Improved Resin Transfer Molding (RTM) technology and equipment were established.Void content and morphology of the 3-D braided preform/phenolic composite were investigated using different RTM processes.The results sho...Improved Resin Transfer Molding (RTM) technology and equipment were established.Void content and morphology of the 3-D braided preform/phenolic composite were investigated using different RTM processes.The results showed that void content of the vacuum and compression co-assisted RTM process was the lowest.Void morphologies of the specimen cross-section were analyzed with metallographic microscope.In traditional RTM process,the crack of cross-section was in evidence.In vacuum assisted RTM process,the void shape was divided into three categories:irregular crack,triangle,rotundity and ellipse.The most voids distributed in resin rich areas and were observed as large void based on equivalent diameter.In compression assisted RTM,vacuum and compression co-assisted RTM process,the polygonal voids mostly existed inter tows.Void size was mainly intermediate and small based equivalent diameter separately.展开更多
Based on the statistical model for the tensile statistical strength of unidirectional composite materials and the stress analysis of 3-D braided composites, a new method is proposed to calculate the tensile statistica...Based on the statistical model for the tensile statistical strength of unidirectional composite materials and the stress analysis of 3-D braided composites, a new method is proposed to calculate the tensile statistical strength of the 3-D braided compos- ites. With this method, the strength of 3-D braided composites can be calculated with very large accuracy, and the statistical parameters of 3-D braided composites can be determined. The numerical result shows that the tensile statistical strength of 3-D braided composites can be predicted using this method.展开更多
The yarn architecture of 3-D braided composites products by the four-step 1×1 braiding technique has been studied by means of a control volume method in conjunction with experimental investigation and a numerical...The yarn architecture of 3-D braided composites products by the four-step 1×1 braiding technique has been studied by means of a control volume method in conjunction with experimental investigation and a numerical method, respectively. An ellipse assumption for the cross-section of yarn was proposed in this analysis method with considering the yarn size and yarn-packing factor. Two types of local unit cell structures were identified for 4-step braided composites by considering the nature of the braiding processes and by observing the sample cross-sections. The relationship between the braiding procedure and the properties for 3-D braided structural shapes was established. This method provides the basis for analyzing stiffness and strength of 3-D braided composites.展开更多
This paper measured permeability of three-dimension braided preform by radial technology. The results show that principal permeability tensor coincided with their braiding axial direction. The software of one dimensio...This paper measured permeability of three-dimension braided preform by radial technology. The results show that principal permeability tensor coincided with their braiding axial direction. The software of one dimensional flow filling mold was designed using Visual C++ language. Filling time is predicted and validated. The result showed that the filling time of the mold centerline agrees with the prediction value. The filling time of the mould edge is shorter than that of the prediction. An actual plate of 3D braided preform/ modified polyarylacetylene composite is produced according to prediction value and validation analysis.展开更多
Starting with governing equations of a saturated soil with anisotropic permeability and based on multiple integral transforms, an analytical layer-element equation is established explicitly in the Laplace-Fourier tran...Starting with governing equations of a saturated soil with anisotropic permeability and based on multiple integral transforms, an analytical layer-element equation is established explicitly in the Laplace-Fourier transformed domain. A global matrix of layered soil can be obtained by assembling a set of analytical layer-elements, which is further solved in the transformed domain by considering boundary conditions. The numerical inversion of LaplaceFourier trans- form is employed to acquire the actual solution. Numerical analysis for 3-D consolidation with anisotropic permeability of a layered soil system is presented, and the influence of anisotropy of permeability on the consolidation behavior is discussed.展开更多
