The excellent irradiation resistance,high strength and plasticity exhibited by high-entropy alloys(HEAs)make it candidate for engin-eering applications.Diffusion bonding of Al_(0.3)CoCrFeNi single-phase HEAs was carri...The excellent irradiation resistance,high strength and plasticity exhibited by high-entropy alloys(HEAs)make it candidate for engin-eering applications.Diffusion bonding of Al_(0.3)CoCrFeNi single-phase HEAs was carried out using electric-assisted diffusion bonding(EADB),and the effect of bonding temperature on the evolution of the interfacial microstructure and the mechanical properties was investigated.The results indicate that as the bonding temperature increases,the pores at the interface gradually decrease in size and undergo closure.The electric current significantly promotes the pore closure mechanism dominated by plastic deformation at the diffusion interface and promotes the recrystallisation behavior at the interface,and the fracture mode changes from intergranular fracture at the interface to jagged fracture along the grains spanning the weld parent material.Due to the activation effect of EADB,higher-strength diffusion bonding of high-entropy alloys can be achieved at the same temperature compared with the conventional hot-pressure diffusion bonding(HPDB)process.展开更多
In this study, to meet the development and application requirements for high-strength and hightoughness energetic structural materials, a representative volume element of a TA15 matrix embedded with a TaZrNb sphere wa...In this study, to meet the development and application requirements for high-strength and hightoughness energetic structural materials, a representative volume element of a TA15 matrix embedded with a TaZrNb sphere was designed and fabricated via diffusion bonding. The mechanisms of the microstructural evolution of the TaZrNb/TA15 interface were investigated via SEM, EBSD, EDS, and XRD.Interface mechanical property tests and in-situ tensile tests were conducted on the sphere-containing structure, and an equivalent tensile-strength model was established for the structure. The results revealed that the TA15 titanium alloy and joint had high density and no pores or cracks. The thickness of the planar joint was approximately 50-60 μm. The average tensile and shear strengths were 767 MPa and 608 MPa, respectively. The thickness of the spherical joint was approximately 60 μm. The Zr and Nb elements in the joint diffused uniformly and formed strong bonds with Ti without forming intermetallic compounds. The interface exhibited submicron grain refinement and a concave-convex interlocking structure. The tensile fracture surface primarily exhibited intergranular fracture combined with some transgranular fracture, which constituted a quasi-brittle fracture mode. The shear fracture surface exhibited brittle fracture with regular arrangements of furrows. Internal fracture occurred along the spherical interface, as revealed by advanced in-situ X-ray microcomputed tomography. The experimental results agreed well with the theoretical predictions, indicating that the high-strength interface contributes to the overall strength and toughness of the sphere-containing structure.展开更多
The unclear interfacial characteristics of Ag/Cu interface during diffusion welding limit the improvement of mechanical properties of Ag/Cu bimetallic strips.The growth orientation and evolution of Ag and Cu crystals ...The unclear interfacial characteristics of Ag/Cu interface during diffusion welding limit the improvement of mechanical properties of Ag/Cu bimetallic strips.The growth orientation and evolution of Ag and Cu crystals between Ag and Cu strips were investigated by electron backscatter diffraction(EBSD)analysis,and the interfacial properties of various Ag/Cu interfacial configurations were calculated using first-principles calculations to elucidate the diversified interfacial characteristics.Three interface bonding states,including Ag(100)/Cu(100),Ag(110)/Cu(110)and Ag(111)/Cu(111),were preferentially formed in Ag/Cu bimetallic strips during roll bonding.The intensity of Ag(100)/Cu(100)interface increases with the increasing deformation amounts during cold rolling,accompanied by the decreased intensity of Ag(110)/Cu(110)and Ag(111)/Cu(111)interfaces.The largest adsorption work and lowest interface energy of Ag(100)/Cu(100)interface at the“center”position reveal the transition from Ag(110)/Cu(110)and Ag(111)/Cu(111)interfaces to Ag(100)/Cu(100)interface.展开更多
High Nbβ/γ-TiAl(HNBG)intermetallics and Ni-based superalloy(IN718)were diffusion-bonded using pure Ti foil interlayer under pulse current.The microstructure,element segregation,and mechanical properties of HNBG/Ti/I...High Nbβ/γ-TiAl(HNBG)intermetallics and Ni-based superalloy(IN718)were diffusion-bonded using pure Ti foil interlayer under pulse current.The microstructure,element segregation,and mechanical properties of HNBG/Ti/IN718 joint were investigated.The effect of Ti interlayer on microstructure and mechanical properties of the joint was discussed.The typical microstructure of HNBG/Ti/IN718 joint was HNBG//β/B2,τ_(3)-NiAl_(3)Ti_(2)//α_(2)-Ti_(3)Al//α-Ti+δ-NiTi_(2),β-Ti//δ-NiTi_(2)//β2-(Ni,Fe)Ti//Cr/Fe-richη-Ni_(3)Ti,η-Ni_(3)Ti,α-Cr,δ-Ni_(3)Nb//η-Ni_(3)Ti,γ-Ni,δ-Ni_(3)Nb//IN718.The gaps and Kirkendall voids exhibited a gradual disappearance with increasing bonding temperature.The mechanism of Cr,Fe and Nb elements segregation was that NiTi phase hindered the diffusion of them.The nano-indentation results demonstrated that diffusion zones on IN718 alloy side had higher hardness.The maximum shear strength of the joint(326 MPa)was achieved at bonding parameters of 850℃,20 min and 10 MPa.The fracture occurred in Zones IV and V,and the fracture modes were brittle fracture and cleavage fracture.The introduction of Ti interlayer resulted in improved microstructure and enhanced bonding strength of the joint.展开更多
