Great attention has been paid on fabricating diamond wire by using the brazing diamond because of its strong chemical bonding strength and controllability of grits distribution. Although several serving performances o...Great attention has been paid on fabricating diamond wire by using the brazing diamond because of its strong chemical bonding strength and controllability of grits distribution. Although several serving performances of brazed diamond wire have been reported, seldom do these studies refer to its process characteristics. Sawing performances of a brazed diamond wire are investigated and compared with those of a sintered diamond wire on a wire saw machine. The surface topographies of beads selected from the two wires are micro observed before sawing. The sawing tests are carried out in constant feed rate feeding（CFF） and constant normal force feeding（CNFF）. In CFF test, sawing force, power, and the cut depths of positions on contact curve are measured. Then, coupled with the observations of beads topographies, sawing force and its ratio, relations of power against material removal rate, and contact curve linearity are compared and discussed. In CNFF test, the sawing rates of the two wires are investigated. The results indicate that the brazed wire performs with lower sawing force（less 16% of tangential force and 28% of normal force）, more energy efficiency（nearly one-fifth of sawing power is saved）, at a higher sawing rate （the rate is doubled） and with better contact curve linearity as compared with the sintered wire. This proposed research experimentally evaluates the sawing performances of brazed diamond wire from the aspect of process parameters, which can provide a basis for popularizing the brazed diamond wire.展开更多
Based on impulse and vibration machining theories,a mathematical model of cutting force for the electroplated diamond ultrasonic wire saw was established using superposition principle.The differences between the cutti...Based on impulse and vibration machining theories,a mathematical model of cutting force for the electroplated diamond ultrasonic wire saw was established using superposition principle.The differences between the cutting forces with and without ultrasonic effect were analyzed theoretically and experimentally.The results indicate that the cutting force of diamond wire increases along with the spindle speed decrease and the lateral pressure increase.The force in ultrasonic vibration cutting is about 20% to 30% less than that in conventional cutting.Also,the cutting trajectory of single diamond grit in sawing process is simulated,and the reason that the ultrasonic vibration can reduce the cutting force is explained further.展开更多
The cutting process of electroplated diamond wire saw was researched on the basis of impulse and vibration machining theories. The different contact states in the cutting process were analyzed by using the finite elem...The cutting process of electroplated diamond wire saw was researched on the basis of impulse and vibration machining theories. The different contact states in the cutting process were analyzed by using the finite element method. It shows that the cutting stress is uniformly distributed along the direction of the workpiece width in the steady state. A mathematical equation of sawing trajectory was established by using the superposition principle and the cutting experiment of wire saw to calculate the cutting trajectory. The comparison of the theoretical trajectory with the calculated one indicates that the error is less than 15%. The research results provide a theoretic basis for optimization of the saw's cutting process parameters.展开更多
CFRP （carbon fiber reinforced plastic）, which is composed of carbon fibers in a resin matrix, is an extremely strong and light composite material that has found use in the aerospace and automotive industries. CFRP b...CFRP （carbon fiber reinforced plastic）, which is composed of carbon fibers in a resin matrix, is an extremely strong and light composite material that has found use in the aerospace and automotive industries. CFRP boards are very difficult to machine using common machining processes. Various machining artifacts, such as burrs and delamination, occur frequently when machining CFRP. Adequate techniques for machining CFRP have not yet been established. Recently, electroplated diamond wire machining technology has found use in cutting hard, brittle materials such as silicon and sapphire. In this study, we used an electroplated diamond wire saw to cut a CFRP workpiece. We quantified the cutting forces imposed on the workpiece and observed the surface state of the workpiece after cutting. We demonstrated that an electroplated diamond wire tool is suitable for the high-quality machining of CFRP boards.展开更多
The diamond wire-sawing process was developed to cut granite in both quarries and block processing plants.In this paper,swarf was collected from different areas along the sawing arc when sawing three granites.The part...The diamond wire-sawing process was developed to cut granite in both quarries and block processing plants.In this paper,swarf was collected from different areas along the sawing arc when sawing three granites.The particle size distribution and the morphology of the swarf were investigated systematically,along with the swarf formation mechanism in sawing.Granite swarf formation was dominated by transgranular fractures based on the morphology of sawn granite chips and the analysis of sawn chip size.A long cutting arc increased the movement among the swarf,tool,and workpiece,thereby inducing a secondary fracture in the sawn chip.展开更多