In recent years, with the level of science and technology progress, largely to promote the development of animation techniques. Animated film is divided into two-dimensional animation and three-dimensional animation, ...In recent years, with the level of science and technology progress, largely to promote the development of animation techniques. Animated film is divided into two-dimensional animation and three-dimensional animation, both in the retention feature animated films, based on the performance of each with different strengths, thus forming a different artistic style. Wherein the two-dimensional animation is the most common one is the most basic form of expression in animation technology is relatively mature and complete, but because of the development of animation techniques, two-dimensional animation can not meet the needs of the audience. Thus, the effective combination of two-dimensional animation and three-dimensional animation technology, the advantages of integration between the two is particularly important, so that innovation in the form of screen performance, enhance audio-visual experience. In this paper, two-dimensional animation and three-dimensional animation skills fusion analysis and research, and put forward a number of specific observations, in order to learn.展开更多
The present work deals with 12-bit Nyquist current-steering CMOS digital-to-analog converter (DAC) which is an essential part in baseband section of wireless transmitter circuits. Using oversampling ratio (OSR) for th...The present work deals with 12-bit Nyquist current-steering CMOS digital-to-analog converter (DAC) which is an essential part in baseband section of wireless transmitter circuits. Using oversampling ratio (OSR) for the proposed DAC leads to avoid use of an active analog reconstruction filter. The optimum segmentation (75%) has been used to get the best DNL and reduce glitch energy. This segmentation ratio guarantees the monotonicity. Higher performance is achieved using a new 3-D thermometer decoding method which reduces the area, power consumption and the number of control signals of the digital section. Using two digital channels in parallel, helps reach 1-GSample/s frequency. Simulation results show that the spurious- free-dynamic-range (SFDR) in Nyquist rate is better than 64 dB for sampling frequency up to 1-GSample/s. The analog voltage supply is 3.3 V while the digital part of the chip operates with only 2.4 V. Total power consumption in Nyquist rate measurement is 144.9 mW. The chip has been processed in a standard 0.35 μm CMOS technology. Active area of chip is 1.37 mm2.展开更多
As Moore’s Law approaches its limits,3-D integrated circuits(ICs)have emerged as promising alternatives to conventional scaling methodologies.However,the benefits of 3-D integration in terms of lower power consumptio...As Moore’s Law approaches its limits,3-D integrated circuits(ICs)have emerged as promising alternatives to conventional scaling methodologies.However,the benefits of 3-D integration in terms of lower power consumption,higher performance,and reduced area are accompanied by testing challenges.The unique vertical stacking of components in 3-D ICs introduces concerns related to the robustness of bonding surfaces.Moreover,immature manufacturing processes during 3-D fabrication can lead to high defect rates in different tiers.Therefore,there is a need for design-for-test solutions to ensure the reliability and performance of 3-D-integrated architectures.In this paper,we provide a comprehensive survey of existing testing strategies for 3-D ICs.We describe recent advances,including research efforts and industry practice,that address concerns related to bonding defects,elevated power supply noise,fault diagnosis,and fault localization specific to the unique characteristics of 3-D ICs.展开更多
This paper discusses use of approximations and the Integral Mean Value Theorem to show that 6 coefficients approximately describe the distortions of near surface inhomogeneities on the MT field of a horizontally layer...This paper discusses use of approximations and the Integral Mean Value Theorem to show that 6 coefficients approximately describe the distortions of near surface inhomogeneities on the MT field of a horizontally layered earth model. When these 6 coefficients are considered together with those of the magnetic field of a horizontally layered earth model,the analytic and approximate wave impedance equations can be derived for the MT response of a horizontally layered earth model with near-surface 2-D and 3-D inhomogeneities. These approximate wave impedance equations are used with inverted MT data for 2-D and 3-D forward modelling. Although these 6 coefficients cannot be determined before inversion,initial estimates can be used. The 6 coefficients and the asistivity and thickness of each layer of a horizontally layered earth can be obtained by using published inversion methods. The 6 coefficients give important informaion (depths and resistivities) on the near-surface inhomogenelties.The authors inverted 2-D and 3-D theoretical models for Fast Approximate Inversion of Magnetotelluric (FAIMT) data for a horizontally layered earth with near-surface inhomogeneities compares favorably with traditional invrsion methods, especially for inverting regional or basin structures. This method simplifies computation and gives a reasonable 1 -D geological model with fewer nonuniquenas problems.展开更多
