This essay explores the intersection of AI-driven tools like DeepSeek and its impact on academic assessments in accounting education.Using the Management Accounting course as an example,this research examines how AI t...This essay explores the intersection of AI-driven tools like DeepSeek and its impact on academic assessments in accounting education.Using the Management Accounting course as an example,this research examines how AI technologies are influencing the nature of student assessments,particularly in terms of their effectiveness and accuracy.The study also investigates how DeepSeek serves as both an educational aid and a potential threat to traditional accounting assessment methods.By analyzing multiple choice questions(MCQs)from 22'-23',the second semester's final exam performance for the Management Accounting course,the research evaluates the Al's ability to solve numerical and narrative-based questions correctly,comparing its performance against traditional student responses.Findings suggest that while AI can achieve high performance on simpler tasks,it struggles with complex accounting concepts that require critical thinking and deeper understanding.Furthermore,the paper discusses the implications of these findings for both lecturers and students,highlighting the need for a balance between technological innovation and traditional academic integrity.Ultimately,it calls for a re-evaluation of assessment frameworks to incorporate AI as a tool for learning enhancement while safeguarding against misuse in academic environments.展开更多
Three-dimensional(3D)vertical architecture transistors represent an important technological pursuit,which have distinct advantages in device integration density,operation speed,and power consumption.However,the fabric...Three-dimensional(3D)vertical architecture transistors represent an important technological pursuit,which have distinct advantages in device integration density,operation speed,and power consumption.However,the fabrication processes of such 3D devices are complex,especially in the interconnection of electrodes.In this paper,we present a novel method which combines suspended electrodes and focused ion beam(FIB)technology to greatly simplify the electrodes interconnection in 3D devices.Based on this method,we fabricate 3D vertical core-double shell structure transistors with ZnO channel and Al_(2)O_(3) gate-oxide both grown by atomic layer deposition.Suspended top electrodes of vertical architecture could be directly connected to planar electrodes by FIB deposited Pt nanowires,which avoid cumbersome steps in the traditional 3D structure fabrication technology.Both single pillar and arrays devices show well behaved transfer characteristics with an Ion/Ioff current ratio greater than 106 and a low threshold voltage around 0 V.The ON-current of the 2×2 pillars vertical channel transistor was 1.2μA at the gate voltage of 3 V and drain voltage of 2 V,which can be also improved by increasing the number of pillars.Our method for fabricating vertical architecture transistors can be promising for device applications with high integration density and low power consumption.展开更多
文摘This essay explores the intersection of AI-driven tools like DeepSeek and its impact on academic assessments in accounting education.Using the Management Accounting course as an example,this research examines how AI technologies are influencing the nature of student assessments,particularly in terms of their effectiveness and accuracy.The study also investigates how DeepSeek serves as both an educational aid and a potential threat to traditional accounting assessment methods.By analyzing multiple choice questions(MCQs)from 22'-23',the second semester's final exam performance for the Management Accounting course,the research evaluates the Al's ability to solve numerical and narrative-based questions correctly,comparing its performance against traditional student responses.Findings suggest that while AI can achieve high performance on simpler tasks,it struggles with complex accounting concepts that require critical thinking and deeper understanding.Furthermore,the paper discusses the implications of these findings for both lecturers and students,highlighting the need for a balance between technological innovation and traditional academic integrity.Ultimately,it calls for a re-evaluation of assessment frameworks to incorporate AI as a tool for learning enhancement while safeguarding against misuse in academic environments.
基金the National Key Research and Development Program of China(Grant Nos.2016YFA0200400 and 2016YFA0200800)the National Natural Science Foundation of China(Grant Nos.61888102,12074420,and 11674387)+1 种基金Strategic Priority Research Program of the Chinese Academy of Sciences(Grant No.XDB33000000)Key Research Program of Frontier Sciences,Chinese Acdemy of Sciences(Grant No.QYZDJ-SSWSLH042).
文摘Three-dimensional(3D)vertical architecture transistors represent an important technological pursuit,which have distinct advantages in device integration density,operation speed,and power consumption.However,the fabrication processes of such 3D devices are complex,especially in the interconnection of electrodes.In this paper,we present a novel method which combines suspended electrodes and focused ion beam(FIB)technology to greatly simplify the electrodes interconnection in 3D devices.Based on this method,we fabricate 3D vertical core-double shell structure transistors with ZnO channel and Al_(2)O_(3) gate-oxide both grown by atomic layer deposition.Suspended top electrodes of vertical architecture could be directly connected to planar electrodes by FIB deposited Pt nanowires,which avoid cumbersome steps in the traditional 3D structure fabrication technology.Both single pillar and arrays devices show well behaved transfer characteristics with an Ion/Ioff current ratio greater than 106 and a low threshold voltage around 0 V.The ON-current of the 2×2 pillars vertical channel transistor was 1.2μA at the gate voltage of 3 V and drain voltage of 2 V,which can be also improved by increasing the number of pillars.Our method for fabricating vertical architecture transistors can be promising for device applications with high integration density and low power consumption.
