Mechanical-guided assembly of three-dimensional(3D)mesostructures from pre-defined 2D precursors based on the deterministically controlled buckling has attracted increasing attention in both fundamental and applied re...Mechanical-guided assembly of three-dimensional(3D)mesostructures from pre-defined 2D precursors based on the deterministically controlled buckling has attracted increasing attention in both fundamental and applied research areas,owing to the compelling advantages in developing flexible electronic devices with complex 3D geometries and novel functions.Recently,a buckling-guided strategy was reported to enable assembly of complex 3D mesostructures and electronic devices on cylindrical and cylinder-like substrates,which can be integrated with vascular systems for monitoring of flow rate and other physical signals.A clear understanding of nonlinear buckling deformations of elastic beams assembled on cylindrical substrates is thereby essential for the relevant structural design.In this work,we present a systematic study on the nonlinear deformations of buckled ribbon-type structures on cylindrical substrates.Two representative classes of ribbon-type structures are considered,including arc structures and serpentine structures.Starting with the finite-deformation beam theory,a theoretical model is established to investigate deformed configurations resulted from the controlled buckling,including ribbons assembled on both outer and inner surfaces of the substrate.The structure-substrate contact and self-contact are taken into account in the analyses,which could lead to distinct deformed configurations.Both experimental studies and finite element analyses(FEA)were carried out to validate the developed theoretical model.A demonstrative device design based on the 3D ribbon network outside the cylindrical substrate suggests potential applications in energy harvesting across a broad range of frequency.The theoretical model presented herein could offer insights for the practical design of 3D electronic devices that can be conformally integrated with curvy biological surfaces.展开更多
To reduce the weight and production costs of light-emitting diode （LED） lamps, we applied the principle of the chimney effect to design a cylindrical LED substrate without a radiator. We built a 3D model by using So...To reduce the weight and production costs of light-emitting diode （LED） lamps, we applied the principle of the chimney effect to design a cylindrical LED substrate without a radiator. We built a 3D model by using Solidworks software and applied the flow simulation plug-in to conduct model simulation, thereby optimizing the heat source distribution and substrate thickness. The results indicate that the design achieved optimal cooling with a substrate with an upper extension length of 35 mm, a lower extension length of 8 mm, and a thickness of 1 mm. For a substrate of those dimensions, the highest LED chip temperature was 64.78 ~C, the weight of the sub- strate was 35.09 g, and Rib = 7.00 K/W. If the substrate is powered at 8, 10, and 12 W, its temperature meets LED safety requirements. In physical tests, the highest temperature for a physical 8 W cylindrical LED substrate was 66 ℃, which differed by only 1.22 ℃ from the simulation results, verifying the validity of the simulation. The designed cylindrical LED substrate can be used in high-power LED lamps that do not require radiators. This design is not only excellent for heat dissipation, but also for its low weight, low cost, and simplicity of manufacture.展开更多
基金supported by the National Natural Science Foundation of China(Grant Nos.12225206 and 11921002)the Tsinghua National Laboratory for Information Science and Technology,and a grant from the Institute for Guo Qiang,Tsinghua University(Grant No.2021GQG1009).
文摘Mechanical-guided assembly of three-dimensional(3D)mesostructures from pre-defined 2D precursors based on the deterministically controlled buckling has attracted increasing attention in both fundamental and applied research areas,owing to the compelling advantages in developing flexible electronic devices with complex 3D geometries and novel functions.Recently,a buckling-guided strategy was reported to enable assembly of complex 3D mesostructures and electronic devices on cylindrical and cylinder-like substrates,which can be integrated with vascular systems for monitoring of flow rate and other physical signals.A clear understanding of nonlinear buckling deformations of elastic beams assembled on cylindrical substrates is thereby essential for the relevant structural design.In this work,we present a systematic study on the nonlinear deformations of buckled ribbon-type structures on cylindrical substrates.Two representative classes of ribbon-type structures are considered,including arc structures and serpentine structures.Starting with the finite-deformation beam theory,a theoretical model is established to investigate deformed configurations resulted from the controlled buckling,including ribbons assembled on both outer and inner surfaces of the substrate.The structure-substrate contact and self-contact are taken into account in the analyses,which could lead to distinct deformed configurations.Both experimental studies and finite element analyses(FEA)were carried out to validate the developed theoretical model.A demonstrative device design based on the 3D ribbon network outside the cylindrical substrate suggests potential applications in energy harvesting across a broad range of frequency.The theoretical model presented herein could offer insights for the practical design of 3D electronic devices that can be conformally integrated with curvy biological surfaces.
文摘To reduce the weight and production costs of light-emitting diode （LED） lamps, we applied the principle of the chimney effect to design a cylindrical LED substrate without a radiator. We built a 3D model by using Solidworks software and applied the flow simulation plug-in to conduct model simulation, thereby optimizing the heat source distribution and substrate thickness. The results indicate that the design achieved optimal cooling with a substrate with an upper extension length of 35 mm, a lower extension length of 8 mm, and a thickness of 1 mm. For a substrate of those dimensions, the highest LED chip temperature was 64.78 ~C, the weight of the sub- strate was 35.09 g, and Rib = 7.00 K/W. If the substrate is powered at 8, 10, and 12 W, its temperature meets LED safety requirements. In physical tests, the highest temperature for a physical 8 W cylindrical LED substrate was 66 ℃, which differed by only 1.22 ℃ from the simulation results, verifying the validity of the simulation. The designed cylindrical LED substrate can be used in high-power LED lamps that do not require radiators. This design is not only excellent for heat dissipation, but also for its low weight, low cost, and simplicity of manufacture.