Effects of ultrasonic bonding parameters on atomic diffusion, microstructure at the Al-Au interface, and shear strength of Al-Au ultrasonic bonding were investigated by the combining experiments and finite element (FE...Effects of ultrasonic bonding parameters on atomic diffusion, microstructure at the Al-Au interface, and shear strength of Al-Au ultrasonic bonding were investigated by the combining experiments and finite element (FE) simulation. The quantitative model of atomic diffusion, which is related to the ultrasonic bonding parameters, time and distance, is established to calculate the atomic diffusion of the Al-Au interface. The maximum relative error between the calculated and experimental fraction of Al atom is 7.35%, indicating high prediction accuracy of this model. During the process of ultrasonic bonding, Au8Al3 is the main intermetallic compound (IMC) at the Al-Au interface. With larger bonding forces, higher ultrasonic powers and longer bonding time, it is more difficult to remove the oxide particles from the Al-Au interface, which hinders the atomic diffusion. Therefore, the complicated stress state and the existence of oxide particles both promotes the formation of holes. The shear strength of Al-Au ultrasonic bonding increases with increasing bonding force, ultrasonic power and bonding time. However, combined with the presence of holes at especial parameters, the optimal ultrasonic bonding parameter is confirmed to be a bonding force of 23 gf, ultrasonic power of 75 mW and bonding time of 21 ms.展开更多
The bonding interface characteristic and shear strength of diffusion bonded Ti-17 titanium alloy at different bonding time were investigated. The results show that the average size of voids decreases while the amount ...The bonding interface characteristic and shear strength of diffusion bonded Ti-17 titanium alloy at different bonding time were investigated. The results show that the average size of voids decreases while the amount of voids decreases after increasing to the maximum value with the increasing bonding time. The irregular void with a scraggly edge tends to an ellipse void with smooth surface and then changes to a tiny void with round shape. The grains across bonding interface occur at bonding time of 60 min. The shear strength of bond increases with increasing bonding time, and the highest shear strength of bond is 887.4 MPa at 60 min. The contribution of plastic deformation on the void closure and the increase of shear strength is significant even though the action time of plastic deformation is short.展开更多
Diffusion bonding between tungsten and 0Cr13Al stainless steel using a Cu/90W-10Ni powder mixtures/Ni multi-interlayer was carried out in vacuum at 1150 °C with a pressure of 5 MPa for 60 min. The microstructures...Diffusion bonding between tungsten and 0Cr13Al stainless steel using a Cu/90W-10Ni powder mixtures/Ni multi-interlayer was carried out in vacuum at 1150 °C with a pressure of 5 MPa for 60 min. The microstructures, composition distribution and fracture characteristics of the joint were studied by SEM and EDS. Joint properties were evaluated by shear experiments and thermal shock tests. The results showed that the joints comprised tungsten/Cu-Ni sub-layer/W-Ni composites sub-layer/Ni sub-layer/0Cr13Al stainless steel. The W-Ni composites sub-layer with a homogeneous and dense microstructure was formed by solid phase sintering of 90W-10Ni powder mixtures. Sound bonding between tungsten base material and W-Ni composites sub-layer was realized based on transient liquid phase (TLP) diffusion bonding mechanism. Joints fractured at bonding zone of W-Ni composites sub-layer and Ni sub-layer during shear testing, and the average strength was 256 MPa. Thermal shock tests showed that joints could withstood 60 thermal cycles quenching from 700 °C to room temperature.展开更多
BN coated A1203 fibre-reinforced NiAl-alloy composites were fabricated by hot pressing at 1 200-1 400 ℃, and the interracial microstructure and chemical stability of BN coated Al2O3 fibre-reinforced NiAl-alloy compos...BN coated A1203 fibre-reinforced NiAl-alloy composites were fabricated by hot pressing at 1 200-1 400 ℃, and the interracial microstructure and chemical stability of BN coated Al2O3 fibre-reinforced NiAl-alloy composites were investigated by scanning electron microscopy （SEM） and analytical transmission electron microscopy （TEM）. It was found that the complicated chemical reactions and diffusion processes happened in the interface area between BN-layer and Ni25.8A19.6Ta8.3 during the hot pressing at 1 200-1 400 ℃. A continuous AlN-layer was formed at the interface due to the reaction between NiAl and BN. At the same time, Cr diffused extensively into the BN-layer and reacted with boron to form Cr boride precipitates （CrsB3）. In addition, a few particles of Ta-rich phase were also precipitated in NiAl matrix near the interface.展开更多
The superplasticity and diffusion bonding of IN718 superalloy were studied in this article. The strain rate sensitivity index m was obtained at different temperatures and various initial strain rates using the tensile...The superplasticity and diffusion bonding of IN718 superalloy were studied in this article. The strain rate sensitivity index m was obtained at different temperatures and various initial strain rates using the tensile speed mutation method; m reached its maximum value 0.53 at an initial strain rate of 1×10^-4s^-1 at 1253K. The diffusion bonding parameters, including the bonding temperature T, pressure p, and time t, affected the mechanism of joints. When the bonded specimen with 25μm thick nickel foil interlayer was tensile at room temperature, the shear fracture of the joints with nickel foil interlayer took place at the IN718 part. Microstructure study was carried out with the bonded samples. The microstructure shows an excellent bonding at the interfaces. The optimum parameters for the diffusion bonding are： T = 1273-1323K, p = 20-30MPa, t = 45-60min.展开更多
In many circumstances,dissimilar metals have to be bonded together and the resulting joint interfaces must typically sustain mechanical and/or electrical forces without failure,which is not possible by fusion welding ...In many circumstances,dissimilar metals have to be bonded together and the resulting joint interfaces must typically sustain mechanical and/or electrical forces without failure,which is not possible by fusion welding processes.The melting points of magnesium(Mg)and copper(Cu)have a significant difference(nearly 400℃)and this may lead to a large difference in the microstructure and joint performance of Mg-Cu joints.However,diffusion bonding can be used to join these alloys without much difficulty.This work analyses the effect of parameters on diffusion layer thickness,hardness and strength of magnesium-copper dissimilar joints.The experiments were conducted using three-factor,five-level,central composite rotatable design matrix.Empirical relationships were developed to predict diffusion layer thickness,hardness and strength using response surface methodology.It is found that bonding temperature has predominant effect on bond characteristics.Joints fabricated at a bonding temperature of 450℃, bonding pressure of 12 MPa and bonding time of 30 min exhibited maximum shear strength and bonding strength of 66 and 81 MPa, respectively.展开更多
