In the process of electroless cobalt plating,the saccharin additive can significantly change the surface morphology,texture orientation,and conductivity of the cobalt coating layer.When the amount of saccharin was 3 m...In the process of electroless cobalt plating,the saccharin additive can significantly change the surface morphology,texture orientation,and conductivity of the cobalt coating layer.When the amount of saccharin was 3 mg·L^(-1),the cobalt coating transformed from disordered large grains to a honeycomb structure,with a preferred orientation of(002)facet on hexago-nal close-packed(HCP)cobalt crystals.The resistivity of the cobalt film decreased to 14.4μΩ·cm,and further decreased to 10.7μΩ·cm after the annealing treatment.When the concentration of saccharin was increased,the grain size was gradually refined and a“stone forest”structure was observed,with the preferred orientation remaining unchanged.The addition of saccharin also slightly improves the purity of cobalt coating to a certain extent.Through the study of the crystallization behavior of cobalt electroless plating,saccharin molecules can adsorb to specific c-sites on the cobalt dense crystal plane,inhibiting the growth of abc stacking arrangement and inducing the crystal growth in ab stacking mode,thereby achieving optimal growth of HCP(002)texture.展开更多
With the rapid development of flexible wearable electronic products,their application fields and demands are increasing,posing new challenges to flexible conductive materials.This paper selected flexible polydimethyls...With the rapid development of flexible wearable electronic products,their application fields and demands are increasing,posing new challenges to flexible conductive materials.This paper selected flexible polydimethylsiloxane(PDMS)as the substrate.In order to enhance the adhesion between the substrate and the metal coating,dopamine and silanization were used to co-modify its surface.A conductive layer of metallic copper is deposited on its surface using an inexpensive,easy-to-use electroless plating technique.By optimizing the process conditions,it is found that a uniform copper layer of about 0.6μm can be formed on the surface of the substrate by electroless plating at a constant temperature of 45℃ for 30 min with a conductivity of 5556 S/cm.The relative resistance changes under different deformation conditions,and the I-V curve of the LED circuit is not very different.Therefore,this paper prepared a flexible conductor with excellent electrical conductivity,high coating adhesion,and good electrical stability under large-scale deformation.展开更多
A novel method based on mid-frequency vibration is proposed to eliminate coating defects such as bubbles during electroless nickel plating.An automated control system for the plating,enabling precise and stable measur...A novel method based on mid-frequency vibration is proposed to eliminate coating defects such as bubbles during electroless nickel plating.An automated control system for the plating,enabling precise and stable measurements and adjustments of critical parameters such as plating solution temperature,pH,and nickel ion concentration,is also established,which significantly improves process efficiency and coating quality.Experimental results indicate that the system is capable of realizing stable operation over extended periods.A nonporous nickel-phosphorus coating with a thickness greater than 200μm is successfully obtained,with high phosphorus content,robust adhesion,and superior machinability.展开更多
Because of an unfortunate mistake by authors,the Project(5227010679)of Foundation item was wrong.The corrected Project is shown as follows:Project(52271073).
Pretreated Mg-Li alloy sheets were pre-plated in a NiCO3？2Ni（OH）2？4H2O solution to form a thin Ni-P alloy film and then plating in a NiSO4？6H2O solution was carried out to obtain a protective coating.The surface ...Pretreated Mg-Li alloy sheets were pre-plated in a NiCO3？2Ni（OH）2？4H2O solution to form a thin Ni-P alloy film and then plating in a NiSO4？6H2O solution was carried out to obtain a protective coating.The surface morphology,structure and corrosion resistance of the coating were studied.The results showed that a flat,bright and compact plating layer,which was integrated into the matrix metal,was obtained.The P content of the Ni-P coating reached 13.56%（mass fraction）.The hardness value of the Ni-P coating was about HV 549.The polarization curve showed that the corrosion potential of the Ni-P coating reached ？0.249 V（vs SCE）.A long passivation region was found on the polarization curve,and this phenomenon indicated that the coating has an excellent anti-corrosion property.展开更多
A method of electroless plating is utilized to deposit Co-Fe alloy on the surface of multi-walled carbon nanotubes （MWCNTs）,and electromagnetic parameters of MWCNTs with and without electroless plating are discussed...A method of electroless plating is utilized to deposit Co-Fe alloy on the surface of multi-walled carbon nanotubes （MWCNTs）,and electromagnetic parameters of MWCNTs with and without electroless plating are discussed. The MWCNTs covered by Co-Fe is a desirable light absorbent in wide wave band by utilizing electroless plating process in experiments. Field-emission scanning electron microscope （FESEM） and field-emission transmission electron microscope （FETEM） images as well as energy dispersive spectroscopy （EDS） results are presented to show the morphology,components and electromagnetic parameters of MWCNTs. Electromagnetic properties of MWCNTs are enhanced after electroless plating observed from contrast of results be-tween MWCNTs with and without plating. In conclusion,the covering Co-Fe on the surface of MWCNTs in 2-18 GHz frequency range has better electromagnetic properties. When the material is in the 6.5 GHz electromagnetic waves,the reflection loss is up to -10 dB,and the bandwidth more than -4 dB is 5 GHz. The excellent electromagnetic properties make it probable for MWCNTs to be utilized as absorbent in electromagnetic shielding materials.展开更多
