Tension and shear tests are carried out on composite cross-joints, produced by resin transfer moulding (RTM), stitch-RTM and cobonding techniques separately, to investigate the influences of different production metho...Tension and shear tests are carried out on composite cross-joints, produced by resin transfer moulding (RTM), stitch-RTM and cobonding techniques separately, to investigate the influences of different production methods on their mechanical properties and their failure mechanism. It is concluded from test results that, in terms of mechanical properties, the RTM-made cross-joint holds superiority over other two, and both stitch-RTM and cobonding methods have significant adverse effects on mechanical proper- t...展开更多
系统级封装(system in package,SiP)作为后摩尔时代异构集成的关键技术,其内部多级互连结构的尺寸跨度达3个数量级,而互连尺寸的持续减小导致传统分析方法的成本与难度显著攀升.文中旨在建立一种快速准确的SiP器件评估方法,为器件可靠...系统级封装(system in package,SiP)作为后摩尔时代异构集成的关键技术,其内部多级互连结构的尺寸跨度达3个数量级,而互连尺寸的持续减小导致传统分析方法的成本与难度显著攀升.文中旨在建立一种快速准确的SiP器件评估方法,为器件可靠性设计提供支撑,首先对SiP器件的互连焊点形态进行精准预测,基于该结果构建等效简化的SiP整体模型及可控塌陷芯片互连(controlled collapsed chip connection,C4)、芯片互连(chip connection,C2)专用子模型,以降低仿真计算复杂度,随后采用子模型有限元分析方法,开展实际工况下的热循环有限元仿真,定位应力危险点并进行子模型计算,完成不同互连结构的寿命评估.结果表明,通过有限元仿真成功定位SiP器件的应力危险点,子模型计算有效反映了不同互连结构的力学性能差异,经寿命对比分析最终明确了兼具可靠性与经济性的最优互连结构,同时验证了所建立的等效简化模型及子模型分析方法的准确性与高效性.展开更多
文摘Tension and shear tests are carried out on composite cross-joints, produced by resin transfer moulding (RTM), stitch-RTM and cobonding techniques separately, to investigate the influences of different production methods on their mechanical properties and their failure mechanism. It is concluded from test results that, in terms of mechanical properties, the RTM-made cross-joint holds superiority over other two, and both stitch-RTM and cobonding methods have significant adverse effects on mechanical proper- t...