In the present study, impulse pressuring diffu- sion bonding technology （IPDB） was utilized between commercially pure titanium and 304 stainless steel （SS） using pure nickel （Ni） as interlayer metal. The interfa...In the present study, impulse pressuring diffu- sion bonding technology （IPDB） was utilized between commercially pure titanium and 304 stainless steel （SS） using pure nickel （Ni） as interlayer metal. The interfacial microstructures of the bonded joints were investigated by scanning electron microscopy （SEM） and energy dispersive spectroscope （EDS） analyses. It is found that with the aid of the Ni interlayer, the interdiffusion and reaction between Ti and SS can be effectively restricted and robust joints can be obtained. Intermetallic compounds （IMCs） including Ti2Ni, TiNi, and TiNi3 are detected at the Ti/Ni interface; however, only Ni-Fe solid solution is found at the Ni/SS interface. The maximum tensile strength of 358 MPa is obtained by IPDB for 90 s and the fracture takes place along the Ti2Ni and TiNi phase upon tensile loading. The existence of cleavage pattern on the fracture surface indi- cates the brittle nature of the joints.展开更多
The effect of temperature on interface microstructure and shear strength of 1420 A1-Li alloy and 7B04 A1 alloy composite plates prepared by diffusion bonding were investigated. The results indicate the optimum tempera...The effect of temperature on interface microstructure and shear strength of 1420 A1-Li alloy and 7B04 A1 alloy composite plates prepared by diffusion bonding were investigated. The results indicate the optimum temperature for bonding the composite plates is 520℃, a sound bonding interface without continuous intermetallic compound layers and interfacial voids is obtained, and the shear strength value of bond joints can be as high as 190 MPa. An interfacial transition zone is formed due to the alloying elements mutual diffusion during the bonding process. Meanwhile, the effect of temperature on diffusion of alloying elements and interface reaction were discussed in detail, the results show that the higher temperature can increase the diffusion of alloying elements fluxes across the bonding interface, which can accelerate the closure of interfacial voids; meanwhile, when Mg atoms diffuse across the bonding interface, it can react with and break up the surface oxide films into discrete particles, and the removal of interface oxides increases the metal to metal bond areas and improves the bond quality.展开更多
Direct diffusion bonding of an orthorhombic Ti2AlNb base alloy to a TiAl base alloy, Ti-22Al-23Nb-2Ta and Ti-46.2Al-2Cr-2Nb-0.15B （at. pct）, was carried out and the interface microstructure, formation of new phase a...Direct diffusion bonding of an orthorhombic Ti2AlNb base alloy to a TiAl base alloy, Ti-22Al-23Nb-2Ta and Ti-46.2Al-2Cr-2Nb-0.15B （at. pct）, was carried out and the interface microstructure, formation of new phase at the interface and joint strength were characterized. At low temperature, a new phase with AlNb2-structure, Al（Nb, Ti）2, was formed in the interface region adjacent to the O base alloy. The α2 was found to be the major reaction product and developed in the interface region adjacent to the TiAl alloy as well as in the region adjacent to the O base alloy accompanying the formation of Al（Nb, Ti）2. The occurrence of Al（Nb, Ti）2 has been attributed to the different diffusivity of Nb and Al, leading to a eutectoid-like reaction. At relatively high temperature, Al（Nb, Ti）2 did not form due to enhanced diffusion of Nb but a B2-enriched zone formed on the O alloy side instead after long holding time. Only when an appropriate interface microstructure was achieved by optimizing the bonding parameters, could the shear strength of the joint reach 80% of that of the TiAl base alloy.展开更多
This article introduces an element diffusion behavior model for a titanium/steel explosive clad plate characterized by a typical curved interface during the heat-treatment process. A series of heat-treatment experimen...This article introduces an element diffusion behavior model for a titanium/steel explosive clad plate characterized by a typical curved interface during the heat-treatment process. A series of heat-treatment experiments were conducted in the temperature range from 750℃ to 950℃, and the effects of heat-treatment parameters on the microstructural evolution and diffusion behavior were investigated by optical microscopy, scanning electron microscopy, X-ray diffraction analysis, and electron-probe microanalysis. Carbon atoms within the steel matrix were observed to diffuse toward the titanium matrix and to aggregate at the bonding interface at 850℃ or lower; in contrast, when the temperature exceeded 850℃, the mutual diffusion of Ti and Fe occurred, along with the diffusion of C atoms, resulting in the for- marion of Ti-Fe intermetallics （Fe2Ti/FeTi）. The diffusion distances of C, Ti, and Fe atoms increased with increasing heating temperature and/or holding time. On the basis of this diffusion behavior, a novel diffusion model was proposed. This model considers the effects of various factors, including the curvature radius of the curved interface, the diffusion coefficient, the heating temperature, and the holding rime. The experimental results show good agreement with the calculated values. The proposed model could clearly provide a general prediction of the elements＇ diffusion at both straight and curved interfaces.展开更多