An in situ method was designed to measure a continuous open circuit potential （OCP） curve of AZ31 magnesium alloy and to observe the morphology variation of Ni-P coating during the process of the electroless plating...An in situ method was designed to measure a continuous open circuit potential （OCP） curve of AZ31 magnesium alloy and to observe the morphology variation of Ni-P coating during the process of the electroless plating. The deposition mechanism of the electroless Ni-P plating on AZ31 Mg alloy was studied by OCP curve, scanning electron microscopy （SEM）, and energy dispersion spectroscopy （EDS）. The process of electroless Ni-P plating contains the coating formation stage and the coating growth stage. The formation stage includes three procedures, i.e., the nucleation and growth of Ni crystallites, the extension of the coating in two-dimensional （2D） direction and the coalescence of the coating along three-dimensional （3D） direction. SEM investigations demonstrate that the spherical nodules of the Ni-P coating are not only formed during the coating growth stage, but also generated in the initial deposition stage of electroless Ni-P plating. The variation of the coating rates at different deposition stages corresponds to the deposition mechanism of their respective deposition stage.展开更多
An electroless ternary Ni-Sn-P transition layer with high corrosion resistance was applied for acid electroless nickel plating on magnesium alloys. The surface morphologies and microstructure of the traditional alkali...An electroless ternary Ni-Sn-P transition layer with high corrosion resistance was applied for acid electroless nickel plating on magnesium alloys. The surface morphologies and microstructure of the traditional alkaline electroless Ni-P and novel Ni-Sn-P transition layers were compared by SEM and XRD, and the bonding strengths between the transition layers and AZ31 magnesium alloys were tested. The corrosion resistance of the samples was analyzed by porosity test, potentiodynamic polarization, electrochemical impedance spectroscopy（EIS） in acid electroless solution at p H 4.5 and immersion test in 10% HCl. The results indicate that the transition layer is essential for acid electroless plating Ni-P coatings on magnesium alloys. Under the same thin thickness（-6 μm）, the electroless Ni-Sn-P transition layer possesses superior properties to the traditional Ni-P transition layer, including high amorphization, smooth and dense surface without pores, enhanced bonding strength and corrosion resistance. Most importantly, acid electroless Ni-P coatings can be successfully deposited on magnesium alloys by using Ni-Sn-P transition layer.展开更多
The friction and wear properties of the electrolessly-deposited Ni-P-Gr-SiC composites were investigated. The effects of graphite content, load and rotation speed on the friction coefficient and wear resistance of the...The friction and wear properties of the electrolessly-deposited Ni-P-Gr-SiC composites were investigated. The effects of graphite content, load and rotation speed on the friction coefficient and wear resistance of the composite coatings were mainly investigated. The worn surface and cross section of the coatings were characterized by scanning electron microscopy and energy-dispersive X-ray analysis. The results show that the composite coatings reveal good antifriction and wear resistance due to the synergic effect of graphite and SiC particles. The formation of graphite-rich mechanically mixed layer （GRMML） on the surface of Ni-P-Gr-SiC coating contributes to the good tribological behavior of the wear counterparts and SiC particles play a load bearing role in protecting GRMML from shearing easily.展开更多
The electroless Ni-P coatings on AZ91 D magnesium alloy substrate were prepared using the acidic hypophosphite-reduced electroless nickel bath containing the novel ternary ligand system. The results indicate that the ...The electroless Ni-P coatings on AZ91 D magnesium alloy substrate were prepared using the acidic hypophosphite-reduced electroless nickel bath containing the novel ternary ligand system. The results indicate that the deposition rate varies with the ternary ligand concentration in plating solution. The structural and morphological characteristics of the coatings were analyzed by XRD and SEM. The anticorrosion properties of the Ni-P coatings were evaluated in 3.5% NaCl solution by electrochemical impedance and potentiodynamic polarization methods. The amount of ternary ligands in electroless plating bath has an significant effect on the surface morphology and structure of Ni-P coatings. The decrease of crystallization temperature and increase of crystallization heat of all the deposits with an increase in ternary ligand concentration are found by DSC measurements. The coating obtained with 0.035 mol/L ternary ligand additive in plating bath can offer a better surface homogeneity and improve corrosion resistance.展开更多
