Micro/nano functional structures (MNFSs) have attracted substantial attention because of theiroutstanding performance in optical, tribological, thermal, electronic, and biomedical applications. Despite thedevelopment ...Micro/nano functional structures (MNFSs) have attracted substantial attention because of theiroutstanding performance in optical, tribological, thermal, electronic, and biomedical applications. Despite thedevelopment of various mechanical and non-mechanical machining methods, achieving the high-efficiency, high-precision fabrication of MNFS from difficult-to-cut materials remains a significant technical challenge. This reviewbegins with an introduction to typical artificial MNFSs and their stringent requirements and then provides acomprehensive survey of MNFSs, focusing on etching methods. In particular, plasma etching demonstrates notableadvantages in MNFS fabrication. However, two critical challenges persist: accurately controlling topographicalinformation during pattern transfer in plasma etching and achieving high-quality, uniform patterning masks overlarge areas. These issues are addressed by thoroughly analyzing and summarizing the modeling of plasma etchingand the simulation of feature profiles. Various hybrid etching machining (HEM) strategies, including laser andetching combined machining, cutting and etching combined machining, molding and etching combined machining,and self-assembly and etching combined machining, are categorized and compared in detail to facilitate themanufacturing of complex MNFSs. Finally, this review summarizes current deficiencies and future challenges ofHEM, laying the groundwork for further advancements in MNFS fabrication and intelligent HEM technologies.展开更多
Wu Hanming is a distinguished academician at the Chinese Academy of Engineering,renowned for his expertise in microelectronics technology,specifically integrated circuit(IC)manufacturing.He currently serves as the dea...Wu Hanming is a distinguished academician at the Chinese Academy of Engineering,renowned for his expertise in microelectronics technology,specifically integrated circuit(IC)manufacturing.He currently serves as the dean of the College of Integrated Circuits at Zhejiang University.Throughout his career,he has been at the forefront of China’s IC chip industry and has played a pivotal role in the research and development(R&D)of large-scale production process technology for seventhgeneration chips.Notably,his contributions include the successful use of a theoretical model to support the R&D of China’s first large-scale production plasma etching machine.展开更多
基金supports by the National Natural Science Foundation of China(Grant Nos.52435008,52205440,and 52205441).
文摘Micro/nano functional structures (MNFSs) have attracted substantial attention because of theiroutstanding performance in optical, tribological, thermal, electronic, and biomedical applications. Despite thedevelopment of various mechanical and non-mechanical machining methods, achieving the high-efficiency, high-precision fabrication of MNFS from difficult-to-cut materials remains a significant technical challenge. This reviewbegins with an introduction to typical artificial MNFSs and their stringent requirements and then provides acomprehensive survey of MNFSs, focusing on etching methods. In particular, plasma etching demonstrates notableadvantages in MNFS fabrication. However, two critical challenges persist: accurately controlling topographicalinformation during pattern transfer in plasma etching and achieving high-quality, uniform patterning masks overlarge areas. These issues are addressed by thoroughly analyzing and summarizing the modeling of plasma etchingand the simulation of feature profiles. Various hybrid etching machining (HEM) strategies, including laser andetching combined machining, cutting and etching combined machining, molding and etching combined machining,and self-assembly and etching combined machining, are categorized and compared in detail to facilitate themanufacturing of complex MNFSs. Finally, this review summarizes current deficiencies and future challenges ofHEM, laying the groundwork for further advancements in MNFS fabrication and intelligent HEM technologies.
文摘Wu Hanming is a distinguished academician at the Chinese Academy of Engineering,renowned for his expertise in microelectronics technology,specifically integrated circuit(IC)manufacturing.He currently serves as the dean of the College of Integrated Circuits at Zhejiang University.Throughout his career,he has been at the forefront of China’s IC chip industry and has played a pivotal role in the research and development(R&D)of large-scale production process technology for seventhgeneration chips.Notably,his contributions include the successful use of a theoretical model to support the R&D of China’s first large-scale production plasma etching machine.