Texturing of diamond wire cut wafers using a standard wafer etch process chemistry has always been a challenge in solar cell manufacturing industry. This is due to the change in surface morphology of diamond wire cut ...Texturing of diamond wire cut wafers using a standard wafer etch process chemistry has always been a challenge in solar cell manufacturing industry. This is due to the change in surface morphology of diamond wire cut wafers and the abundant presence of amorphous silicon content, which are introduced from wafer manufacturing industry during sawing of multi-crystalline wafers using ultra-thin diamond wires. The industry standard texturing process for multi-crystalline wafers cannot deliver a homogeneous etched silicon surface, thereby requiring an additive compound, which acts like a surfactant in the acidic etch bath to enhance the texturing quality on diamond wire cut wafers. Black silicon wafers on the other hand require completely a different process chemistry and are normally textured using a metal catalyst assisted etching technique or by plasma reactive ion etching technique. In this paper, various challenges associated with cell processing steps using diamond wire cut and black silicon wafers along with cell electrical results using each of these wafer types are discussed.展开更多
The influence of different technological parameter on material remove rate and surface quality of ZrO2 ceramics is studied using the cutting machining method of electroplate diamond wire saw with ultrasonic vibration....The influence of different technological parameter on material remove rate and surface quality of ZrO2 ceramics is studied using the cutting machining method of electroplate diamond wire saw with ultrasonic vibration.Experimental results show that,compared with the same experiment condition without ultrasonic vibration,this cutting method has the advantages of high material remove rate,good surface quality,little brokenness and so on.展开更多
Monocrystalline silicon(mono-Si)is an important application material in photovoltaic and microelectronic chips.The mono-Si bricks or rods are cut into wafers using diamond wire saw,and the surface and subsurface micro...Monocrystalline silicon(mono-Si)is an important application material in photovoltaic and microelectronic chips.The mono-Si bricks or rods are cut into wafers using diamond wire saw,and the surface and subsurface microstructure properties of wafers are key concerns in the slicing process.This paper conducted experiments on cutting mono-Si using electroplated diamond wire saw,with feed speed,wire speed,and the cut specimen size as influencing factors,and single factor and orthogonal experiments were designed.Then the influence of three factors on the mono-Si wafer surface and subsurface microstructure properties was studied.The research results indicate that within the range of experimental parameters in this paper,the generation of mono-Si wafer surface is the result of materials brittle and ductile removal.In addition to slender grooves and brittle pits,there are typical wavy saw marks on sawed surface that approximate the distribution of a sine function curve,and the height difference between the peaks and valleys(PV)of the waviness changes with the values of three factors.Residual median cracks cause wafer subsurface damage(SSD),and there are also residual lateral cracks that have not fully expanded and removed the material.Increasing wire speed and decreasing feed speed and specimen length will reduce the PV value.The parameter that has the greatest impact on the PV value is the feed speed,followed by the specimen length and wire speed.SSD exhibits the same pattern of change.The research results provide experimental basis for a deeper understanding of the surface and subsurface microstructure characteristics of electroplated diamond wire sawed mono-Si wafers and optimizing process parameters and improving the wafer quality.展开更多
Diamond grits are indispensable for sawing granite or concrete.Each year about 1 000 tons of diamond grits are consumed for such purposes.In all cases,mono crystalline diamond is used.However, polycrystalline grits(po...Diamond grits are indispensable for sawing granite or concrete.Each year about 1 000 tons of diamond grits are consumed for such purposes.In all cases,mono crystalline diamond is used.However, polycrystalline grits(polygrits) are generally better performed than mono grits as abrasives.For example,poly grits of cubic boron nitride(e.g.Borazon(?) CBN-550 of Diamond Innovations) can cut faster and they last longer than mono grits(e.g.Borazon(?) CBN-500). Polygrits of alumina(e.g.Cubitron(?) of 3M) also out perform by far glassy grits(e.g.white alumina).For diamond superabrasives,micron polygrits formed by shock waves may polish as fast as mono grits of the same size,but without causing as much scratches due to the presence of smaller sintered grains.The improved performance of poly grits is attributed to their ability to micro chipping that renews the sharp cutting corners from time to time.By contrast,mono grits tend to round off at low cutting force or macro fracture at high cutting force,so they may lose the cutting ability rapidly. For sawing granite with mesh sizes 40/50 or coarser,poly grits of diamond have not been available until recently.In this research,we have made polygrits in mini cube with sizes of 18/20,20/25,and 30/40.Turbo grinders and wire saws were made by brazing both mono grits and polygrits on steel substrates.Cutting performance on granite demonstrated that grinding speed was faster with turbo grinder,and the surface finish was smoother with wire saw for poly grits than mono ones. Polygrits and mono grits of diamond were mixed for comparison(upper left).Polygrits of mini cubes were brazed on the pearl of a wire saw(upper right).Mono diamond grits were brazed on a turbo grinder(bottom diagrams ).展开更多