The current research processes of electroplating and electroless Ni-P alloy plating on magnesium alloys were reviewed. Theoretically,the reason for difficulties in electroplating and electroless plating on magnesium a...The current research processes of electroplating and electroless Ni-P alloy plating on magnesium alloys were reviewed. Theoretically,the reason for difficulties in electroplating and electroless plating on magnesium alloys was given.The zinc immersion, copper immersion,direct electroless Ni-P alloy plating and electroplating and electroless plating on magnesium alloys prepared by chemical conversion coating were presented in detail.Especially,the research development of magnesium alloy AZ91 and AZ31 was discussed briefly.Based on the analysis,the existing problems and future research directions were then given.展开更多
Characteristics of microstructures of electroless Ni-P/Ni-W-P duplex coatings were investigated using SEM/EDX and XRD analysis techniques. Microhardness and wear behaviour of the coatings before and after laser crysta...Characteristics of microstructures of electroless Ni-P/Ni-W-P duplex coatings were investigated using SEM/EDX and XRD analysis techniques. Microhardness and wear behaviour of the coatings before and after laser crystallization were evaluated by measurements of hardnesses of coating surface and cross-section, and by unlubricated friction and wear experiments. The results indicate that it is possible to prepare electroless Ni-P/Ni-W-P duplex coatings by sequential immersion in two different plating baths. After laser crystallization, the microstructures of electroless Ni-P/Ni-W-P duplex coatings present the characteristics of higher degree of crystallization and larger grain size for outer layer Ni-W-P than inner Ni-P, but outer layer has a higher hardness. The wear resistance of laser-treated duplex coatings in a given process parameter conditions is superior to the as-plated ones. Laser treatment was performed directly in air without argon protection, which provides the possibility for application of industrialized production.展开更多
The diffusion barrier Ni-Mo-P film for Cu interconnects was prepared on SiO2/Si substrate using electroless method. The surface morphology and composition during the formation process of electroless Ni-Mo-P film were ...The diffusion barrier Ni-Mo-P film for Cu interconnects was prepared on SiO2/Si substrate using electroless method. The surface morphology and composition during the formation process of electroless Ni-Mo-P film were investigated through analyzing samples of different deposition time. Induced nucleation, induced co-deposition, and self-induced growth mechanisms involved in electroless process were confirmed by field-emission scanning electron microscopy （FE-SEM）, energy dispersive spectrometry and atomic force microscopy （AFM）. Firstly, the preceding palladium particles as catalysts induce the nucleation of nickel. Secondly, the nickel particles induce the deposition of molybdenum and phosphorus, which attributes to induced co-deposition. Thirdly, former deposited Ni-Mo-P induces deposition of the latter Ni-Mo-P particles. Moreover, the reaction mechanism was proposed with the oxydate of 3-4PO .展开更多
Cu-P-silicon carbide （SiC） composite coatings were deposited by means of electroless plating.The effects of pH values,temperature,and different concentrations of sodium hypophosphite （NaH2PO2·H2O）,nickel sulf...Cu-P-silicon carbide （SiC） composite coatings were deposited by means of electroless plating.The effects of pH values,temperature,and different concentrations of sodium hypophosphite （NaH2PO2·H2O）,nickel sulfate （NiSO4·6H2O）,sodium citrate （C6H5Na3O7·2H2O） and SiC on the deposition rate and coating compositions were evaluated,and the bath formulation for Cu-P-SiC composite coatings was optimised.The coating compositions were determined using energy-dispersive X-ray analysis （EDX）.The corresponding optimal operating parameters for depositing Cu-P-SiC are as follows：pH 9;temperature,90oC;NaH2PO2·H2O concentration,125 g/L;NiSO4·6H2O concentration,3.125 g/L;SiC concentration,5 g/L;and C6H5Na3O7·2H2O concentration,50 g/L.The surface morphology of the coatings analysed by scanning electron microscopy （SEM） shows that Cu particles are uniformly distributed.The hardness and wear resistance of Cu-P composite coatings are improved with the addition of SiC particles and increase with the increase of SiC content.展开更多
After Sn/Pd activating, the SiCp/Al composite with 65% SiC (volume fraction) was coated by electroless Ni?P alloy plating. Surface morphology of the composite and its effect on the Ni?P alloy depositing process and bo...After Sn/Pd activating, the SiCp/Al composite with 65% SiC (volume fraction) was coated by electroless Ni?P alloy plating. Surface morphology of the composite and its effect on the Ni?P alloy depositing process and bonding action of Ni and P atoms in the Ni?P alloy were studied. The results show that inhomogeneous distribution of the Sn/Pd activating points results in preferential deposition of the Ni?P alloy particles on the Al alloy and rough SiC particle surfaces and in the etched caves. The Ni?P alloy film has an amorphous structure where chemical bonding between Ni and P atoms exists. After a continuous Ni?P alloy film formed, electroless Ni?P alloy plating is not affected by surface morphology and characteristics of the SiCp/Al composite any longer, but by the electroless plating process itself. The Ni?P alloy film follows linear growth kinetics with an activation energy of 68.44 kJ/mol.展开更多
