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Metallographic etching and microstructure characterization of NiCrMoV rotor steels for nuclear power 被引量:1
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作者 Peng Liu Feng-gui Lu +1 位作者 Xia Liu Yu-lai Gao 《International Journal of Minerals,Metallurgy and Materials》 SCIE EI CAS CSCD 2013年第12期1164-1169,共6页
The grain size of prior austenite has a distinct influence on the microstructure and final mechanical properties of steels. Thus, it is significant to clearly reveal the grain boundaries and therefore to precisely cha... The grain size of prior austenite has a distinct influence on the microstructure and final mechanical properties of steels. Thus, it is significant to clearly reveal the grain boundaries and therefore to precisely characterize the grain size of prior austenite. For NiCrMoV rotor steels quenched and tempered at high temperature, it is really difficult to display the grain boundaries of prior austenite clearly, which limits a further study on the correlation between the properties and the corresponding microstructure. In this paper, an effective etchant was put forward and further optimized. Experimental results indicated that this agent was effective to show the details of grain boundaries, which help analyze fatigue crack details along the propagation path. The optimized corrosion agent is successful to observe the microstructure characteristics and expected to help analyze the effect of microstructure for a further study on the mechanical properties of NiCrMoV rotor steels used in the field of nuclear power. 展开更多
关键词 METALLOGRAPHY ETCHING AUSTENITE grain size and shape etchants nuclear power plants
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Recovery of copper from simulated ammoniacal spent etchant using sterically hindered beta-diketone 被引量:4
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作者 梁文 胡慧萍 +2 位作者 付翁 叶婷 陈启元 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2011年第8期1840-1846,共7页
The solvent extraction of copper from simulated ammoniacal spent etchant with 1-(4'-dodecyl)-phenyl-3-tertiary butyl-1,3-octadione(HR) was studied,and a model of extraction isotherm was proposed and verified with... The solvent extraction of copper from simulated ammoniacal spent etchant with 1-(4'-dodecyl)-phenyl-3-tertiary butyl-1,3-octadione(HR) was studied,and a model of extraction isotherm was proposed and verified with equilibrium extraction constant.The influence of equilibration time,extractant concentration and phase ratio on the extraction of copper was studied at(298±0.5) K.For the spent etching solutions containing 112.98 g/L Cu,6 mol/L NH3 and 1 mol/L NH4+,the optimal solvent extraction condition of copper was obtained in one-stage solvent extraction at phase ratio of 5:4 with 40% HR in sulphonated kerosene for 5 min.The copper concentration in the raffinate decreased to 63.24 g/L and raffinate can be favorably recycled to the etching solution.The stripping studies were carried out with the simulated copper spent electrolyte containing 30 g/L Cu and 180 g/L H2SO4.The stripping ratio is 98.27% from the loaded organic phase after one-stage stripping at phase ratio of 1:2 at(298±0.5) K. 展开更多
关键词 spent ammoniacal etchant copper recovery solvent extraction BETA-DIKETONE
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Selective separation of copper by membrane-electro-winning and its application in etchant recycling 被引量:4
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作者 LI De-liang CHEN Ren-hua 《Journal of Central South University of Technology》 2005年第z1期94-97,共4页
A close-looped process based on the membrane separation and electrolysis is proposed to regenerate the copper etchant in-situ, recover copper on-site and reuse it. It is characterized by selective separation of copper... A close-looped process based on the membrane separation and electrolysis is proposed to regenerate the copper etchant in-situ, recover copper on-site and reuse it. It is characterized by selective separation of copper from the spent etchant, which is accomplished by the ion exchange membrane-electrowinning, and at the same time the other components useful for etching are reclaimed. The experiments show that at least 90 % of electricity efficiency for copper removal can be maintained and the optimum condition for membrane-electrowinning is: cell voltage 2 -2.5 V, operating temperature 40 - 50 ℃ and current density 500 - 1 500 A/m2. The regenerated etchant can be suc cessfully reused to etch copper after adjusting its composition to the normal range, and its recycling property is as good as that of the fresh etchant after 50 times of use-disposal-regeneration cycles. 展开更多
关键词 copper ETCHANT membrane-electrowinning(M-E) RECYCLE SELECTIVE separation
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Experimental Study on Wax Protective Coating for Wet Deep Silicon Etching Processes 被引量:1
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作者 蒋剑良 ULRICH Hilleringmann 《Journal of Beijing Institute of Technology》 EI CAS 2006年第3期306-310,共5页
In order to protect the finished structures on the front side during deep silicon wet etching processes, the wax coating for double-sided etching process on the wafer is studied to separate the aforementioned structur... In order to protect the finished structures on the front side during deep silicon wet etching processes, the wax coating for double-sided etching process on the wafer is studied to separate the aforementioned structures from the strong aqueous bases. By way of heating and vacuumization, the air bubbles are expelled from the coating to extend the protection duration. The air pressure in the sealed chamber is 0.026 7 Pa, and the temperature of the heated wafer is 300℃. Two kinds of the wax are used, and the corresponding photos of the etched wafer and the protection times are given. In 75 ℃ 10 % KOH solution, the protection duration is more than 8 h. 展开更多
