Flexible and stretchable electronics have shown high potential applied in the electronics world such as wearable electronics[1,2],displays[3,4]and energy harvesting[5,6].Their innovative characteristics are that flexi...Flexible and stretchable electronics have shown high potential applied in the electronics world such as wearable electronics[1,2],displays[3,4]and energy harvesting[5,6].Their innovative characteristics are that flexible electronics own stable function under limited physical deformation(e.g.,bending)[7,8],and stretchable electronics possess the ability to ensure reliable performance under diverse physical deformation modes(e.g.,stretching and twisting)[9,10].However,challenges remain when integrating rigid,flexible substrates into the stretchable substrates,because of a mismatch in their elastic moduli,which causes failing operations when devices are stretching.Several efforts are devoted to enhancing the stretchability,such as the modified geometry by the serpentine and kirigami island[11],and rigid island method by materials and interfacial engineering[12,13],but fully mitigating the strain mismatch,large-scale application and long-term stability are still obstacles to combine flexible and stretchable substrates.展开更多
文摘Flexible and stretchable electronics have shown high potential applied in the electronics world such as wearable electronics[1,2],displays[3,4]and energy harvesting[5,6].Their innovative characteristics are that flexible electronics own stable function under limited physical deformation(e.g.,bending)[7,8],and stretchable electronics possess the ability to ensure reliable performance under diverse physical deformation modes(e.g.,stretching and twisting)[9,10].However,challenges remain when integrating rigid,flexible substrates into the stretchable substrates,because of a mismatch in their elastic moduli,which causes failing operations when devices are stretching.Several efforts are devoted to enhancing the stretchability,such as the modified geometry by the serpentine and kirigami island[11],and rigid island method by materials and interfacial engineering[12,13],but fully mitigating the strain mismatch,large-scale application and long-term stability are still obstacles to combine flexible and stretchable substrates.