Phosphate-manganese, tannic acid and vanadium conversion coatings were proposed as an effective pre-treatment layer between electroless Ni-P coating and AZ91D magnesium alloy substrate to replace the traditional chrom...Phosphate-manganese, tannic acid and vanadium conversion coatings were proposed as an effective pre-treatment layer between electroless Ni-P coating and AZ91D magnesium alloy substrate to replace the traditional chromate plus HF pre-treatment. The electrochemical results show that the chrome-free coatings plus electroless Ni-P coating on the magnesium alloy has the lowest corrosion current density and most positive corrosion potential compared with chromate plus electroless Ni-P coating on the magnesium alloy. These proposed pre-treatment layers on the substrate reduce the corrosion of magnesium during plating process, and reduce the potential difference between the matrix and the second phase. Thus, an electroless Ni-P coating with fine crystalline and dense structure was obtained, with preferential phosphorus content, low porosity, good corrosion-resistance and strengthened adhesion than the chromate plus electroless Ni-P.展开更多
Electroless copper plating on diamond particles precoated with 1%Cr was carried out to evaluate the effects of various experimental parameters on coating quality and deposition rate to obtain the optimized reaction pa...Electroless copper plating on diamond particles precoated with 1%Cr was carried out to evaluate the effects of various experimental parameters on coating quality and deposition rate to obtain the optimized reaction parameters. The formulated samples under optimized parameters were characterized by X-ray diffraction, scanning electron microscopy, energy dispersive spectroscopy, X-ray photoelectron spectra and optical microscopy. The best parameters, where uniform and maximum coating thickness was achieved, are etching with 20%NaOH for 30 min, sensitization and activation with SnCl2 and PdCl2 for 5 and 20 min, respectively. The composition of the copper solution bath was 16 g/L CuSO4＆#183;5H2O, 35 mL/L formaldehyde （HCHO）, 23 g/L KNaC4H4O6 at 60 ℃, pH=13 and stirring at （350±15） r/min under ultrasonication.展开更多
Electroless nickel plating on AZ91D substrate with a new and eco-friendly pretreatment process based on tuning an electrochemical homogeneous surface was investigated. The morphology, deposition process, chemical comp...Electroless nickel plating on AZ91D substrate with a new and eco-friendly pretreatment process based on tuning an electrochemical homogeneous surface was investigated. The morphology, deposition process, chemical composition and microstructure of Ni-P coating were studied. It is indicated that β phases are selectively removed, producing a microstructural homogeneous surface and the subsequent uniform and compact Zn immersion layer. A defect-free and well adhesive Ni-P coating can be successfully obtained due to its uniform nucleation and growth based on such pretreatment. Potentiodynamic polarization and electrochemical impedance spectroscopy （EIS） tests reveal that Ni-P coating could significantly improve the corrosion resistance of AZ91D substrate.展开更多
Electrical and electromagnetic shielding wood metal composite was prepared by using electroless nickel plating. The effects of solution amount, plating time and plating temperature on surface resistivity and electroma...Electrical and electromagnetic shielding wood metal composite was prepared by using electroless nickel plating. The effects of solution amount, plating time and plating temperature on surface resistivity and electromagnetic shielding effectiveness were investigated. And P content, microstructure and surface feature of layers obtained at different temperatures were analyzed by energy dispersion spectrometer （EDS）, X-ray diffraction （XRI）） and scanning electron microscopy （SEM）. The results showed that layers with higher electro-conductivity and electromagnetic shielding effectiveness were obtained under the optimum conditions that plating solution was 500 mL, plating time was 30 min and plating temperature was 62℃. The results showed by EDS analysis; that P content increased gradually in a small extent with plating temperature increased. It was showed by XRD and SEM analysis that layers plated at different temperatures were all microcrystalline structure and uniform and successive, which had noticeable metal luster. Those indicated that plating temperature had little influence on microstructure and surface feature under pH value invariable.展开更多
In this article, a new type of Cu-Ti3SiC2 composite powder prepared using the electroless plating technique was introduced. The initial Ti3SiC2 particles are 11 μm in diameter on an average. The Cu plating was carrie...In this article, a new type of Cu-Ti3SiC2 composite powder prepared using the electroless plating technique was introduced. The initial Ti3SiC2 particles are 11 μm in diameter on an average. The Cu plating was carried out at middle temperature （62-65℃） with the application of ultrasonic agitation. The copper deposition rate was determined by measuring the weight gain of the powder after plating. It has been found that the pretreatment of Ti3SiC2 powder is very important to obtain copper nanoparticles on the surface of Ti3SiC2 The optimum procedure before plating aimed to add activated sites and the adjustment of the traditional composition of the electroless copper plating bath could decelerate the copper deposition rate to 0.8 gm/h. X-ray diffraction （XRD） indicates that the chemical composition of the plating layer is copper. SEM images show that the surface of the Ti3SiC2 particles is successfully coated with continuous copper layer. The wetting property between the copper matrix and Ti3SiC2 can be improved so as to increase the interfacial strength.展开更多
基金supported by National Natural Science Foundation of China(22402115,22472094)Shaanxi Special Fund for Talent Introduction(100090/1204071055).
