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Design of Ku Band 64 Channel Tile Type Transceiver Component
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作者 Wenyi Xiong Taifu Zhou Xianglou Chen 《Journal of Computer and Communications》 2024年第12期332-341,共10页
Based on the high integration and low profile application requirements of phased array systems, a Ku band 64-element tile type transceiver component was developed. Through the high-density integrated 3D design concept... Based on the high integration and low profile application requirements of phased array systems, a Ku band 64-element tile type transceiver component was developed. Through the high-density integrated 3D design concept, the 64-element transceiver channels are arranged in a rectangular grid array, and the functional circuits are horizontally arranged and vertically integrated, achieving the low profile characteristics of the components. Detailed introductions were provided on the key circuit design, structural design, and thermal design of the components. Through physical testing, the single channel receiving gain of the transceiver component is ≥6 dB, and the noise figure is ≤3.5 dB;Single channel transmission gain ≥ 4 dB, transmission saturation output power ≥ 22 dBm;Each channel can independently achieve 6-bit phase shift and 4-bit attenuation functions. The phase consistency of 64 channels is better than 7°, and the amplitude consistency is better than 0.6 dB. The component size is 100 mm × 84 mm × 13.1 mm, with a mass of less than 150 g. This transceiver component has a standardized architecture and can flexibly achieve large-scale array expansion. 展开更多
关键词 Ku Band Tile Tyle Sending and Receiving Components high density integration
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Bi-CMOS技术进展(下) 被引量:2
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作者 沈文正 《微电子学》 CAS 1988年第5期14-18,共5页
三、Bi-CMOS模拟/数字电路 随着电子系统复杂性的增加以及对可靠性要求的提高,过去那种将模拟电路和数字电路通过PC板互连起来的方法已经不适应。因此,实现A/D LSI已经成为人们追求的目标。这种芯片不仅在数字通讯、测量仪器、图像处理... 三、Bi-CMOS模拟/数字电路 随着电子系统复杂性的增加以及对可靠性要求的提高,过去那种将模拟电路和数字电路通过PC板互连起来的方法已经不适应。因此,实现A/D LSI已经成为人们追求的目标。这种芯片不仅在数字通讯、测量仪器、图像处理等方面有广泛用途,而且在民用领域,如照像机的自动曝光、录相机的自动聚焦、马达控制、声音的合成和识别等方面也有广阔的市场。 展开更多
关键词 Bi-CMOS Bipolar device CMOS device high density integration Silicon integrated circuits
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Ka-Band CTDRSS Terminal Technology for Meeting the Needs of Launch Vehicle TT&C
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作者 LIAO Yanjie SONG Rui +2 位作者 GONG Changhui ZHANG Siyan ZHOU Lin 《Aerospace China》 2021年第2期35-41,共7页
To meet the application requirements for a Ka-band space-based TT&C terminal for a launch vehicle,this paper proposes the implementation scheme of a space-based TT&C terminal,analyzes and solves the miniaturiz... To meet the application requirements for a Ka-band space-based TT&C terminal for a launch vehicle,this paper proposes the implementation scheme of a space-based TT&C terminal,analyzes and solves the miniaturized design of equipment and the key technology for high-efficiency heat dissipation.The phased array antenna test shows that without external heat dissipation measures,the phased array antenna can work for a long time to meet the working requirements of launch vehicle,which has been verified in the LM-8 mission,and has wide engineering application prospects. 展开更多
关键词 CTDRSS relay terminal phased array antenna high density integration phase change heat storage technology
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