Hierarchical art was used to solve the mixed mode placement for three dimensional （3-D） integrated circuit design. The 3-D placement flow stream includes hierarchical clustering, hierarchical 3-D floorplanning, vert...Hierarchical art was used to solve the mixed mode placement for three dimensional （3-D） integrated circuit design. The 3-D placement flow stream includes hierarchical clustering, hierarchical 3-D floorplanning, vertical via mapping, and recursive two dimensional （2-D） global/detailed placement phases. With state-of-the-art clustering and de-clustering phases, the design complexity was reduced to enhance the placement algorithm efficiency and capacity. The 3-D floorplanning phase solved the layer assignment problem and controlled the number of vertical vias. The vertical via mapping transformed the 3-D placement problem to a set of 2-D placement sub-problems, which not only simplifies the original 3-D placement problem, but also generates the vertical via assignment solution for the routing phase. The design optimizes both the wire length and the thermal load in the floorplan and placement phases to improve the performance and reliability of 3-D integrate circuits. Experiments on IBM benchmarks show that the total wire length is reduced from 15% to 35% relative to 2-D placement with two to four stacked layers, with the number of vertical vias minimized to satisfy a pre-defined upper bound constraint. The maximum temperature is reduced by 16% with two-stage optimization on four stacked layers.展开更多
Deep submicron process technology is widely being used and interconnect structures are becoming more and more complex.This means that the resistance calculation based on two-dimensional models can no longer provide su...Deep submicron process technology is widely being used and interconnect structures are becoming more and more complex.This means that the resistance calculation based on two-dimensional models can no longer provide sufficiently accurate results.This paper presents a three-dimensional resistance calculation method called the combined analytical formula and boundary element method(ABEM).The method cuts selected interconnecting lines then it calculates the resistances of straight sections using an analytical formula and the resistances of the other sections using the boundary element method(BEM).The resistances of the different sub-regions are combined to calculate the resistance of the entire region.Experiments on actual layouts show that compared with the commercial software Raphael based on finite difference method,the proposed method is 2-3 orders of magnitude faster.The ABEM method uses much less memory(about 0.1%-1%),and is more accurate than Raphael with default mesh partitions.The results illustrate that the proposed method is efficient and accurate.展开更多
INTRODUCTION The level of man-made CO_(2) emissions worldwide climbed to a new record of 30 billion tons in 2010.In 2011,at the COP17 U.N.Climate Change Conference in Durban,South Africa,high-ranking representatives f...INTRODUCTION The level of man-made CO_(2) emissions worldwide climbed to a new record of 30 billion tons in 2010.In 2011,at the COP17 U.N.Climate Change Conference in Durban,South Africa,high-ranking representatives from around the world met again to discuss solutions.For the building sector,numerous energy-efficiency market changes and benchmarking resolutions,like the mandatory E.U.“nearly Net-Zero-Energy-Building(NET-ZEB’s)2018 and 2020 regulations”for all new public and privately owned buildings are now set up to help minimizing carbon emissions and reverse the negative impact.1 In the United States,the American Institute of Architects(AIA)adopted the 2030 Challenge as a voluntary program,where participating buildings aim to achieve a 90%fossil fuel reduction by 2025,and carbon-neutrality by 2030.2 To accomplish these energy goals,designers must strive to best design and utilize the resources available on a site.However,are these goals of achieving carbon-neutral buildings possible?How can NET-ZEB’s become the curricular standard and practical routine in education and the profession?To date,the basic curricular design process components with integrated project delivery metrics for a robust 3-D/4-D-net-zero regulatory design framework are either incomplete or missing,However,formally-based curriculums have begun to weave carbon-neutral design tools into their pedagogy.This research paper critically compares how these new criteria for digital 3-D-building information modeling(BIM),and“Integrated Project Delivery”are mandating a better integration of collaborative carbon-neutral designs into the curriculum and practice of the profession.The majority of those in architectural academia have been using generative computation primarily for pure,aesthetic form-finding,without applying zero-carbon-energy-driven global performance metrics and CO_(2)e reduction strategies to reiterate derived carbon-neutral designs.The advantage of 3-D-parametric design is that it links variables,dimensions,and materials to geometry in a way that when an input or simulation value changes,the 3-D/4-D model automatically updates all life-cycle scenarios and components simultaneously.展开更多