基金supported by National Natural Science Foundation of China(Grant Nos. 51235004, 51105148, 51175194)Program for Changjiang Scholars and Innovative Research Team in University of China(Grant No. IRT1063)
文摘Great attention has been paid on fabricating diamond wire by using the brazing diamond because of its strong chemical bonding strength and controllability of grits distribution. Although several serving performances of brazed diamond wire have been reported, seldom do these studies refer to its process characteristics. Sawing performances of a brazed diamond wire are investigated and compared with those of a sintered diamond wire on a wire saw machine. The surface topographies of beads selected from the two wires are micro observed before sawing. The sawing tests are carried out in constant feed rate feeding（CFF） and constant normal force feeding（CNFF）. In CFF test, sawing force, power, and the cut depths of positions on contact curve are measured. Then, coupled with the observations of beads topographies, sawing force and its ratio, relations of power against material removal rate, and contact curve linearity are compared and discussed. In CNFF test, the sawing rates of the two wires are investigated. The results indicate that the brazed wire performs with lower sawing force（less 16% of tangential force and 28% of normal force）, more energy efficiency（nearly one-fifth of sawing power is saved）, at a higher sawing rate （the rate is doubled） and with better contact curve linearity as compared with the sintered wire. This proposed research experimentally evaluates the sawing performances of brazed diamond wire from the aspect of process parameters, which can provide a basis for popularizing the brazed diamond wire.
基金Sponsored by Liaoning Innovation Team Fundation(2008T164)
文摘Based on impulse and vibration machining theories,a mathematical model of cutting force for the electroplated diamond ultrasonic wire saw was established using superposition principle.The differences between the cutting forces with and without ultrasonic effect were analyzed theoretically and experimentally.The results indicate that the cutting force of diamond wire increases along with the spindle speed decrease and the lateral pressure increase.The force in ultrasonic vibration cutting is about 20% to 30% less than that in conventional cutting.Also,the cutting trajectory of single diamond grit in sawing process is simulated,and the reason that the ultrasonic vibration can reduce the cutting force is explained further.
基金Sponsored by Innovation team item fund of Liaoning Province ( 2008T164)
文摘The cutting process of electroplated diamond wire saw was researched on the basis of impulse and vibration machining theories. The different contact states in the cutting process were analyzed by using the finite element method. It shows that the cutting stress is uniformly distributed along the direction of the workpiece width in the steady state. A mathematical equation of sawing trajectory was established by using the superposition principle and the cutting experiment of wire saw to calculate the cutting trajectory. The comparison of the theoretical trajectory with the calculated one indicates that the error is less than 15%. The research results provide a theoretic basis for optimization of the saw's cutting process parameters.
文摘CFRP （carbon fiber reinforced plastic）, which is composed of carbon fibers in a resin matrix, is an extremely strong and light composite material that has found use in the aerospace and automotive industries. CFRP boards are very difficult to machine using common machining processes. Various machining artifacts, such as burrs and delamination, occur frequently when machining CFRP. Adequate techniques for machining CFRP have not yet been established. Recently, electroplated diamond wire machining technology has found use in cutting hard, brittle materials such as silicon and sapphire. In this study, we used an electroplated diamond wire saw to cut a CFRP workpiece. We quantified the cutting forces imposed on the workpiece and observed the surface state of the workpiece after cutting. We demonstrated that an electroplated diamond wire tool is suitable for the high-quality machining of CFRP boards.
文摘The diamond wire-sawing process was developed to cut granite in both quarries and block processing plants.In this paper,swarf was collected from different areas along the sawing arc when sawing three granites.The particle size distribution and the morphology of the swarf were investigated systematically,along with the swarf formation mechanism in sawing.Granite swarf formation was dominated by transgranular fractures based on the morphology of sawn granite chips and the analysis of sawn chip size.A long cutting arc increased the movement among the swarf,tool,and workpiece,thereby inducing a secondary fracture in the sawn chip.
