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IoT Smart Devices Risk Assessment Model Using Fuzzy Logic and PSO 被引量:1
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作者 Ashraf S.Mashaleh Noor Farizah Binti Ibrahim +2 位作者 Mohammad Alauthman Mohammad Almseidin Amjad Gawanmeh 《Computers, Materials & Continua》 SCIE EI 2024年第2期2245-2267,共23页
Increasing Internet of Things(IoT)device connectivity makes botnet attacks more dangerous,carrying catastrophic hazards.As IoT botnets evolve,their dynamic and multifaceted nature hampers conventional detection method... Increasing Internet of Things(IoT)device connectivity makes botnet attacks more dangerous,carrying catastrophic hazards.As IoT botnets evolve,their dynamic and multifaceted nature hampers conventional detection methods.This paper proposes a risk assessment framework based on fuzzy logic and Particle Swarm Optimization(PSO)to address the risks associated with IoT botnets.Fuzzy logic addresses IoT threat uncertainties and ambiguities methodically.Fuzzy component settings are optimized using PSO to improve accuracy.The methodology allows for more complex thinking by transitioning from binary to continuous assessment.Instead of expert inputs,PSO data-driven tunes rules and membership functions.This study presents a complete IoT botnet risk assessment system.The methodology helps security teams allocate resources by categorizing threats as high,medium,or low severity.This study shows how CICIoT2023 can assess cyber risks.Our research has implications beyond detection,as it provides a proactive approach to risk management and promotes the development of more secure IoT environments. 展开更多
关键词 IoT botnet detection risk assessment fuzzy logic particle swarm optimization(PSO) CYBERSECURITY interconnected devices
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Approach to Simplify the Development of IoT Systems that Interconnect Embedded Devices Using a Single Program
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作者 Enol Matilla Blanco Jordán Pascual Espada Rubén Gonzalez Crespo 《Computers, Materials & Continua》 SCIE EI 2023年第11期2463-2480,共18页
Many Internet of Things(IoT)systems are based on the intercommunication among different devices and centralized systems.Nowadays,there are several commercial and research platforms available to simplify the creation o... Many Internet of Things(IoT)systems are based on the intercommunication among different devices and centralized systems.Nowadays,there are several commercial and research platforms available to simplify the creation of such IoT systems.However,developing these systems can often be a tedious task.To address this challenge,a proposed solution involves the implementation of a unified program or script that encompasses the entire system,including IoT devices functionality.This approach is based on an abstraction,integrating the control of the devices in a single program through a programmable object.Subsequently,the proposal processes the unified script to generate the centralized system code and a controller for each device.By adopting this approach,developers will be able to create IoT systems with significantly reduced implementation costs,surpassing current platforms by more than 10%.The results demonstrate that the single program approach can significantly accelerate the development of IoT systems relying on device communication. 展开更多
关键词 IOT interconnected devices IoT platform programing devices devices coordination and communication
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Design of shared bus DSP board in vector network analyzer
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作者 刘丹 王保锐 《Journal of Measurement Science and Instrumentation》 CAS 2013年第4期317-320,共4页
Currently,the mainstream vector network analyzer employs embedded computer module with a digital intermediate frequency(IF)board to form a high performance windows platform.Under this structure,the vector network anal... Currently,the mainstream vector network analyzer employs embedded computer module with a digital intermediate frequency(IF)board to form a high performance windows platform.Under this structure,the vector network analyzer needs a powerful encoding system to arbitrate the bus acquirement,which is usually realized by field-programmable gate array(FPGA)chip.The paper explores the shared bus design method of the digital signal processing(DSP)board in network analyzer.Firsty,it puts an emphasis on the system structure,and then the shared bus communication method is described in detail;Finally,the advantages of the shared bus communication mechanism are summanzed. 展开更多
关键词 shared bus host port interface(HPI) external memory interface(EMIF) field programmable gate array(FPGA) peripherical component interconnect(PCI)interface device
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Reliability Perspective on Nano-silver Sinteringin SiC Power Modules for Space Applications
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作者 Xiaoqi Li Lei Wang +1 位作者 Chenshan Gao Wenbo Wang 《Space(Science & Technology)》 2025年第1期734-743,共10页
In the field of aerospace,power electronics have a broad range of applications.The advent of SiC power devices could markedly improve the performance of existing systems and enable new applications.However,this potent... In the field of aerospace,power electronics have a broad range of applications.The advent of SiC power devices could markedly improve the performance of existing systems and enable new applications.However,this potential cannot be fully realized if SiC dies are packaged with conventional materials and processes that limit performance in areas such as maximum operating temperature and parasitic elements.More importantly,the reliability of SiC device interconnection is also influenced by packaging technology.Compared to solder material,nano-silver sintering offers several advantages:its thermal conductivity is higher than that of solder,and its melting point of 960℃ is markedly greater than that of solder.Additionally,the electromigration rate of nano-silver is typically 1 to 2 orders of magnitude lower than that of solder.These advantages result in superior electrical and thermal performance,as well as enhanced reliability for silicon carbide power modules.This paper provides an overview of nano-silver sintering technology from the perspective of reliability,summarizing considerations for more reliable materials and processes.It also assesses long-term reliability by investigating failure modes observed in standard tests and applications of sintered joints.Challenges and prospects of using this technology in space applications are also discussed. 展开更多
关键词 sic dies sic device interconnection aerospace silicon carbide reliability nano silver sintering performance sic power devices
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Reliability analysis of magnetic logic interconnect wire subjected to magnet edge imperfections
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作者 Bin Zhang Xiaokuo Yang +2 位作者 Jiahao Liu Weiwei Li Jie Xu 《Journal of Semiconductors》 EI CAS CSCD 2018年第2期45-50,共6页
Nanomagnet logic(NML) devices have been proposed as one of the best candidates for the next generation of integrated circuits thanks to its substantial advantages of nonvolatility, radiation hardening and potentiall... Nanomagnet logic(NML) devices have been proposed as one of the best candidates for the next generation of integrated circuits thanks to its substantial advantages of nonvolatility, radiation hardening and potentially low power. In this article, errors of nanomagnetic interconnect wire subjected to magnet edge imperfections have been evaluated for the purpose of reliable logic propagation. The missing corner defects of nanomagnet in the wire are modeled with a triangle, and the interconnect fabricated with various magnetic materials is thoroughly investigated by micromagnetic simulations under different corner defect amplitudes and device spacings. The results show that as the defect amplitude increases, the success rate of logic propagation in the interconnect decreases. More results show that from the interconnect wire fabricated with materials, iron demonstrates the best defect tolerance ability among three representative and frequently used NML materials, also logic transmission errors can be mitigated by adjusting spacing between nanomagnets. These findings can provide key technical guides for designing reliable interconnects. 展开更多
关键词 nanomagnet logic device defect interconnect reliability
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