This study presents a comprehensive thermal stress analysis of critical components in an embedded multi-die interconnect bridge(EMIB)within a chiplet package using finite element analysis(FEA).We systematically evalua...This study presents a comprehensive thermal stress analysis of critical components in an embedded multi-die interconnect bridge(EMIB)within a chiplet package using finite element analysis(FEA).We systematically evaluated key design parameters—including bump diameter-to-pitch ratios,bump distribution patterns,EMIB thickness,number of EMIBs,and aspect ratios—to assess their impact on stresses.An ABAQUS-based FEA model was used to simulate thermal loading with a 165°C temperature increase.The results indicate that a bump diameter-to-pitch ratio of 0.3 optimizes stress distribution,while a peripheral bump arrangement is superior in stress reduction compared to other patterns.Thinner EMIBs linearly reduce maximum principal stress,whereas multiple EMIBs and aspect ratio variations have minimal effects.These findings offer practical guidelines for optimizing EMIB design in chiplet packages,emphasizing the importance of bump geometry,distribution patterns,and EMIB thickness for improved reliability.展开更多
Low-k and high aspect ratio blind through-silicon-vias （TSVs） to be applied in ＂via-last/backside via＂ 3-D integration paradigm were fabricated with polyimide dielectric liners formed by vacuum-assisted spin coati...Low-k and high aspect ratio blind through-silicon-vias （TSVs） to be applied in ＂via-last/backside via＂ 3-D integration paradigm were fabricated with polyimide dielectric liners formed by vacuum-assisted spin coating technique. MIS trench capacitors with diameter of-6 μm and depth of-54 μm were successfully fabricated with polyimide insulator step coverage better than 30%. C-V characteristics and leakage current properties of the MIS trench capacitor were evaluated under thermal treat- ment. Experimental results show that, the minimum capacitance density is around 4.82 nF/cm2, and the leakage current density after 30 cycles of thermal chock tests becomes stable and it is around 30 nA/cm2 under bias voltage of 20 V. It also shows that, the polyimide dielectric liner is with an excellent capability in constraining copper ion diffusion and mobile charges even un- der test temperature as high as 125℃. Finite element analysis results show that TSVs with polyimide dielectric liner are with lower risks in SiO2 interlayer dielectric （ILD） fracture and interfacial delamination along dielectric-silicon interface, thus, higher thermo-mechanical reliability can be expected.展开更多
In this article, a new way to evaluate the quality of color images is proposed, in which the properties of human vision psychology, objective fidelity, edge information, and color distortion will be combined through u...In this article, a new way to evaluate the quality of color images is proposed, in which the properties of human vision psychology, objective fidelity, edge information, and color distortion will be combined through utilizing 3-D matrix transform. There exists color redundancy and structural similarity between three different frames of a color image, the definition of vision properties will be measured by 3-D submatrix integration transform （SIT）, in which three color components are integrated into one model and color redundancy can be exploited fully. The simulation results show that the measure index is very effective and objective in accord with vision properties.展开更多
基金Tianjin Natural Science Foundation of China(No.06YFJ MJC03100,08JCZDJC24500)
文摘Improved Resin Transfer Molding (RTM) technology and equipment were established.Void content and morphology of the 3-D braided preform/phenolic composite were investigated using different RTM processes.The results showed that void content of the vacuum and compression co-assisted RTM process was the lowest.Void morphologies of the specimen cross-section were analyzed with metallographic microscope.In traditional RTM process,the crack of cross-section was in evidence.In vacuum assisted RTM process,the void shape was divided into three categories:irregular crack,triangle,rotundity and ellipse.The most voids distributed in resin rich areas and were observed as large void based on equivalent diameter.In compression assisted RTM,vacuum and compression co-assisted RTM process,the polygonal voids mostly existed inter tows.Void size was mainly intermediate and small based equivalent diameter separately.
基金Supported by the National Natural Science Foundation of China(51075031)
文摘Based on the statistical model for the tensile statistical strength of unidirectional composite materials and the stress analysis of 3-D braided composites, a new method is proposed to calculate the tensile statistical strength of the 3-D braided compos- ites. With this method, the strength of 3-D braided composites can be calculated with very large accuracy, and the statistical parameters of 3-D braided composites can be determined. The numerical result shows that the tensile statistical strength of 3-D braided composites can be predicted using this method.