文摘In the process of electroless cobalt plating,the saccharin additive can significantly change the surface morphology,texture orientation,and conductivity of the cobalt coating layer.When the amount of saccharin was 3 mg·L^(-1),the cobalt coating transformed from disordered large grains to a honeycomb structure,with a preferred orientation of(002)facet on hexago-nal close-packed(HCP)cobalt crystals.The resistivity of the cobalt film decreased to 14.4μΩ·cm,and further decreased to 10.7μΩ·cm after the annealing treatment.When the concentration of saccharin was increased,the grain size was gradually refined and a“stone forest”structure was observed,with the preferred orientation remaining unchanged.The addition of saccharin also slightly improves the purity of cobalt coating to a certain extent.Through the study of the crystallization behavior of cobalt electroless plating,saccharin molecules can adsorb to specific c-sites on the cobalt dense crystal plane,inhibiting the growth of abc stacking arrangement and inducing the crystal growth in ab stacking mode,thereby achieving optimal growth of HCP(002)texture.
基金supported by the Natural Science Foundation of Hunan Province(Grant No.2021JJ40463).
文摘With the rapid development of flexible wearable electronic products,their application fields and demands are increasing,posing new challenges to flexible conductive materials.This paper selected flexible polydimethylsiloxane(PDMS)as the substrate.In order to enhance the adhesion between the substrate and the metal coating,dopamine and silanization were used to co-modify its surface.A conductive layer of metallic copper is deposited on its surface using an inexpensive,easy-to-use electroless plating technique.By optimizing the process conditions,it is found that a uniform copper layer of about 0.6μm can be formed on the surface of the substrate by electroless plating at a constant temperature of 45℃ for 30 min with a conductivity of 5556 S/cm.The relative resistance changes under different deformation conditions,and the I-V curve of the LED circuit is not very different.Therefore,this paper prepared a flexible conductor with excellent electrical conductivity,high coating adhesion,and good electrical stability under large-scale deformation.
基金supported by the National Key Research and Development Program of China(Grant No.2023YFB3407200)the National Natural Science Foundation of China(Grant Nos.52375462 and 52035009).
文摘A novel method based on mid-frequency vibration is proposed to eliminate coating defects such as bubbles during electroless nickel plating.An automated control system for the plating,enabling precise and stable measurements and adjustments of critical parameters such as plating solution temperature,pH,and nickel ion concentration,is also established,which significantly improves process efficiency and coating quality.Experimental results indicate that the system is capable of realizing stable operation over extended periods.A nonporous nickel-phosphorus coating with a thickness greater than 200μm is successfully obtained,with high phosphorus content,robust adhesion,and superior machinability.
文摘Because of an unfortunate mistake by authors,the Project(5227010679)of Foundation item was wrong.The corrected Project is shown as follows:Project(52271073).
基金Projects(50974114,51174060) supported by National Natural Science Foundation of ChinaProject(2008AA03Z512) supported by High-tech Research and Development Program of ChinaProject(20070145049) supported by PhD Programs Foundation of Ministry of Education of China
文摘Pretreated Mg-Li alloy sheets were pre-plated in a NiCO3？2Ni（OH）2？4H2O solution to form a thin Ni-P alloy film and then plating in a NiSO4？6H2O solution was carried out to obtain a protective coating.The surface morphology,structure and corrosion resistance of the coating were studied.The results showed that a flat,bright and compact plating layer,which was integrated into the matrix metal,was obtained.The P content of the Ni-P coating reached 13.56%（mass fraction）.The hardness value of the Ni-P coating was about HV 549.The polarization curve showed that the corrosion potential of the Ni-P coating reached ？0.249 V（vs SCE）.A long passivation region was found on the polarization curve,and this phenomenon indicated that the coating has an excellent anti-corrosion property.
