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THERMAL STRESS MEASUREMENT OF QUARTZ OSCILLATOR MODULE PACKAGING 被引量:2
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作者 Ji Hongwei Qin Yuwen Chen Jinlong 《Acta Mechanica Solida Sinica》 SCIE EI 2001年第3期251-258,共8页
The thermal stress of the quartz oscillator module packaging isinvestigated using digital-im- age correlation method (DICM), and theexperimental results are given. Under the quartz oscillator modulepackaging, the quar... The thermal stress of the quartz oscillator module packaging isinvestigated using digital-im- age correlation method (DICM), and theexperimental results are given. Under the quartz oscillator modulepackaging, the quartz oscillator and the Fe-Sn-Cu alloy frame arejoined together with the electroconductive adhesive (PI), and theelectroconductive adhesive needs to be cured twice at 150 deg. C and275 deg. C respective- ly. 展开更多
关键词 digital-image correlation method (DICM) thermal stress micro-zone strainmeasurement
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Multi-digital Still Cameras with CCD
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作者 LIU Wen-jing LONG Zai-chuan +1 位作者 XIONG Ping HUAN Yao-xiong 《Semiconductor Photonics and Technology》 CAS 2006年第2期136-138,144,共4页
Digital still camera is a completely typical tool for capturing the digital images. With the development of IC technology and optimization-algorithm, the performance of digital still cameras(DSCs) will be more and mor... Digital still camera is a completely typical tool for capturing the digital images. With the development of IC technology and optimization-algorithm, the performance of digital still cameras(DSCs) will be more and more powerful in the world. But can we obtain the more and better info using the combined information from the multi-digital still camera? The answer is yes by some experiments. By using multi-DSC at different angles, the various 3-D informations of the object are obtained. 展开更多
关键词 INFORMATION digital-image Multi-digital camera CCD
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