基金Aeronautical Science Foundation of China ( 99B2 3 0 0 1)
文摘The yarn architecture of 3-D braided composites products by the four-step 1×1 braiding technique has been studied by means of a control volume method in conjunction with experimental investigation and a numerical method, respectively. An ellipse assumption for the cross-section of yarn was proposed in this analysis method with considering the yarn size and yarn-packing factor. Two types of local unit cell structures were identified for 4-step braided composites by considering the nature of the braiding processes and by observing the sample cross-sections. The relationship between the braiding procedure and the properties for 3-D braided structural shapes was established. This method provides the basis for analyzing stiffness and strength of 3-D braided composites.
文摘This paper measured permeability of three-dimension braided preform by radial technology. The results show that principal permeability tensor coincided with their braiding axial direction. The software of one dimensional flow filling mold was designed using Visual C++ language. Filling time is predicted and validated. The result showed that the filling time of the mold centerline agrees with the prediction value. The filling time of the mould edge is shorter than that of the prediction. An actual plate of 3D braided preform/ modified polyarylacetylene composite is produced according to prediction value and validation analysis.
基金Project supported by the National Natural Science Foundation of China (No. 50578121)
文摘Starting with governing equations of a saturated soil with anisotropic permeability and based on multiple integral transforms, an analytical layer-element equation is established explicitly in the Laplace-Fourier transformed domain. A global matrix of layered soil can be obtained by assembling a set of analytical layer-elements, which is further solved in the transformed domain by considering boundary conditions. The numerical inversion of LaplaceFourier trans- form is employed to acquire the actual solution. Numerical analysis for 3-D consolidation with anisotropic permeability of a layered soil system is presented, and the influence of anisotropy of permeability on the consolidation behavior is discussed.
文摘In recent years, with the level of science and technology progress, largely to promote the development of animation techniques. Animated film is divided into two-dimensional animation and three-dimensional animation, both in the retention feature animated films, based on the performance of each with different strengths, thus forming a different artistic style. Wherein the two-dimensional animation is the most common one is the most basic form of expression in animation technology is relatively mature and complete, but because of the development of animation techniques, two-dimensional animation can not meet the needs of the audience. Thus, the effective combination of two-dimensional animation and three-dimensional animation technology, the advantages of integration between the two is particularly important, so that innovation in the form of screen performance, enhance audio-visual experience. In this paper, two-dimensional animation and three-dimensional animation skills fusion analysis and research, and put forward a number of specific observations, in order to learn.
文摘The present work deals with 12-bit Nyquist current-steering CMOS digital-to-analog converter (DAC) which is an essential part in baseband section of wireless transmitter circuits. Using oversampling ratio (OSR) for the proposed DAC leads to avoid use of an active analog reconstruction filter. The optimum segmentation (75%) has been used to get the best DNL and reduce glitch energy. This segmentation ratio guarantees the monotonicity. Higher performance is achieved using a new 3-D thermometer decoding method which reduces the area, power consumption and the number of control signals of the digital section. Using two digital channels in parallel, helps reach 1-GSample/s frequency. Simulation results show that the spurious- free-dynamic-range (SFDR) in Nyquist rate is better than 64 dB for sampling frequency up to 1-GSample/s. The analog voltage supply is 3.3 V while the digital part of the chip operates with only 2.4 V. Total power consumption in Nyquist rate measurement is 144.9 mW. The chip has been processed in a standard 0.35 μm CMOS technology. Active area of chip is 1.37 mm2.
基金supported in part by the National Science Foundation under Grant CCF-1908045 and Grant CCF-2309822in part by the Semiconductor Research Corporation(SRC)under Contract 2470+3 种基金in part by Intel Corporationin part by the DARPA ERI 3DSOC program under Award HR001118C0096in part by CHIMES,one of the seven centers in JUMP 2.0in part by DARPA through SRC Program.