Solid-state diffusion bonding is an advanced joining technique, which has been widely used to join similar or dissimilar materials. Generally, it is easy to observe the diffusion behavior during dissimilar bonding, bu...Solid-state diffusion bonding is an advanced joining technique, which has been widely used to join similar or dissimilar materials. Generally, it is easy to observe the diffusion behavior during dissimilar bonding, but for similar bonding the diffusion behavior has yet been observed via experiments. In this study, the diffusion behavior at void tip was firstly observed during similar bonding of stainless steel. Scanning electron microscopy with energy dispersive spectroscopy was used to examine the interface charac- teristic and diffusion behavior. The results showed that a diffusion region was discovered at void tip. Element concentrations of diffusion region were more than those of void region, but less than those of bonded region. This behavior indicated that the diffusion was ongoing at void tip, but the perfect bond has yet formed. The diffusion region was attributed to the interface diffusion from adjacent region to void tip due to the stress gradient along bonding interface. The mass accumulation at void tip transformed the sharp void tip into smooth one at the beginning of void shrinkage, and then resulted in shorter voids.展开更多
With CuMn alloy as interlayer, the transient liquid phase (TLP) diffusion bonding of Cu alloys (CuAlBe) to stainless steel (1Cr18Ni9Ti) was studied. The results show that the bonding pressure, time and temperature and...With CuMn alloy as interlayer, the transient liquid phase (TLP) diffusion bonding of Cu alloys (CuAlBe) to stainless steel (1Cr18Ni9Ti) was studied. The results show that the bonding pressure, time and temperature and the content of Mn in CuMn alloy have great effects on the strength of bonding interface; when they are 1 MPa, 40 min, 1 223 K and 30% respectively, the maximum joint strength of 487 MPa is attained. The fracture occurring at the bonding interface is a plastic one and the effect of Mn has been analyzed.展开更多
Diffusion bonding between Al and Cu was successfully performed by hot isostatic pressing(HIP). To improve the strength of diffusion bonding joint, pure nickel foils with different thickness were used as intermediate l...Diffusion bonding between Al and Cu was successfully performed by hot isostatic pressing(HIP). To improve the strength of diffusion bonding joint, pure nickel foils with different thickness were used as intermediate layer. Microstructure of the interface between Al and Cu was investigated by X-ray diffraction(XRD) technique, secondary electron microscopy(SEM), and nano-indentation tests. When the temperature was 500 ℃ and held for 3 h with a processing pressure of 50 MPa, Al and Cu could be bonded with its interface formed by several diffusion layers. With the addition of Ni interlayer, the diffusion of aluminum atoms was effectively hindered, and the interface became smoother. The tensile strength of bonded joints increases with increasing the thickness of Ni interlayer, which contributes to a reduction in the thickness of intermetallic compounds(IMCs) and well bonding quality of Al-Cu joints.展开更多
High entropy alloys have special microstructure and remarkable properties.To explore their potential engineering application in high temperature structures,the microstructure evolution of bonding interface,the element...High entropy alloys have special microstructure and remarkable properties.To explore their potential engineering application in high temperature structures,the microstructure evolution of bonding interface,the elemental diffusion behavior and mechanical property of the diffusion bonded joint between AlCoCrFeNi2.1eutectic high entropy alloy(EHEA)and TiAl alloy were investigated.Four reaction layers(rodlike B2 phase,Al(Co,Ni)2Ti,τ3-Al3NiTi2+TiAl,τ3-Al3NiTi2+TiAl+Ti3Al)formed in the diffusion zone near FCC phase of EHEA,but three layers(Al(Co,Ni)2Ti,τ3-Al3Ni Ti2+Ti Al,τ3-Al3Ni Ti2+Ti Al+Ti3Al)formed near B2 phase.Al and Ni controlled the reaction diffusion of EHEA and TiAl alloy,coarsened the acicular precipitated B2 phase and turned Ti Al phase into Al(Co,Ni)2Ti andτ3-Al3NiTi2 phases.All these reaction layers grew in a parabolic manner as a function of bonding temperature.Rodlike B2 phase has the lowest growth activation energy of 125.2 kJ/mol,and the growth activation energy ofτ3-Al3Ni Ti2+TiAl layer near B2 phase is much lower than that near FCC phase.The penetration phenomenon and convex structure formed in the diffusion zone,which resulted in interlocking effect and enhanced the strength of resultant joints.The highest shear strength of 449 MPa was achieved at 950℃.And the brittle fracture generally initiated at the interface between Al(Co,Ni)2Ti andτ3-Al3NiTi2+TiAl layers.展开更多
The experimental investigation of the direct diffusion bonding of Ti-6Al-4V to ZQSn10-10 was carried out in vacuum. The microstructure of bonded joint was studied by scanning electron microscopy （SEM）, energy disper...The experimental investigation of the direct diffusion bonding of Ti-6Al-4V to ZQSn10-10 was carried out in vacuum. The microstructure of bonded joint was studied by scanning electron microscopy （SEM）, energy dispersive spectroscopy （ EDS ） and the mechanical properties were detected by the tensile experiments. The microstructure and tensile strength of the joint mainly depend on the bonding temperature and bonding time. A satisfying diffusion bonded interface with a tensile strength of 73.9 MPa can be obtained under the condition of bonding temperature 850℃ for 30 rain. Three kinds of reaction products were observed in the bonded interface, namely β-Ti, CoaTi and CuSn3Ti5. And the brittle Cu3Ti and CuSn3 Ti5 are mainly responsible for lowering the strength of the bonded joint. The diffusion distances of Sn , Cu and Ti and square root of bonding time are approximately linear relationship. And diffusion velocity of Sn, Cu and Ti in the diffusion reaction layer are 0. 013 9,0. 069 7 and 0. 056 4 mm^2/s.展开更多
The effects of thermal cycle parameters on the tensile strength and fracture characteristics of phase transformation diffusion bonding(PTDB) joint of titanium and stainless steel (Ti/SS) were studied in this paper. Wi...The effects of thermal cycle parameters on the tensile strength and fracture characteristics of phase transformation diffusion bonding(PTDB) joint of titanium and stainless steel (Ti/SS) were studied in this paper. With the maximum cyclic temperature of 1 173～1 223 K , the minimum cyclic temperature of 1 073～1 093 K , the heating velocity of 30～50 K/s , the cooling velocity of 15～20 K/s , the cycle numbers of 15～20 and bonding pressure is 13 MPa , the tensile strength of joint is more than 380 MPa , exceeding 80% of that of Ti.展开更多
基金support from National Natural Science Foundation of China(NSFC,Grant numbers U22A20185,U21A20128,52175302 and 52305353)Aeronautical Science Foundation(ASFC-20230036077001)Fundamental Research Funds for the Central Universities(2022FRFK060009,HIT.DZI1.2023012).
