load balancing （DLB）algorithm--THINDLBA, which adopts multicast tree （MT）technology to improve the efficiency of interchanging load information, is presented. To support the algorithm, a complete set of DLB messages and a schema of maintaining DLB information in each processing node are designed. The load migration request messages from the heavily loaded node （HLN）are spread along an MT whose root is the HLN. And the lightly loaded nodes（LLNs） covered by the MT are the candidate destinations of load migration; the load information interchanged between the LLNs and the HLN can be transmitted along the MT. So the HLN can migrate excess loads out as many as possible during a one time execution of the THINDLBA, and its load state can be improved as quickly as possible. To avoid wrongly transmitted or redundant DLB messages due to MT overlapping, the MT construction is restricted in the design of the THINDLBA. Through experiments, the effectiveness of four DLB algorithms are compared, and the results show that the THINDLBA can effectively decrease the time costs of THIN systems in dealing with large scale computeintensive tasks more than others.
文摘For performance optimization such as placement,interconnect synthesis,and routing, an efficient and accurate interconnect delay metric is critical,even in design tools development like design for yield （DFY） and design for manufacture （DFM）. In the nanometer regime, the recently proposed delay models for RLC interconnects based on statistical probability density function （PDF）interpretation such as PRIMO,H-gamma,WED and RLD bridge the gap between accuracy and efficiency. However, these models always require table look-up when operating. In this paper, a novel delay model based on the Birnbaum-Saunders distribution （BSD） is presented. BSD can accomplish interconnect delay estimation fast and accurately without table look-up operations. Furthermore, it only needs the first two moments to match. Experimental results in 90nm technology show that BSD is robust, easy to implement,efficient,and accurate.