文摘As Moore’s Law approaches its limits,3-D integrated circuits(ICs)have emerged as promising alternatives to conventional scaling methodologies.However,the benefits of 3-D integration in terms of lower power consumption,higher performance,and reduced area are accompanied by testing challenges.The unique vertical stacking of components in 3-D ICs introduces concerns related to the robustness of bonding surfaces.Moreover,immature manufacturing processes during 3-D fabrication can lead to high defect rates in different tiers.Therefore,there is a need for design-for-test solutions to ensure the reliability and performance of 3-D-integrated architectures.In this paper,we provide a comprehensive survey of existing testing strategies for 3-D ICs.We describe recent advances,including research efforts and industry practice,that address concerns related to bonding defects,elevated power supply noise,fault diagnosis,and fault localization specific to the unique characteristics of 3-D ICs.
文摘This paper discusses use of approximations and the Integral Mean Value Theorem to show that 6 coefficients approximately describe the distortions of near surface inhomogeneities on the MT field of a horizontally layered earth model. When these 6 coefficients are considered together with those of the magnetic field of a horizontally layered earth model,the analytic and approximate wave impedance equations can be derived for the MT response of a horizontally layered earth model with near-surface 2-D and 3-D inhomogeneities. These approximate wave impedance equations are used with inverted MT data for 2-D and 3-D forward modelling. Although these 6 coefficients cannot be determined before inversion,initial estimates can be used. The 6 coefficients and the asistivity and thickness of each layer of a horizontally layered earth can be obtained by using published inversion methods. The 6 coefficients give important informaion (depths and resistivities) on the near-surface inhomogenelties.The authors inverted 2-D and 3-D theoretical models for Fast Approximate Inversion of Magnetotelluric (FAIMT) data for a horizontally layered earth with near-surface inhomogeneities compares favorably with traditional invrsion methods, especially for inverting regional or basin structures. This method simplifies computation and gives a reasonable 1 -D geological model with fewer nonuniquenas problems.
基金Supported by the National Natural Science Foundation of China (Nos.60833004 and 60876026)the 3-D Floorplanning and Placement Project of the Intel Corporation
文摘Hierarchical art was used to solve the mixed mode placement for three dimensional （3-D） integrated circuit design. The 3-D placement flow stream includes hierarchical clustering, hierarchical 3-D floorplanning, vertical via mapping, and recursive two dimensional （2-D） global/detailed placement phases. With state-of-the-art clustering and de-clustering phases, the design complexity was reduced to enhance the placement algorithm efficiency and capacity. The 3-D floorplanning phase solved the layer assignment problem and controlled the number of vertical vias. The vertical via mapping transformed the 3-D placement problem to a set of 2-D placement sub-problems, which not only simplifies the original 3-D placement problem, but also generates the vertical via assignment solution for the routing phase. The design optimizes both the wire length and the thermal load in the floorplan and placement phases to improve the performance and reliability of 3-D integrate circuits. Experiments on IBM benchmarks show that the total wire length is reduced from 15% to 35% relative to 2-D placement with two to four stacked layers, with the number of vertical vias minimized to satisfy a pre-defined upper bound constraint. The maximum temperature is reduced by 16% with two-stage optimization on four stacked layers.
基金supported by National Science Foundation of China(No.90407004).
文摘Deep submicron process technology is widely being used and interconnect structures are becoming more and more complex.This means that the resistance calculation based on two-dimensional models can no longer provide sufficiently accurate results.This paper presents a three-dimensional resistance calculation method called the combined analytical formula and boundary element method(ABEM).The method cuts selected interconnecting lines then it calculates the resistances of straight sections using an analytical formula and the resistances of the other sections using the boundary element method(BEM).The resistances of the different sub-regions are combined to calculate the resistance of the entire region.Experiments on actual layouts show that compared with the commercial software Raphael based on finite difference method,the proposed method is 2-3 orders of magnitude faster.The ABEM method uses much less memory(about 0.1%-1%),and is more accurate than Raphael with default mesh partitions.The results illustrate that the proposed method is efficient and accurate.