文摘The excellent irradiation resistance,high strength and plasticity exhibited by high-entropy alloys(HEAs)make it candidate for engin-eering applications.Diffusion bonding of Al_(0.3)CoCrFeNi single-phase HEAs was carried out using electric-assisted diffusion bonding(EADB),and the effect of bonding temperature on the evolution of the interfacial microstructure and the mechanical properties was investigated.The results indicate that as the bonding temperature increases,the pores at the interface gradually decrease in size and undergo closure.The electric current significantly promotes the pore closure mechanism dominated by plastic deformation at the diffusion interface and promotes the recrystallisation behavior at the interface,and the fracture mode changes from intergranular fracture at the interface to jagged fracture along the grains spanning the weld parent material.Due to the activation effect of EADB,higher-strength diffusion bonding of high-entropy alloys can be achieved at the same temperature compared with the conventional hot-pressure diffusion bonding(HPDB)process.
基金supported by the National Natural Science Foundation of China(Grant No.12372351).
文摘In this study, to meet the development and application requirements for high-strength and hightoughness energetic structural materials, a representative volume element of a TA15 matrix embedded with a TaZrNb sphere was designed and fabricated via diffusion bonding. The mechanisms of the microstructural evolution of the TaZrNb/TA15 interface were investigated via SEM, EBSD, EDS, and XRD.Interface mechanical property tests and in-situ tensile tests were conducted on the sphere-containing structure, and an equivalent tensile-strength model was established for the structure. The results revealed that the TA15 titanium alloy and joint had high density and no pores or cracks. The thickness of the planar joint was approximately 50-60 μm. The average tensile and shear strengths were 767 MPa and 608 MPa, respectively. The thickness of the spherical joint was approximately 60 μm. The Zr and Nb elements in the joint diffused uniformly and formed strong bonds with Ti without forming intermetallic compounds. The interface exhibited submicron grain refinement and a concave-convex interlocking structure. The tensile fracture surface primarily exhibited intergranular fracture combined with some transgranular fracture, which constituted a quasi-brittle fracture mode. The shear fracture surface exhibited brittle fracture with regular arrangements of furrows. Internal fracture occurred along the spherical interface, as revealed by advanced in-situ X-ray microcomputed tomography. The experimental results agreed well with the theoretical predictions, indicating that the high-strength interface contributes to the overall strength and toughness of the sphere-containing structure.
基金supported by the National Natural Science Foundation of China(No.52474401)the Project funded by the China Postdoctoral Science Foundation(No.2022M712919)+1 种基金Open Project of State Key Laboratory of Advanced Brazing Filler Metals and Technology(SKLABFMT-2021-03)Guangdong Basic and Applied Basic Research Foundation(2023A1515140124).
文摘The unclear interfacial characteristics of Ag/Cu interface during diffusion welding limit the improvement of mechanical properties of Ag/Cu bimetallic strips.The growth orientation and evolution of Ag and Cu crystals between Ag and Cu strips were investigated by electron backscatter diffraction(EBSD)analysis,and the interfacial properties of various Ag/Cu interfacial configurations were calculated using first-principles calculations to elucidate the diversified interfacial characteristics.Three interface bonding states,including Ag(100)/Cu(100),Ag(110)/Cu(110)and Ag(111)/Cu(111),were preferentially formed in Ag/Cu bimetallic strips during roll bonding.The intensity of Ag(100)/Cu(100)interface increases with the increasing deformation amounts during cold rolling,accompanied by the decreased intensity of Ag(110)/Cu(110)and Ag(111)/Cu(111)interfaces.The largest adsorption work and lowest interface energy of Ag(100)/Cu(100)interface at the“center”position reveal the transition from Ag(110)/Cu(110)and Ag(111)/Cu(111)interfaces to Ag(100)/Cu(100)interface.
基金supported by the National Natural Science Foundation of China(Nos.52071021,51871012)Beijing Natural Science Foundation,China(No.2162024)+1 种基金the Fundamental Research Funds for the Central Universities,China(No.FRF-GF-20-20B)the National Program on Key Basic Research Project of China(No.2011CB605502).
文摘High Nbβ/γ-TiAl(HNBG)intermetallics and Ni-based superalloy(IN718)were diffusion-bonded using pure Ti foil interlayer under pulse current.The microstructure,element segregation,and mechanical properties of HNBG/Ti/IN718 joint were investigated.The effect of Ti interlayer on microstructure and mechanical properties of the joint was discussed.The typical microstructure of HNBG/Ti/IN718 joint was HNBG//β/B2,τ_(3)-NiAl_(3)Ti_(2)//α_(2)-Ti_(3)Al//α-Ti+δ-NiTi_(2),β-Ti//δ-NiTi_(2)//β2-(Ni,Fe)Ti//Cr/Fe-richη-Ni_(3)Ti,η-Ni_(3)Ti,α-Cr,δ-Ni_(3)Nb//η-Ni_(3)Ti,γ-Ni,δ-Ni_(3)Nb//IN718.The gaps and Kirkendall voids exhibited a gradual disappearance with increasing bonding temperature.The mechanism of Cr,Fe and Nb elements segregation was that NiTi phase hindered the diffusion of them.The nano-indentation results demonstrated that diffusion zones on IN718 alloy side had higher hardness.The maximum shear strength of the joint(326 MPa)was achieved at bonding parameters of 850℃,20 min and 10 MPa.The fracture occurred in Zones IV and V,and the fracture modes were brittle fracture and cleavage fracture.The introduction of Ti interlayer resulted in improved microstructure and enhanced bonding strength of the joint.