文摘A method of electroless plating is utilized to deposit Co-Fe alloy on the surface of multi-walled carbon nanotubes （MWCNTs）,and electromagnetic parameters of MWCNTs with and without electroless plating are discussed. The MWCNTs covered by Co-Fe is a desirable light absorbent in wide wave band by utilizing electroless plating process in experiments. Field-emission scanning electron microscope （FESEM） and field-emission transmission electron microscope （FETEM） images as well as energy dispersive spectroscopy （EDS） results are presented to show the morphology,components and electromagnetic parameters of MWCNTs. Electromagnetic properties of MWCNTs are enhanced after electroless plating observed from contrast of results be-tween MWCNTs with and without plating. In conclusion,the covering Co-Fe on the surface of MWCNTs in 2-18 GHz frequency range has better electromagnetic properties. When the material is in the 6.5 GHz electromagnetic waves,the reflection loss is up to -10 dB,and the bandwidth more than -4 dB is 5 GHz. The excellent electromagnetic properties make it probable for MWCNTs to be utilized as absorbent in electromagnetic shielding materials.
基金Project supported by the Priority Academic Program Development of Jiangsu Higher Education Institutions (PAPD), China
文摘An in situ method was designed to measure a continuous open circuit potential （OCP） curve of AZ31 magnesium alloy and to observe the morphology variation of Ni-P coating during the process of the electroless plating. The deposition mechanism of the electroless Ni-P plating on AZ31 Mg alloy was studied by OCP curve, scanning electron microscopy （SEM）, and energy dispersion spectroscopy （EDS）. The process of electroless Ni-P plating contains the coating formation stage and the coating growth stage. The formation stage includes three procedures, i.e., the nucleation and growth of Ni crystallites, the extension of the coating in two-dimensional （2D） direction and the coalescence of the coating along three-dimensional （3D） direction. SEM investigations demonstrate that the spherical nodules of the Ni-P coating are not only formed during the coating growth stage, but also generated in the initial deposition stage of electroless Ni-P plating. The variation of the coating rates at different deposition stages corresponds to the deposition mechanism of their respective deposition stage.
基金Project(20120407)supported by the Science and Technology Key Development Plan of Jilin Province,China
文摘An electroless ternary Ni-Sn-P transition layer with high corrosion resistance was applied for acid electroless nickel plating on magnesium alloys. The surface morphologies and microstructure of the traditional alkaline electroless Ni-P and novel Ni-Sn-P transition layers were compared by SEM and XRD, and the bonding strengths between the transition layers and AZ31 magnesium alloys were tested. The corrosion resistance of the samples was analyzed by porosity test, potentiodynamic polarization, electrochemical impedance spectroscopy（EIS） in acid electroless solution at p H 4.5 and immersion test in 10% HCl. The results indicate that the transition layer is essential for acid electroless plating Ni-P coatings on magnesium alloys. Under the same thin thickness（-6 μm）, the electroless Ni-Sn-P transition layer possesses superior properties to the traditional Ni-P transition layer, including high amorphization, smooth and dense surface without pores, enhanced bonding strength and corrosion resistance. Most importantly, acid electroless Ni-P coatings can be successfully deposited on magnesium alloys by using Ni-Sn-P transition layer.
基金Project (51204105) supported by the National Natural Science Foundation of ChinaProject (11ZR1418000) supported by the Shanghai Natural Science Foundation, China
文摘The friction and wear properties of the electrolessly-deposited Ni-P-Gr-SiC composites were investigated. The effects of graphite content, load and rotation speed on the friction coefficient and wear resistance of the composite coatings were mainly investigated. The worn surface and cross section of the coatings were characterized by scanning electron microscopy and energy-dispersive X-ray analysis. The results show that the composite coatings reveal good antifriction and wear resistance due to the synergic effect of graphite and SiC particles. The formation of graphite-rich mechanically mixed layer （GRMML） on the surface of Ni-P-Gr-SiC coating contributes to the good tribological behavior of the wear counterparts and SiC particles play a load bearing role in protecting GRMML from shearing easily.
基金Project(21073027)supported by the National Natural Science Foundation of ChinaProject(DUT10LK26)supported by the Fundamental Research Funds for the Central Universities of China
文摘The electroless Ni-P coatings on AZ91 D magnesium alloy substrate were prepared using the acidic hypophosphite-reduced electroless nickel bath containing the novel ternary ligand system. The results indicate that the deposition rate varies with the ternary ligand concentration in plating solution. The structural and morphological characteristics of the coatings were analyzed by XRD and SEM. The anticorrosion properties of the Ni-P coatings were evaluated in 3.5% NaCl solution by electrochemical impedance and potentiodynamic polarization methods. The amount of ternary ligands in electroless plating bath has an significant effect on the surface morphology and structure of Ni-P coatings. The decrease of crystallization temperature and increase of crystallization heat of all the deposits with an increase in ternary ligand concentration are found by DSC measurements. The coating obtained with 0.035 mol/L ternary ligand additive in plating bath can offer a better surface homogeneity and improve corrosion resistance.