文摘INTRODUCTION The level of man-made CO_(2) emissions worldwide climbed to a new record of 30 billion tons in 2010.In 2011,at the COP17 U.N.Climate Change Conference in Durban,South Africa,high-ranking representatives from around the world met again to discuss solutions.For the building sector,numerous energy-efficiency market changes and benchmarking resolutions,like the mandatory E.U.“nearly Net-Zero-Energy-Building(NET-ZEB’s)2018 and 2020 regulations”for all new public and privately owned buildings are now set up to help minimizing carbon emissions and reverse the negative impact.1 In the United States,the American Institute of Architects(AIA)adopted the 2030 Challenge as a voluntary program,where participating buildings aim to achieve a 90%fossil fuel reduction by 2025,and carbon-neutrality by 2030.2 To accomplish these energy goals,designers must strive to best design and utilize the resources available on a site.However,are these goals of achieving carbon-neutral buildings possible?How can NET-ZEB’s become the curricular standard and practical routine in education and the profession?To date,the basic curricular design process components with integrated project delivery metrics for a robust 3-D/4-D-net-zero regulatory design framework are either incomplete or missing,However,formally-based curriculums have begun to weave carbon-neutral design tools into their pedagogy.This research paper critically compares how these new criteria for digital 3-D-building information modeling(BIM),and“Integrated Project Delivery”are mandating a better integration of collaborative carbon-neutral designs into the curriculum and practice of the profession.The majority of those in architectural academia have been using generative computation primarily for pure,aesthetic form-finding,without applying zero-carbon-energy-driven global performance metrics and CO_(2)e reduction strategies to reiterate derived carbon-neutral designs.The advantage of 3-D-parametric design is that it links variables,dimensions,and materials to geometry in a way that when an input or simulation value changes,the 3-D/4-D model automatically updates all life-cycle scenarios and components simultaneously.
基金supported in part by the National Natural Science Foundation of China under Grant 61774044in part by the Ministry of Education(MOE)Innovation Platform.
文摘This study presents a comprehensive thermal stress analysis of critical components in an embedded multi-die interconnect bridge(EMIB)within a chiplet package using finite element analysis(FEA).We systematically evaluated key design parameters—including bump diameter-to-pitch ratios,bump distribution patterns,EMIB thickness,number of EMIBs,and aspect ratios—to assess their impact on stresses.An ABAQUS-based FEA model was used to simulate thermal loading with a 165°C temperature increase.The results indicate that a bump diameter-to-pitch ratio of 0.3 optimizes stress distribution,while a peripheral bump arrangement is superior in stress reduction compared to other patterns.Thinner EMIBs linearly reduce maximum principal stress,whereas multiple EMIBs and aspect ratio variations have minimal effects.These findings offer practical guidelines for optimizing EMIB design in chiplet packages,emphasizing the importance of bump geometry,distribution patterns,and EMIB thickness for improved reliability.
基金supported by the National Natural Science Foundation of China(Grant Nos.61404008&61574016)"111"Project of China(Grant No.B14010)
文摘Low-k and high aspect ratio blind through-silicon-vias （TSVs） to be applied in ＂via-last/backside via＂ 3-D integration paradigm were fabricated with polyimide dielectric liners formed by vacuum-assisted spin coating technique. MIS trench capacitors with diameter of-6 μm and depth of-54 μm were successfully fabricated with polyimide insulator step coverage better than 30%. C-V characteristics and leakage current properties of the MIS trench capacitor were evaluated under thermal treat- ment. Experimental results show that, the minimum capacitance density is around 4.82 nF/cm2, and the leakage current density after 30 cycles of thermal chock tests becomes stable and it is around 30 nA/cm2 under bias voltage of 20 V. It also shows that, the polyimide dielectric liner is with an excellent capability in constraining copper ion diffusion and mobile charges even un- der test temperature as high as 125℃. Finite element analysis results show that TSVs with polyimide dielectric liner are with lower risks in SiO2 interlayer dielectric （ILD） fracture and interfacial delamination along dielectric-silicon interface, thus, higher thermo-mechanical reliability can be expected.
基金This work is supported by the National Natural Science Foundation of China(60372060)by Changchun Science&Technology Project(03-037G10).
文摘In this article, a new way to evaluate the quality of color images is proposed, in which the properties of human vision psychology, objective fidelity, edge information, and color distortion will be combined through utilizing 3-D matrix transform. There exists color redundancy and structural similarity between three different frames of a color image, the definition of vision properties will be measured by 3-D submatrix integration transform （SIT）, in which three color components are integrated into one model and color redundancy can be exploited fully. The simulation results show that the measure index is very effective and objective in accord with vision properties.