基金Project(2022YFB3707201) supported by the National Key R&D Program of ChinaProject(U2341254) supported by the Ye Qisun Science Foundation of National Natural Science Foundation of China+1 种基金Projects(0604022GH0202143,0604022SH0201143) supported by the NPU Aoxiang Distinguished Young Scholars,ChinaProject supported by the Funding of Young Top-notch Talent of the National Ten Thousand Talent Program,China。
文摘Effects of ultrasonic bonding parameters on atomic diffusion, microstructure at the Al-Au interface, and shear strength of Al-Au ultrasonic bonding were investigated by the combining experiments and finite element (FE) simulation. The quantitative model of atomic diffusion, which is related to the ultrasonic bonding parameters, time and distance, is established to calculate the atomic diffusion of the Al-Au interface. The maximum relative error between the calculated and experimental fraction of Al atom is 7.35%, indicating high prediction accuracy of this model. During the process of ultrasonic bonding, Au8Al3 is the main intermetallic compound (IMC) at the Al-Au interface. With larger bonding forces, higher ultrasonic powers and longer bonding time, it is more difficult to remove the oxide particles from the Al-Au interface, which hinders the atomic diffusion. Therefore, the complicated stress state and the existence of oxide particles both promotes the formation of holes. The shear strength of Al-Au ultrasonic bonding increases with increasing bonding force, ultrasonic power and bonding time. However, combined with the presence of holes at especial parameters, the optimal ultrasonic bonding parameter is confirmed to be a bonding force of 23 gf, ultrasonic power of 75 mW and bonding time of 21 ms.
基金Project(51275416)supported by the National Natural Science Foundation of China
文摘The bonding interface characteristic and shear strength of diffusion bonded Ti-17 titanium alloy at different bonding time were investigated. The results show that the average size of voids decreases while the amount of voids decreases after increasing to the maximum value with the increasing bonding time. The irregular void with a scraggly edge tends to an ellipse void with smooth surface and then changes to a tiny void with round shape. The grains across bonding interface occur at bonding time of 60 min. The shear strength of bond increases with increasing bonding time, and the highest shear strength of bond is 887.4 MPa at 60 min. The contribution of plastic deformation on the void closure and the increase of shear strength is significant even though the action time of plastic deformation is short.
基金Project(51075205)supported by the National Natural Science Foundation of China
文摘Diffusion bonding between tungsten and 0Cr13Al stainless steel using a Cu/90W-10Ni powder mixtures/Ni multi-interlayer was carried out in vacuum at 1150 °C with a pressure of 5 MPa for 60 min. The microstructures, composition distribution and fracture characteristics of the joint were studied by SEM and EDS. Joint properties were evaluated by shear experiments and thermal shock tests. The results showed that the joints comprised tungsten/Cu-Ni sub-layer/W-Ni composites sub-layer/Ni sub-layer/0Cr13Al stainless steel. The W-Ni composites sub-layer with a homogeneous and dense microstructure was formed by solid phase sintering of 90W-10Ni powder mixtures. Sound bonding between tungsten base material and W-Ni composites sub-layer was realized based on transient liquid phase (TLP) diffusion bonding mechanism. Joints fractured at bonding zone of W-Ni composites sub-layer and Ni sub-layer during shear testing, and the average strength was 256 MPa. Thermal shock tests showed that joints could withstood 60 thermal cycles quenching from 700 °C to room temperature.
基金Project (10972190) supported by the National Natural Science Foundation of China Projects (09A089, 08C207) supported by the Scientific Research Fund of Hunan Provincial Education Department,ChinaProject (2010FJ3132) supported by the Planned Science and Technology Project of Hunan Province,China
文摘BN coated A1203 fibre-reinforced NiAl-alloy composites were fabricated by hot pressing at 1 200-1 400 ℃, and the interracial microstructure and chemical stability of BN coated Al2O3 fibre-reinforced NiAl-alloy composites were investigated by scanning electron microscopy （SEM） and analytical transmission electron microscopy （TEM）. It was found that the complicated chemical reactions and diffusion processes happened in the interface area between BN-layer and Ni25.8A19.6Ta8.3 during the hot pressing at 1 200-1 400 ℃. A continuous AlN-layer was formed at the interface due to the reaction between NiAl and BN. At the same time, Cr diffused extensively into the BN-layer and reacted with boron to form Cr boride precipitates （CrsB3）. In addition, a few particles of Ta-rich phase were also precipitated in NiAl matrix near the interface.
文摘The superplasticity and diffusion bonding of IN718 superalloy were studied in this article. The strain rate sensitivity index m was obtained at different temperatures and various initial strain rates using the tensile speed mutation method; m reached its maximum value 0.53 at an initial strain rate of 1×10^-4s^-1 at 1253K. The diffusion bonding parameters, including the bonding temperature T, pressure p, and time t, affected the mechanism of joints. When the bonded specimen with 25μm thick nickel foil interlayer was tensile at room temperature, the shear fracture of the joints with nickel foil interlayer took place at the IN718 part. Microstructure study was carried out with the bonded samples. The microstructure shows an excellent bonding at the interfaces. The optimum parameters for the diffusion bonding are： T = 1273-1323K, p = 20-30MPa, t = 45-60min.
