The oxide scale present on the feedstock particles is critical for inter-particle bond formation in the cold spray(CS)coating process,therefore,oxide scale break-up is a prerequisite for clean metallic contact which g...The oxide scale present on the feedstock particles is critical for inter-particle bond formation in the cold spray(CS)coating process,therefore,oxide scale break-up is a prerequisite for clean metallic contact which greatly improves the quality of inter-particle bonding within the deposited coating.In general,a spray powder which contains a thicker oxide scale on its surface(i.e.,powders having high oxygen content)requires a higher critical particle velocity for coating formation,which also lowers the deposition efficiency(DE)making the whole process a challenging task.In this work,it is reported for the first time that an artificially oxidized copper(Cu)powder containing a high oxygen content of 0.81 wt.%with a thick surface oxide scale of 0.71μm.,can help achieve an astonishing increment in DE.A transition of surficial oxide scale evolution starting with crack initiations followed by segmenting to peeling-off was observed during the high velocity particle impact of the particles,which helps in achieving an astounding increment in DE.Single-particle deposit observations revealed that the thick oxide scale peels off from most of the sprayed powder surfaces during the high-velocity impact,which leaves a clean metallic surface on the deposited particle.This makes the successive particles to bond easily and thus leads to a higher DE.Further,owning to the peeling-off of the oxide scale from the feedstock particles,very few discontinuous oxide scale segments are retained at inter-particle boundaries ensuring a high electrical conductivity within the resulting deposit.Dependency of the oxide scale threshold thickness for peeling-off during the high velocity particle impact was also investigated.展开更多
The growing demand for semiconductor devices simulation poses a big challenge for large-scale electronic structure calculations.Among various methods,the linearly scaling three-dimensional fragment(LS3DF)method exhibi...The growing demand for semiconductor devices simulation poses a big challenge for large-scale electronic structure calculations.Among various methods,the linearly scaling three-dimensional fragment(LS3DF)method exhibits excellent scalability in large-scale simulations.Based on algorithmic and system-level optimizations,we propose a highly scalable and highly efficient implementation of LS3DF on a domestic heterogeneous supercomputer equipped with acceler-ators.In terms of algorithmic optimizations,the original all-band conjugate gradient algorithm is refined to achieve faster convergence,and mixed precision computing is adopted to increase overall efficiency.In terms of system-level optimiza-tions,the original two-layer parallel structure is replaced by a coarse-grained parallel method.Optimization strategies such as multi-stream,kernel fusion,and redundant computation removal are proposed to increase further utilization of the com-putational power provided by the heterogeneous machines.As a result,our optimized LS3DF can scale to a 10-million sili-con atoms system,attaining a peak performance of 34.8 PFLOPS(21.2% of the peak).All the improvements can be adapt-ed to the next-generation supercomputers for larger simulations.展开更多
基金supported financially by the National Natural Science Foundation of China(No.51875443)the Guangdong Basic and Applied Basic Research Foundation(Nos.2019B1515120016 and 202002030290)+3 种基金the Shaanxi Co-Innovation Projects(No.2015KTTSGY03-03)the Shaanxi Natural Science Foundation(No.2015JQ5200)the Open Project from The Key Lab of Guangdong for Modern Surface Engineering Technologyfinancial support by Guangdong Academy of Sciences’Project of Constructing First-class Domestic Research Institutions(Nos.2019GDASYL-0503006,2020GDASYL-20200302011)。
文摘The oxide scale present on the feedstock particles is critical for inter-particle bond formation in the cold spray(CS)coating process,therefore,oxide scale break-up is a prerequisite for clean metallic contact which greatly improves the quality of inter-particle bonding within the deposited coating.In general,a spray powder which contains a thicker oxide scale on its surface(i.e.,powders having high oxygen content)requires a higher critical particle velocity for coating formation,which also lowers the deposition efficiency(DE)making the whole process a challenging task.In this work,it is reported for the first time that an artificially oxidized copper(Cu)powder containing a high oxygen content of 0.81 wt.%with a thick surface oxide scale of 0.71μm.,can help achieve an astonishing increment in DE.A transition of surficial oxide scale evolution starting with crack initiations followed by segmenting to peeling-off was observed during the high velocity particle impact of the particles,which helps in achieving an astounding increment in DE.Single-particle deposit observations revealed that the thick oxide scale peels off from most of the sprayed powder surfaces during the high-velocity impact,which leaves a clean metallic surface on the deposited particle.This makes the successive particles to bond easily and thus leads to a higher DE.Further,owning to the peeling-off of the oxide scale from the feedstock particles,very few discontinuous oxide scale segments are retained at inter-particle boundaries ensuring a high electrical conductivity within the resulting deposit.Dependency of the oxide scale threshold thickness for peeling-off during the high velocity particle impact was also investigated.
基金This work was supported by the National Key Research and Development Program of China under Grant No.2021YFB0300600the National Natural Science Foundation of China under Grant Nos.92270206,T2125013,62032023,61972377,T2293702,and 12274360+2 种基金the Chinese Academy of Sciences Project for Young Scientists in Basic Research under Grant No.YSBR-005the Network Information Project of Chinese Academy of Sciences under Grant No.CASWX2021SF-0103the Key Research Program of Chinese Academy of Sciences under Grant No.ZDBSSSW-WHC002.
文摘The growing demand for semiconductor devices simulation poses a big challenge for large-scale electronic structure calculations.Among various methods,the linearly scaling three-dimensional fragment(LS3DF)method exhibits excellent scalability in large-scale simulations.Based on algorithmic and system-level optimizations,we propose a highly scalable and highly efficient implementation of LS3DF on a domestic heterogeneous supercomputer equipped with acceler-ators.In terms of algorithmic optimizations,the original all-band conjugate gradient algorithm is refined to achieve faster convergence,and mixed precision computing is adopted to increase overall efficiency.In terms of system-level optimiza-tions,the original two-layer parallel structure is replaced by a coarse-grained parallel method.Optimization strategies such as multi-stream,kernel fusion,and redundant computation removal are proposed to increase further utilization of the com-putational power provided by the heterogeneous machines.As a result,our optimized LS3DF can scale to a 10-million sili-con atoms system,attaining a peak performance of 34.8 PFLOPS(21.2% of the peak).All the improvements can be adapt-ed to the next-generation supercomputers for larger simulations.