关键词 deep silicon etching potassium hydroxide etchant protective coating
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Chlorine-free emission disposal of spent acid etchant in a three-compartment ceramic membrane reactor
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作者 Fanglu Yuan Lele Cui +1 位作者 Peipei Ding Wenheng Jing 《Chinese Journal of Chemical Engineering》 SCIE EI CAS CSCD 2020年第1期271-278,共8页
Electrochemical technologies for the on-site treatment of spent acid etchant have received great attention due their ease of operation and economic benefits. On the other hand, a large amount of Cl2 is generated durin... Electrochemical technologies for the on-site treatment of spent acid etchant have received great attention due their ease of operation and economic benefits. On the other hand, a large amount of Cl2 is generated during the electrolysis process, which leads to potential environmental risks. In the present work, a novel threecompartment ceramic membrane flow reactor, including a cathode chamber, an anode chamber, and a gas absorption chamber was developed. The three chambers were divided by an Al2O3 ceramic membrane and a breathable hydrophobic anode diffusion electrode(ADE). The Cl2 evolution onset potential of the ADE was increased to 1.19 V from 1.05 V of the graphite felt, effectively inhibiting the chlorine evolution reaction(CER).The anode-generated Cl2 diffused into the gas absorption chamber through the ADE and was eventually consumed by the H2O2 adsorbent. Cu could be recovered without emitting chlorine due to the special structure of reactor. The current efficiency of copper precipitation and cathode reduction from Cu2+to Cu+reached 97.7%at a working current of 150 m A. These results indicated that the novel membrane reactor had high potential for application in the copper recovery industry. 展开更多
关键词 SPENT ACID ETCHANT CHLORINE evolution reaction Anode diffusion electrode Three-compartment reactor CERAMIC membrane
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The coupling effect of slow-rate mechanical motion on the confined etching process in electrochemical mechanical micromachining 被引量:1
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作者 Lianhuan Han Yuchao Jia +6 位作者 Yongzhi Cao Zhenjiang Hu Xuesen Zhao Shusen Guo Yongda Yan Zhongqun Tian Dongping Zhan 《Science China Chemistry》 SCIE EI CAS CSCD 2018年第6期715-724,共10页
By introducing the mechanical motion into the confined etchant layer technique(CELT), we have developed a promising ultraprecision machining method, termed as electrochemical mechanical micromachining(ECMM), for produ... By introducing the mechanical motion into the confined etchant layer technique(CELT), we have developed a promising ultraprecision machining method, termed as electrochemical mechanical micromachining(ECMM), for producing both regular and irregular three dimensional(3 D) microstructures. It was found that there was a dramatic coupling effect between the confined etching process and the slow-rate mechanical motion because of the concentration distribution of electrogenerated etchant caused by the latter. In this article, the coupling effect was investigated systemically by comparing the etchant diffusion, etching depths and profiles in the non-confined and confined machining modes. A two-dimensional(2 D) numerical simulation model was proposed to analyze the diffusion variations during the ECMM process, which is well verified by the machining experiments. The results showed that, in the confined machining mode, both the machining resolution and the perpendicularity tolerance of side faces were improved effectively. Furthermore, the theoretical modeling and numerical simulations were proved valuable to optimize the technical parameters of the ECMM process. 展开更多
关键词 confined etchant layer technique electrochemical micromachining coupling effect mechanical motion confined etching
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Improvement of silicon etching resolution using the confined etchant layer technique
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作者 Zu, YB Xie, L +3 位作者 Tian, ZW Xie, ZX Mu, JQ Mao, BW 《Chinese Science Bulletin》 SCIE EI CAS 1997年第15期1318-1319,共2页
WHEN scanning electrochemical microscopy (SECM) with feedback mode is used to etchcertain surface, the etchant molecules generated at a microelectrode diffuse to the surface andreact therein with the surface species, ... WHEN scanning electrochemical microscopy (SECM) with feedback mode is used to etchcertain surface, the etchant molecules generated at a microelectrode diffuse to the surface andreact therein with the surface species, resulting in local etching pattern. It is noted that theetching resolution of SECM is dominantly determined by the size of the microelectrode.However, many experimental results have shown the significant influence of the lateral diffu-sion of etchant on the etching resolution. Therefore, a thin diffusion layer of the 展开更多
关键词 AS SECM Improvement of silicon etching resolution using the confined etchant layer technique CELT
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