基金support rendered through a Major Research Project No. F-31-51/2005(SR)
文摘In many circumstances,dissimilar metals have to be bonded together and the resulting joint interfaces must typically sustain mechanical and/or electrical forces without failure,which is not possible by fusion welding processes.The melting points of magnesium(Mg)and copper(Cu)have a significant difference(nearly 400℃)and this may lead to a large difference in the microstructure and joint performance of Mg-Cu joints.However,diffusion bonding can be used to join these alloys without much difficulty.This work analyses the effect of parameters on diffusion layer thickness,hardness and strength of magnesium-copper dissimilar joints.The experiments were conducted using three-factor,five-level,central composite rotatable design matrix.Empirical relationships were developed to predict diffusion layer thickness,hardness and strength using response surface methodology.It is found that bonding temperature has predominant effect on bond characteristics.Joints fabricated at a bonding temperature of 450℃, bonding pressure of 12 MPa and bonding time of 30 min exhibited maximum shear strength and bonding strength of 66 and 81 MPa, respectively.
基金financially supported by the National Natural Science Foundation of China(No.50675234)
文摘In the present study, impulse pressuring diffu- sion bonding technology （IPDB） was utilized between commercially pure titanium and 304 stainless steel （SS） using pure nickel （Ni） as interlayer metal. The interfacial microstructures of the bonded joints were investigated by scanning electron microscopy （SEM） and energy dispersive spectroscope （EDS） analyses. It is found that with the aid of the Ni interlayer, the interdiffusion and reaction between Ti and SS can be effectively restricted and robust joints can be obtained. Intermetallic compounds （IMCs） including Ti2Ni, TiNi, and TiNi3 are detected at the Ti/Ni interface; however, only Ni-Fe solid solution is found at the Ni/SS interface. The maximum tensile strength of 358 MPa is obtained by IPDB for 90 s and the fracture takes place along the Ti2Ni and TiNi phase upon tensile loading. The existence of cleavage pattern on the fracture surface indi- cates the brittle nature of the joints.
基金financially supported by the Major State Basic Research Development Program of China(No.2011CB012803)the National Natural Science Foundation of China (No. 51334006)
文摘The effect of temperature on interface microstructure and shear strength of 1420 A1-Li alloy and 7B04 A1 alloy composite plates prepared by diffusion bonding were investigated. The results indicate the optimum temperature for bonding the composite plates is 520℃, a sound bonding interface without continuous intermetallic compound layers and interfacial voids is obtained, and the shear strength value of bond joints can be as high as 190 MPa. An interfacial transition zone is formed due to the alloying elements mutual diffusion during the bonding process. Meanwhile, the effect of temperature on diffusion of alloying elements and interface reaction were discussed in detail, the results show that the higher temperature can increase the diffusion of alloying elements fluxes across the bonding interface, which can accelerate the closure of interfacial voids; meanwhile, when Mg atoms diffuse across the bonding interface, it can react with and break up the surface oxide films into discrete particles, and the removal of interface oxides increases the metal to metal bond areas and improves the bond quality.
文摘Direct diffusion bonding of an orthorhombic Ti2AlNb base alloy to a TiAl base alloy, Ti-22Al-23Nb-2Ta and Ti-46.2Al-2Cr-2Nb-0.15B （at. pct）, was carried out and the interface microstructure, formation of new phase at the interface and joint strength were characterized. At low temperature, a new phase with AlNb2-structure, Al（Nb, Ti）2, was formed in the interface region adjacent to the O base alloy. The α2 was found to be the major reaction product and developed in the interface region adjacent to the TiAl alloy as well as in the region adjacent to the O base alloy accompanying the formation of Al（Nb, Ti）2. The occurrence of Al（Nb, Ti）2 has been attributed to the different diffusivity of Nb and Al, leading to a eutectoid-like reaction. At relatively high temperature, Al（Nb, Ti）2 did not form due to enhanced diffusion of Nb but a B2-enriched zone formed on the O alloy side instead after long holding time. Only when an appropriate interface microstructure was achieved by optimizing the bonding parameters, could the shear strength of the joint reach 80% of that of the TiAl base alloy.
文摘This article introduces an element diffusion behavior model for a titanium/steel explosive clad plate characterized by a typical curved interface during the heat-treatment process. A series of heat-treatment experiments were conducted in the temperature range from 750℃ to 950℃, and the effects of heat-treatment parameters on the microstructural evolution and diffusion behavior were investigated by optical microscopy, scanning electron microscopy, X-ray diffraction analysis, and electron-probe microanalysis. Carbon atoms within the steel matrix were observed to diffuse toward the titanium matrix and to aggregate at the bonding interface at 850℃ or lower; in contrast, when the temperature exceeded 850℃, the mutual diffusion of Ti and Fe occurred, along with the diffusion of C atoms, resulting in the for- marion of Ti-Fe intermetallics （Fe2Ti/FeTi）. The diffusion distances of C, Ti, and Fe atoms increased with increasing heating temperature and/or holding time. On the basis of this diffusion behavior, a novel diffusion model was proposed. This model considers the effects of various factors, including the curvature radius of the curved interface, the diffusion coefficient, the heating temperature, and the holding rime. The experimental results show good agreement with the calculated values. The proposed model could clearly provide a general prediction of the elements＇ diffusion at both straight and curved interfaces.
