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Cutting force prediction for circular end milling process 被引量:19
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作者 Wu Baohai Yan Xue +1 位作者 Luo Ming Gao Ge 《Chinese Journal of Aeronautics》 SCIE EI CAS CSCD 2013年第4期1057-1063,共7页
A deduced cutting force prediction model for circular end milling process is presented in this paper. Traditional researches on cutting force model usually focus on linear milling process which does not meet other cut... A deduced cutting force prediction model for circular end milling process is presented in this paper. Traditional researches on cutting force model usually focus on linear milling process which does not meet other cutting conditions, especially for circular milling process. This paper presents an improved cutting force model for circular end milling process based on the typical linear milling force model. The curvature effects of tool path on chip thickness as well as entry and exit angles are analyzed, and the cutting force model of linear milling process is then corrected to fit circular end milling processes. Instantaneous cutting forces during circular end milling process are predicted according to the proposed model. The deduced cutting force model can be used for both linear and circular end milling processes. Finally, circular end milling experiments with constant and variable radial depth were carried out to verify the availability of the proposed method. Experiment results show that measured results and simulated results corresponds well with each other. 展开更多
关键词 Chip thickness Circular end milling cutting force Machining Radial depth Tool path curvature
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Simulated and experimental study of the chip deformation mechanisms of monocrystalline Cu
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作者 Bing Liu Kai Jiang +4 位作者 Yuxiang Chen Haijie Yang Yurong Wang Keyu Sun Haiyang Li 《Nanotechnology and Precision Engineering》 2025年第1期68-78,共11页
Monocrystalline Cu exhibits excellent electrical and signal-transmission properties due to its absence of grain boundaries,making it a critical material for the production of micro-machinery and micro-components;howev... Monocrystalline Cu exhibits excellent electrical and signal-transmission properties due to its absence of grain boundaries,making it a critical material for the production of micro-machinery and micro-components;however,achieving ultrahigh precision and ultralow damage machining of functional devices using traditional techniques such as grinding and polishing is extremely challenging.Consequently,nanocutting has emerged as an efficient means to fabricate monocrystalline materials with complex surface characteristics and high surface integrity.Nevertheless,the macroscopic cutting theory of metal materials cannot be applied to nanocutting.Accordingly,in this paper,both simulations and experiments were conducted to examine the chip deformation mechanisms of monocrystalline Cu.First,large-scale molecular dynamics(MD)simulations were conducted to gain a comprehensive understanding of the deformation behavior during nanocutting.This included examining the influencing factors and the variation patterns of the chip deformation coefficient,cutting force,and minimum cutting thickness.Subsequently,nanocutting experiments were performed using a specially designed nanocutting platform with high-resolution online observation by scanning electron microscopy.The experimental results served to verify the accuracy and reliability of theMDmodeling,as they exhibited excellent consistency with the simulated results.Although this work considered monocrystalline Cu,it is believed that the elucidated chip deformation mechanisms could also be applied to other face-centered-cubic metals.These results are of great value for advancing the understanding of the mechanisms of ultraprecision cutting. 展开更多
关键词 Monocrystalline Cu Nanocutting Chip deformation coefficient cutting force Minimum cutting thickness
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