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Development of massively parallel electron beam direct write lithography using active-matrix nanocrystalline-silicon electron emitter arrays 被引量:4
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作者 Masayoshi Esashi Akira Kojima +2 位作者 Naokatsu Ikegami Hiroshi Miyaguchi Nobuyoshi Koshida 《Microsystems & Nanoengineering》 EI 2015年第1期44-51,共8页
Nanoscale lithographic technologies have been intensively studied for the development of the next generation of semiconductor manufacturing practices.While mask-less/direct-write electron beam(EB)lithography methods s... Nanoscale lithographic technologies have been intensively studied for the development of the next generation of semiconductor manufacturing practices.While mask-less/direct-write electron beam(EB)lithography methods serve as a candidate for the upcoming 10-nm node approaches and beyond,it remains difficult to achieve an appropriate level of throughput.Several innovative features of the multiple EB system that involve the use of a thermionic source have been proposed.However,a blanking array mechanism is required for the individual control of multiple beamlets whereby each beamlet is deflected onto a blanking object or passed through an array.This paper reviews the recent developments of our application studies on the development of a high-speed massively parallel electron beam direct write(MPEBDW)lithography.The emitter array used in our study includes nanocrystalline-Si(nc-Si)ballistic electron emitters.Electrons are drifted via multiple tunnelling cascade transport and are emitted as hot electrons.The transport mechanism allows one to quickly turn electron beamlets on or off.The emitter array is a micro-electro-mechanical system(MEMS)that is hetero-integrated with a separately fabricated active-matrix-driving complementary metal-oxide semiconductor(CMOS)large-scale integration(LSI)system that controls each emitter individually.The basic function of the LSI was confirmed to receive external writing bitmap data and generate driving signals for turning beamlets on or off.Each emitted beamlet(10×10μm^(2))is converged to 10×10 nm^(2) on a target via the reduction electron optic system under development.This paper presents an overview of the system and characteristic evaluations of the nc-Si emitter array.We examine beamlets and their electron emission characteristics via a 1:1 exposure test. 展开更多
关键词 direct write lithography electron beam lithography electron emitter array multiple electron beams NANOCRYSTALLINE Si
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High-speed, large-area and high-precision fabrication of aspheric micro-lens array based on 12-bit direct laser writing lithography 被引量:6
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作者 Shiyi Luan Fei Peng +3 位作者 Guoxing Zheng Chengqun Gui Yi Song Sheng Liu 《Light: Advanced Manufacturing》 2022年第4期50-60,共11页
Aspheric micro-lens array(AMLA),featured with low dispersion and diffraction-limited imaging quality,plays an important role in advanced optical imaging.Ideally,the fabrication of commercially applicable AMLAs should ... Aspheric micro-lens array(AMLA),featured with low dispersion and diffraction-limited imaging quality,plays an important role in advanced optical imaging.Ideally,the fabrication of commercially applicable AMLAs should feature low cost,high precision,large area and high speed.However,these criteria have been achieved only partially with conventional fabrication process.Herein,we demonstrate the fabrication and characterization of AMLAs based on 12-bit direct laser writing lithography,which exhibits a high fabrication speed,large area,perfect lens shape control via a three-dimensional optical proximity correction and average surface roughness lower than 6 nm.In particular,the AMLAs can be flexibly designed with customized filling factor and arbitrary off-axis operation for each single micro-lens,and the proposed pattern transfer approach with polydimethylsiloxane(PDMS)suggests a low-cost way for mass manufacturing.An auto-stereoscopic-display flexible thin film with excellent display effect has been prepared by using above technology,which exhibits a new way to provide flexible auto-stereoscopic-display at low cost.In brief,the demonstrated fabrication of AMLAs based on direct laser writing lithography reduce the complexity of AMLA fabrication while significantly increasing their performance,suggesting a new route for high-quality three-dimentional optical manufacturing towards simplified fabrication process,high precision and large scale. 展开更多
关键词 Aspheric micro-lens array Large-area fabrication Sub 6 nm roughness 12-bit direct laser writing lithography
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Patterning of metal-organic framework: From methodology to application
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作者 Nannan Zhang Haoyang Zhang +2 位作者 Jianhang Ma Jie Guan Yuanyuan Wang 《Nano Research》 2025年第12期509-530,共22页
Metal-organic frameworks(MOFs)are versatile materials with tunable pore structures,high surface areas,and diverse chemical functionalities,making them ideal for applications in catalysis,sensing,gas separation,and dru... Metal-organic frameworks(MOFs)are versatile materials with tunable pore structures,high surface areas,and diverse chemical functionalities,making them ideal for applications in catalysis,sensing,gas separation,and drug delivery.However,their bulk or powdered forms often limit performance due to poor dispersion and low functional integration.This challenge has driven the rapid development of MOF patterning techniques.This review explores various patterning methods,including template-induced growth method,printing techniques,conventional lithography and emerging direct photolithographic strategies,highlighting their principles,advantages,and limitations.We also discuss the broad applications of MOF patterning in energy devices,biosensors,and biomedical fields,emphasizing its potential in advancing performance.In addition,we address the challenge of balancing the quality of patterning resolution with the performance of MOF materials.By offering insights into both methodologies and applications,this review provides valuable guidance for researchers,fostering innovation in MOF-based multifunctional devices across diverse scientific fields. 展开更多
关键词 metal-organic framework(MOF) direct lithography technology fabrication PATTERNING APPLICATION
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High-aspect-ratio nanoimprint process chains 被引量:1
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作者 Víctor J.Cadarso Nachiappan Chidambaram +1 位作者 Loïc Jacot-Descombes Helmut Schift 《Microsystems & Nanoengineering》 EI CSCD 2017年第1期221-232,共12页
Different methods capable of developing complex structures and building elements with high-aspect-ratio nanostructures combined with microstructures,which are of interest in nanophotonics,are presented.As originals fo... Different methods capable of developing complex structures and building elements with high-aspect-ratio nanostructures combined with microstructures,which are of interest in nanophotonics,are presented.As originals for subsequent replication steps,two families of masters were developed:(i)3.2μm deep,180 nm wide trenches were fabricated by silicon cryo-etching and(ii)9.8μm high,350 nm wide ridges were fabricated using 2-photon polymerization direct laser writing.Both emerging technologies enable the vertical smooth sidewalls needed for a successful imprint into thin layers of polymers with aspect ratios exceeding 15.Nanoridges with high aspect ratios of up to 28 and no residual layer were produced in Ormocers using the micromoulding into capillaries(MIMIC)process with subsequent ultraviolet-curing.This work presents and balances the different fabrication routes and the subsequent generation of working tools from masters with inverted tones and the combination of hard and soft materials.This provides these techniques with a proof of concept for their compatibility with high volume manufacturing of complex micro-and nanostructures. 展开更多
关键词 cryo-etching direct 6 write laser lithography high aspect ratio MOULDING nanoimprint lithography ORMOCER photonic nanofences 2-photon polymerization
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