基金financially supported by the National Natural Science Foundation of China (Nos.51505386 and 51275416)the Fundamental Research funds for the Central Universities (No.3102017GX06003)
文摘Solid-state diffusion bonding is an advanced joining technique, which has been widely used to join similar or dissimilar materials. Generally, it is easy to observe the diffusion behavior during dissimilar bonding, but for similar bonding the diffusion behavior has yet been observed via experiments. In this study, the diffusion behavior at void tip was firstly observed during similar bonding of stainless steel. Scanning electron microscopy with energy dispersive spectroscopy was used to examine the interface charac- teristic and diffusion behavior. The results showed that a diffusion region was discovered at void tip. Element concentrations of diffusion region were more than those of void region, but less than those of bonded region. This behavior indicated that the diffusion was ongoing at void tip, but the perfect bond has yet formed. The diffusion region was attributed to the interface diffusion from adjacent region to void tip due to the stress gradient along bonding interface. The mass accumulation at void tip transformed the sharp void tip into smooth one at the beginning of void shrinkage, and then resulted in shorter voids.
文摘With CuMn alloy as interlayer, the transient liquid phase (TLP) diffusion bonding of Cu alloys (CuAlBe) to stainless steel (1Cr18Ni9Ti) was studied. The results show that the bonding pressure, time and temperature and the content of Mn in CuMn alloy have great effects on the strength of bonding interface; when they are 1 MPa, 40 min, 1 223 K and 30% respectively, the maximum joint strength of 487 MPa is attained. The fracture occurring at the bonding interface is a plastic one and the effect of Mn has been analyzed.
基金Funded by National Science and Technology Major Project(No.2017-Ⅵ-0009-0080)Science and Technology Planning Project of Wuhan(No.2018010401011281).
文摘Diffusion bonding between Al and Cu was successfully performed by hot isostatic pressing(HIP). To improve the strength of diffusion bonding joint, pure nickel foils with different thickness were used as intermediate layer. Microstructure of the interface between Al and Cu was investigated by X-ray diffraction(XRD) technique, secondary electron microscopy(SEM), and nano-indentation tests. When the temperature was 500 ℃ and held for 3 h with a processing pressure of 50 MPa, Al and Cu could be bonded with its interface formed by several diffusion layers. With the addition of Ni interlayer, the diffusion of aluminum atoms was effectively hindered, and the interface became smoother. The tensile strength of bonded joints increases with increasing the thickness of Ni interlayer, which contributes to a reduction in the thickness of intermetallic compounds(IMCs) and well bonding quality of Al-Cu joints.
基金the National Natural Science Foundation of China(Nos.51605075 and 51674060)the China Postdoctoral Science Foundation(No.2018T110217)+1 种基金the Scientific Research Foundation for Doctor,Liaoning Province of China(No.20170520375)the Fundamental Research Funds for the Central Universities(Nos.DUT18RC(4)032 and DUT18LAB01)。
文摘High entropy alloys have special microstructure and remarkable properties.To explore their potential engineering application in high temperature structures,the microstructure evolution of bonding interface,the elemental diffusion behavior and mechanical property of the diffusion bonded joint between AlCoCrFeNi2.1eutectic high entropy alloy(EHEA)and TiAl alloy were investigated.Four reaction layers(rodlike B2 phase,Al(Co,Ni)2Ti,τ3-Al3NiTi2+TiAl,τ3-Al3NiTi2+TiAl+Ti3Al)formed in the diffusion zone near FCC phase of EHEA,but three layers(Al(Co,Ni)2Ti,τ3-Al3Ni Ti2+Ti Al,τ3-Al3Ni Ti2+Ti Al+Ti3Al)formed near B2 phase.Al and Ni controlled the reaction diffusion of EHEA and TiAl alloy,coarsened the acicular precipitated B2 phase and turned Ti Al phase into Al(Co,Ni)2Ti andτ3-Al3NiTi2 phases.All these reaction layers grew in a parabolic manner as a function of bonding temperature.Rodlike B2 phase has the lowest growth activation energy of 125.2 kJ/mol,and the growth activation energy ofτ3-Al3Ni Ti2+TiAl layer near B2 phase is much lower than that near FCC phase.The penetration phenomenon and convex structure formed in the diffusion zone,which resulted in interlocking effect and enhanced the strength of resultant joints.The highest shear strength of 449 MPa was achieved at 950℃.And the brittle fracture generally initiated at the interface between Al(Co,Ni)2Ti andτ3-Al3NiTi2+TiAl layers.
基金This research was supported by National Natural Science Foundation of China(No 50375065)State Key Laboratory of Advanced Welding Production Technology(04005)
文摘The experimental investigation of the direct diffusion bonding of Ti-6Al-4V to ZQSn10-10 was carried out in vacuum. The microstructure of bonded joint was studied by scanning electron microscopy （SEM）, energy dispersive spectroscopy （ EDS ） and the mechanical properties were detected by the tensile experiments. The microstructure and tensile strength of the joint mainly depend on the bonding temperature and bonding time. A satisfying diffusion bonded interface with a tensile strength of 73.9 MPa can be obtained under the condition of bonding temperature 850℃ for 30 rain. Three kinds of reaction products were observed in the bonded interface, namely β-Ti, CoaTi and CuSn3Ti5. And the brittle Cu3Ti and CuSn3 Ti5 are mainly responsible for lowering the strength of the bonded joint. The diffusion distances of Sn , Cu and Ti and square root of bonding time are approximately linear relationship. And diffusion velocity of Sn, Cu and Ti in the diffusion reaction layer are 0. 013 9,0. 069 7 and 0. 056 4 mm^2/s.
文摘The effects of thermal cycle parameters on the tensile strength and fracture characteristics of phase transformation diffusion bonding(PTDB) joint of titanium and stainless steel (Ti/SS) were studied in this paper. With the maximum cyclic temperature of 1 173～1 223 K , the minimum cyclic temperature of 1 073～1 093 K , the heating velocity of 30～50 K/s , the cooling velocity of 15～20 K/s , the cycle numbers of 15～20 and bonding pressure is 13 MPa , the tensile strength of joint is more than 380 MPa , exceeding 80% of that of Ti.