文摘Texturing of diamond wire cut wafers using a standard wafer etch process chemistry has always been a challenge in solar cell manufacturing industry. This is due to the change in surface morphology of diamond wire cut wafers and the abundant presence of amorphous silicon content, which are introduced from wafer manufacturing industry during sawing of multi-crystalline wafers using ultra-thin diamond wires. The industry standard texturing process for multi-crystalline wafers cannot deliver a homogeneous etched silicon surface, thereby requiring an additive compound, which acts like a surfactant in the acidic etch bath to enhance the texturing quality on diamond wire cut wafers. Black silicon wafers on the other hand require completely a different process chemistry and are normally textured using a metal catalyst assisted etching technique or by plasma reactive ion etching technique. In this paper, various challenges associated with cell processing steps using diamond wire cut and black silicon wafers along with cell electrical results using each of these wafer types are discussed.
基金Sponsored by Department of Education University Research Project of Liaoning Province(LN566)
文摘The influence of different technological parameter on material remove rate and surface quality of ZrO2 ceramics is studied using the cutting machining method of electroplate diamond wire saw with ultrasonic vibration.Experimental results show that,compared with the same experiment condition without ultrasonic vibration,this cutting method has the advantages of high material remove rate,good surface quality,little brokenness and so on.
基金supported by the Natural Science Foundation of Shandong Province(No.ZR2022ME261).
文摘Monocrystalline silicon(mono-Si)is an important application material in photovoltaic and microelectronic chips.The mono-Si bricks or rods are cut into wafers using diamond wire saw,and the surface and subsurface microstructure properties of wafers are key concerns in the slicing process.This paper conducted experiments on cutting mono-Si using electroplated diamond wire saw,with feed speed,wire speed,and the cut specimen size as influencing factors,and single factor and orthogonal experiments were designed.Then the influence of three factors on the mono-Si wafer surface and subsurface microstructure properties was studied.The research results indicate that within the range of experimental parameters in this paper,the generation of mono-Si wafer surface is the result of materials brittle and ductile removal.In addition to slender grooves and brittle pits,there are typical wavy saw marks on sawed surface that approximate the distribution of a sine function curve,and the height difference between the peaks and valleys(PV)of the waviness changes with the values of three factors.Residual median cracks cause wafer subsurface damage(SSD),and there are also residual lateral cracks that have not fully expanded and removed the material.Increasing wire speed and decreasing feed speed and specimen length will reduce the PV value.The parameter that has the greatest impact on the PV value is the feed speed,followed by the specimen length and wire speed.SSD exhibits the same pattern of change.The research results provide experimental basis for a deeper understanding of the surface and subsurface microstructure characteristics of electroplated diamond wire sawed mono-Si wafers and optimizing process parameters and improving the wafer quality.
文摘Diamond grits are indispensable for sawing granite or concrete.Each year about 1 000 tons of diamond grits are consumed for such purposes.In all cases,mono crystalline diamond is used.However, polycrystalline grits(polygrits) are generally better performed than mono grits as abrasives.For example,poly grits of cubic boron nitride(e.g.Borazon(?) CBN-550 of Diamond Innovations) can cut faster and they last longer than mono grits(e.g.Borazon(?) CBN-500). Polygrits of alumina(e.g.Cubitron(?) of 3M) also out perform by far glassy grits(e.g.white alumina).For diamond superabrasives,micron polygrits formed by shock waves may polish as fast as mono grits of the same size,but without causing as much scratches due to the presence of smaller sintered grains.The improved performance of poly grits is attributed to their ability to micro chipping that renews the sharp cutting corners from time to time.By contrast,mono grits tend to round off at low cutting force or macro fracture at high cutting force,so they may lose the cutting ability rapidly. For sawing granite with mesh sizes 40/50 or coarser,poly grits of diamond have not been available until recently.In this research,we have made polygrits in mini cube with sizes of 18/20,20/25,and 30/40.Turbo grinders and wire saws were made by brazing both mono grits and polygrits on steel substrates.Cutting performance on granite demonstrated that grinding speed was faster with turbo grinder,and the surface finish was smoother with wire saw for poly grits than mono ones. Polygrits and mono grits of diamond were mixed for comparison(upper left).Polygrits of mini cubes were brazed on the pearl of a wire saw(upper right).Mono diamond grits were brazed on a turbo grinder(bottom diagrams ).
