This study investigates laser sintering of Cu particle-free ink(Cu formate tetrahydrate—amino-2-propanol complex)as an alternative to conventional sintering in an oven(under inert/reducing atmosphere).Utilizing benef...This study investigates laser sintering of Cu particle-free ink(Cu formate tetrahydrate—amino-2-propanol complex)as an alternative to conventional sintering in an oven(under inert/reducing atmosphere).Utilizing benefits of high-speed localized heating using laser,substrate damage can be prevented for low-melting substrates such as Polyethylene Terephthalate(PET).Firstly,a suitable sintering process window is achieved based on energy density for two different flexible polymeric susbtrates:Polyimide and PET using different laser parameters(laser power,scan rate and spot diameter).Subsequently,characterization of laser sintered traces are also made using different laser optic profiles(Gaussian and top hat).Different methodologies for fabrication of metallized Cu layer were also demonstrated.A very low bulk resistivity of 3.24µΩcm(1.87 times of bulk Cu)was achieved on trace thickness of 0.85±0.15µm exhibiting good adherence to polymeric substrates.A promising fabrication process of low-cost and reliable flexible printed electronic devices is demonstrated.展开更多
基金supported by the Bavarian Collaborative Research Program(BayVFP)of the Free State of Bavaria,Germany within the project‘ADDIRA’’under the grant number DIE-2107-005//DIE0159/01Laser facility at Liverpool John Moore University,Faculty of Engineering and Technology funded through FET Pump Prime Awards 2023/2024.
文摘This study investigates laser sintering of Cu particle-free ink(Cu formate tetrahydrate—amino-2-propanol complex)as an alternative to conventional sintering in an oven(under inert/reducing atmosphere).Utilizing benefits of high-speed localized heating using laser,substrate damage can be prevented for low-melting substrates such as Polyethylene Terephthalate(PET).Firstly,a suitable sintering process window is achieved based on energy density for two different flexible polymeric susbtrates:Polyimide and PET using different laser parameters(laser power,scan rate and spot diameter).Subsequently,characterization of laser sintered traces are also made using different laser optic profiles(Gaussian and top hat).Different methodologies for fabrication of metallized Cu layer were also demonstrated.A very low bulk resistivity of 3.24µΩcm(1.87 times of bulk Cu)was achieved on trace thickness of 0.85±0.15µm exhibiting good adherence to polymeric substrates.A promising fabrication process of low-cost and reliable flexible printed electronic devices is demonstrated.
