The reliability of microsystems is an important issue and for their quality inspection, it is necessary to know the displacements or deformations due to the applied mechanical, thermal, or electrostatic loads. We show...The reliability of microsystems is an important issue and for their quality inspection, it is necessary to know the displacements or deformations due to the applied mechanical, thermal, or electrostatic loads. We show how interferometrical techniques like digital holography and speckle interferometry can be used for the measurement of in plane deformations of microsystems with nanometric accuracy and we give a description of the measurement uncertainties.展开更多
Electronic speckle pattern interferometry（ESPI） and digital speckle pattern interferometry are wellestablished non-contact measurement methods. They have been widely used to carry out precise deformation mapping. Ho...Electronic speckle pattern interferometry（ESPI） and digital speckle pattern interferometry are wellestablished non-contact measurement methods. They have been widely used to carry out precise deformation mapping. However, the simultaneous two-dimensional（2D） or three-dimensional（3D） deformation measurements using ESPI with phase shifting usually involve complicated and slow equipment. In this Letter, we solve these issues by proposing a modified ESPI system based on double phase modulations with only one laser and one camera. In-plane normal and shear strains are obtained with good quality. This system can also be developed to measure 3D deformation, and it has the potential to carry out faster measurements with a highspeed camera.展开更多
Digital speckle pattern interferometry （DSPI） is a high-precision deformation t technique for planar objects. However, for curved objects, the three-dimensional （3D） shape information is needed in order to obtain ...Digital speckle pattern interferometry （DSPI） is a high-precision deformation t technique for planar objects. However, for curved objects, the three-dimensional （3D） shape information is needed in order to obtain correct deformation measurement in DSPI. Thus, combined shape and deformation measurement techniques of DSPI have been proposed. However, the current techniques are either complex in setup or complicated in operation. Furthermore, the operations of some techniques are too slow for real-time measurement. In this work, we propose a DSPI technique for both 3D shape and out-of-plane deformation measurement. Compared with current techniques, the proposed technique is simple in both setup and operation and is capable of fast deformation measurement. Theoretical analysis and experiments are performed. For a cylinder surface with an arch height of 9 mm, the error of out-of-plane deformation measurement is less than 0.15 μm. The effectiveness of the proposed scheme is verified.展开更多
基金supported by the German Research Foundation (DFG) under grants OS111/22 and PA792/4
文摘The reliability of microsystems is an important issue and for their quality inspection, it is necessary to know the displacements or deformations due to the applied mechanical, thermal, or electrostatic loads. We show how interferometrical techniques like digital holography and speckle interferometry can be used for the measurement of in plane deformations of microsystems with nanometric accuracy and we give a description of the measurement uncertainties.
基金financially supported by the ANR Micromorfing Program(ANR-14-CE07-0035)China Scholarship Council(CSC)the Labex Action
文摘Electronic speckle pattern interferometry（ESPI） and digital speckle pattern interferometry are wellestablished non-contact measurement methods. They have been widely used to carry out precise deformation mapping. However, the simultaneous two-dimensional（2D） or three-dimensional（3D） deformation measurements using ESPI with phase shifting usually involve complicated and slow equipment. In this Letter, we solve these issues by proposing a modified ESPI system based on double phase modulations with only one laser and one camera. In-plane normal and shear strains are obtained with good quality. This system can also be developed to measure 3D deformation, and it has the potential to carry out faster measurements with a highspeed camera.
基金supported by the National Key Research and Development Project of China(No.2016YFF0200700)the National Natural Science Foundation of China(No.61405111)
文摘Digital speckle pattern interferometry （DSPI） is a high-precision deformation t technique for planar objects. However, for curved objects, the three-dimensional （3D） shape information is needed in order to obtain correct deformation measurement in DSPI. Thus, combined shape and deformation measurement techniques of DSPI have been proposed. However, the current techniques are either complex in setup or complicated in operation. Furthermore, the operations of some techniques are too slow for real-time measurement. In this work, we propose a DSPI technique for both 3D shape and out-of-plane deformation measurement. Compared with current techniques, the proposed technique is simple in both setup and operation and is capable of fast deformation measurement. Theoretical analysis and experiments are performed. For a cylinder surface with an arch height of 9 mm, the error of out-of-plane deformation measurement is less than 0.15 μm. The effectiveness of the proposed scheme is verified.
