This study presents a low residual tensile stress,flexible thin film encapsulation with a 2 mm bending radius based on atomic layer deposition(ALD),specifically plasma-enhanced ALD(PEALD).By utilizing polydimethylsilo...This study presents a low residual tensile stress,flexible thin film encapsulation with a 2 mm bending radius based on atomic layer deposition(ALD),specifically plasma-enhanced ALD(PEALD).By utilizing polydimethylsiloxane(PDMS)to release stress during deposition,we achieved a wrinkled morphology film that reduces stress magnitude from 10^(3)to 10^(2)compared to conventional Al_(2)O_(3)films.This wrinkled film enhances optical modulation to light extraction,increasing the external quantum efficiency(EQE)of organic light-emitting diode(OLED)by up to 14.95%.The water vapor transmission rate(WVTR)is 4.49×10^(-5)g/m^(2)/day at 60℃/90%RH,and the film retains about 90%of its initial properties after 10,000 bending cycles.This work introduces a novel solution for flexible ALD encapsulation,demonstrating ultra-flexible properties while improving device efficiency.展开更多
基金supported by the Project of Science and Technology Development Plan of Jilin Province(Grant No.20230201040GX)The National Natural Science Foundation project(Grant No.62374070)Changchun Science and Technology Development Plan Project(Grant No.23JQ02)。
文摘This study presents a low residual tensile stress,flexible thin film encapsulation with a 2 mm bending radius based on atomic layer deposition(ALD),specifically plasma-enhanced ALD(PEALD).By utilizing polydimethylsiloxane(PDMS)to release stress during deposition,we achieved a wrinkled morphology film that reduces stress magnitude from 10^(3)to 10^(2)compared to conventional Al_(2)O_(3)films.This wrinkled film enhances optical modulation to light extraction,increasing the external quantum efficiency(EQE)of organic light-emitting diode(OLED)by up to 14.95%.The water vapor transmission rate(WVTR)is 4.49×10^(-5)g/m^(2)/day at 60℃/90%RH,and the film retains about 90%of its initial properties after 10,000 bending cycles.This work introduces a novel solution for flexible ALD encapsulation,demonstrating ultra-flexible properties while improving device efficiency.