文摘The current research processes of electroplating and electroless Ni-P alloy plating on magnesium alloys were reviewed. Theoretically,the reason for difficulties in electroplating and electroless plating on magnesium alloys was given.The zinc immersion, copper immersion,direct electroless Ni-P alloy plating and electroplating and electroless plating on magnesium alloys prepared by chemical conversion coating were presented in detail.Especially,the research development of magnesium alloy AZ91 and AZ31 was discussed briefly.Based on the analysis,the existing problems and future research directions were then given.
基金Project (ZR2011EMM014) supported by the Natural Science Foundation of Shandong Province, China
文摘Characteristics of microstructures of electroless Ni-P/Ni-W-P duplex coatings were investigated using SEM/EDX and XRD analysis techniques. Microhardness and wear behaviour of the coatings before and after laser crystallization were evaluated by measurements of hardnesses of coating surface and cross-section, and by unlubricated friction and wear experiments. The results indicate that it is possible to prepare electroless Ni-P/Ni-W-P duplex coatings by sequential immersion in two different plating baths. After laser crystallization, the microstructures of electroless Ni-P/Ni-W-P duplex coatings present the characteristics of higher degree of crystallization and larger grain size for outer layer Ni-W-P than inner Ni-P, but outer layer has a higher hardness. The wear resistance of laser-treated duplex coatings in a given process parameter conditions is superior to the as-plated ones. Laser treatment was performed directly in air without argon protection, which provides the possibility for application of industrialized production.
文摘The diffusion barrier Ni-Mo-P film for Cu interconnects was prepared on SiO2/Si substrate using electroless method. The surface morphology and composition during the formation process of electroless Ni-Mo-P film were investigated through analyzing samples of different deposition time. Induced nucleation, induced co-deposition, and self-induced growth mechanisms involved in electroless process were confirmed by field-emission scanning electron microscopy （FE-SEM）, energy dispersive spectrometry and atomic force microscopy （AFM）. Firstly, the preceding palladium particles as catalysts induce the nucleation of nickel. Secondly, the nickel particles induce the deposition of molybdenum and phosphorus, which attributes to induced co-deposition. Thirdly, former deposited Ni-Mo-P induces deposition of the latter Ni-Mo-P particles. Moreover, the reaction mechanism was proposed with the oxydate of 3-4PO .
基金supported by Universiti Sains Malaysia under the Research University Grant (RU. Grant No.1001/PKIMIA/811006)
文摘Cu-P-silicon carbide （SiC） composite coatings were deposited by means of electroless plating.The effects of pH values,temperature,and different concentrations of sodium hypophosphite （NaH2PO2·H2O）,nickel sulfate （NiSO4·6H2O）,sodium citrate （C6H5Na3O7·2H2O） and SiC on the deposition rate and coating compositions were evaluated,and the bath formulation for Cu-P-SiC composite coatings was optimised.The coating compositions were determined using energy-dispersive X-ray analysis （EDX）.The corresponding optimal operating parameters for depositing Cu-P-SiC are as follows：pH 9;temperature,90oC;NaH2PO2·H2O concentration,125 g/L;NiSO4·6H2O concentration,3.125 g/L;SiC concentration,5 g/L;and C6H5Na3O7·2H2O concentration,50 g/L.The surface morphology of the coatings analysed by scanning electron microscopy （SEM） shows that Cu particles are uniformly distributed.The hardness and wear resistance of Cu-P composite coatings are improved with the addition of SiC particles and increase with the increase of SiC content.
基金Project(2014DFA50860)supported by International Science&Technology Cooperation Program of China
文摘After Sn/Pd activating, the SiCp/Al composite with 65% SiC (volume fraction) was coated by electroless Ni?P alloy plating. Surface morphology of the composite and its effect on the Ni?P alloy depositing process and bonding action of Ni and P atoms in the Ni?P alloy were studied. The results show that inhomogeneous distribution of the Sn/Pd activating points results in preferential deposition of the Ni?P alloy particles on the Al alloy and rough SiC particle surfaces and in the etched caves. The Ni?P alloy film has an amorphous structure where chemical bonding between Ni and P atoms exists. After a continuous Ni?P alloy film formed, electroless Ni?P alloy plating is not affected by surface morphology and characteristics of the SiCp/Al composite any longer, but by the electroless plating process itself. The Ni?P alloy film follows linear growth kinetics with an activation energy of 68.44 kJ/mol.
基金Project(50871046)supported by the National Natural Science Foundation of ChinaProject(2010CB631001)supported by the National Basic Research Program of China+1 种基金Project supported by the Program for Changjiang Scholars and Innovative Research Team inUniversity,ChinaIndo-China cultural exchange scholarship program by the Ministry of Human Resource Department(MHRD,India)and Ministry of Education(MOE,China)
文摘Phosphate-manganese, tannic acid and vanadium conversion coatings were proposed as an effective pre-treatment layer between electroless Ni-P coating and AZ91D magnesium alloy substrate to replace the traditional chromate plus HF pre-treatment. The electrochemical results show that the chrome-free coatings plus electroless Ni-P coating on the magnesium alloy has the lowest corrosion current density and most positive corrosion potential compared with chromate plus electroless Ni-P coating on the magnesium alloy. These proposed pre-treatment layers on the substrate reduce the corrosion of magnesium during plating process, and reduce the potential difference between the matrix and the second phase. Thus, an electroless Ni-P coating with fine crystalline and dense structure was obtained, with preferential phosphorus content, low porosity, good corrosion-resistance and strengthened adhesion than the chromate plus electroless Ni-P.
基金Project(9140A12060110BQ03)supported by the National Key Laboratory of Science and Technology on Materials under Shock and Impact,China
文摘Electroless copper plating on diamond particles precoated with 1%Cr was carried out to evaluate the effects of various experimental parameters on coating quality and deposition rate to obtain the optimized reaction parameters. The formulated samples under optimized parameters were characterized by X-ray diffraction, scanning electron microscopy, energy dispersive spectroscopy, X-ray photoelectron spectra and optical microscopy. The best parameters, where uniform and maximum coating thickness was achieved, are etching with 20%NaOH for 30 min, sensitization and activation with SnCl2 and PdCl2 for 5 and 20 min, respectively. The composition of the copper solution bath was 16 g/L CuSO4＆#183;5H2O, 35 mL/L formaldehyde （HCHO）, 23 g/L KNaC4H4O6 at 60 ℃, pH=13 and stirring at （350±15） r/min under ultrasonication.
基金Project(51371116)supported by the National Natural Science Foundation of ChinaProject(2009AA033501)supported by the Ministry of Science and Technology,China
文摘Electroless nickel plating on AZ91D substrate with a new and eco-friendly pretreatment process based on tuning an electrochemical homogeneous surface was investigated. The morphology, deposition process, chemical composition and microstructure of Ni-P coating were studied. It is indicated that β phases are selectively removed, producing a microstructural homogeneous surface and the subsequent uniform and compact Zn immersion layer. A defect-free and well adhesive Ni-P coating can be successfully obtained due to its uniform nucleation and growth based on such pretreatment. Potentiodynamic polarization and electrochemical impedance spectroscopy （EIS） tests reveal that Ni-P coating could significantly improve the corrosion resistance of AZ91D substrate.
基金The research was supported by the National Natural Science Foundation of China （30571454）. Natural Science Foundation of Heilongjiang Province （C0210） and Harbin City Youth Science Faud （2004AFQXJ027）.
文摘Electrical and electromagnetic shielding wood metal composite was prepared by using electroless nickel plating. The effects of solution amount, plating time and plating temperature on surface resistivity and electromagnetic shielding effectiveness were investigated. And P content, microstructure and surface feature of layers obtained at different temperatures were analyzed by energy dispersion spectrometer （EDS）, X-ray diffraction （XRI）） and scanning electron microscopy （SEM）. The results showed that layers with higher electro-conductivity and electromagnetic shielding effectiveness were obtained under the optimum conditions that plating solution was 500 mL, plating time was 30 min and plating temperature was 62℃. The results showed by EDS analysis; that P content increased gradually in a small extent with plating temperature increased. It was showed by XRD and SEM analysis that layers plated at different temperatures were all microcrystalline structure and uniform and successive, which had noticeable metal luster. Those indicated that plating temperature had little influence on microstructure and surface feature under pH value invariable.
文摘In this article, a new type of Cu-Ti3SiC2 composite powder prepared using the electroless plating technique was introduced. The initial Ti3SiC2 particles are 11 μm in diameter on an average. The Cu plating was carried out at middle temperature （62-65℃） with the application of ultrasonic agitation. The copper deposition rate was determined by measuring the weight gain of the powder after plating. It has been found that the pretreatment of Ti3SiC2 powder is very important to obtain copper nanoparticles on the surface of Ti3SiC2 The optimum procedure before plating aimed to add activated sites and the adjustment of the traditional composition of the electroless copper plating bath could decelerate the copper deposition rate to 0.8 gm/h. X-ray diffraction （XRD） indicates that the chemical composition of the plating layer is copper. SEM images show that the surface of the Ti3SiC2 particles is successfully coated with continuous copper layer. The wetting property between the copper matrix and Ti3SiC2 can be improved so as to increase the interfacial strength.
