The performance and price of copper-based micro linear products are determined by the diameter uniformity.How to accurately detect the wire diameter of long-length copper based micro linear products without cutting or...The performance and price of copper-based micro linear products are determined by the diameter uniformity.How to accurately detect the wire diameter of long-length copper based micro linear products without cutting or damage has always been a technical concern for production enterprises.Herein,a novel approach was developed for nondestructive detection of the average diameter at any given segment of a long copper wire by assessing the adsorption capacity of arginine on its surface.The amount of adsorbent on the surface of the copper wire exhibits a positive correlation with the area,which can be detected by extractive electrospray ionization mass spectrometry(EESI-MS)after online elution with ammonia.The experimental results demonstrated that the analysis can be completed within 15 min,with a good linear relationship between copper wires with different diameters and the adsorption capacity of arginine.The linear correlation coefficient R2was 0.995,the relative standard deviation was 1.10%-2.81%,and the detection limit reached 2.5μm(length of segment=4 cm),showing potential applications for facile measurement of the average diameter of various metal wires.展开更多
The ultrafine copper wire with a diameter of 18μm is prepared via cold drawing process from the single crystal downcast billet(Φ8 mm),taking a drawing strain to 12.19.In this paper,in-depth investigation of the micr...The ultrafine copper wire with a diameter of 18μm is prepared via cold drawing process from the single crystal downcast billet(Φ8 mm),taking a drawing strain to 12.19.In this paper,in-depth investigation of the microstructure feature,texture evolution,mechanical properties,and electrical conductivity of ultrafine wires ranging fromΦ361μm toΦ18μm is performed.Specially,the microstructure feature and texture type covering the whole longitudinal section of ultrafine wires are elaborately characterized.The results show that the average lamella thickness decreases from 1.63μm to 102 nm during the drawing process.Whereas,inhomogeneous texture evolution across different wire sections was observed.The main texture types of copper wires are comprised of<111>,<001>and<112>orientations.Specifically,the peripheral region is primarily dominated by<111>and<112>,while the central region is dominated by<001>and<111>.As the drawing strain increases,the volume fraction of hard orientation<111>with low Schmid factor increases,where notably higher fraction of<111>is resulted from the consumption of<112>and<001>for the wire ofΦ18μm.For drawn copper wire of 18μm,superior properties are obtained with a tensile strength of 729.8 MPa and an electrical conductivity of 86.9%IACS.Furthermore,it is found that grain strengthening,dislocation strengthening,and texture strengthening are three primary strengthening mechanisms of drawn copper wire,while the dislocation density is the main factor on the reducing of conductivity.展开更多
A crystal plasticity finite element model was developed for the drawing deformation of pure copper micro wire,based on rate-dependent crystal plasticity theory.The impact of wire diameter compression ratio on the micr...A crystal plasticity finite element model was developed for the drawing deformation of pure copper micro wire,based on rate-dependent crystal plasticity theory.The impact of wire diameter compression ratio on the micro-mechanical deformation behavior during the wire drawing process was investigated.Results indicate that the internal deformation and slip of the drawn wire are unevenly distributed,forming distinct slip and non-slip zones.Additionally,horizontal strain concentration bands develop within the drawn wire.As the wire diameter compression ratio increases,the strength of the slip systems and the extent of slip zones inside the deformation zone also increase.However,the fluctuating stress state,induced by contact pressure and frictional stress,results in a rough and uneven wire surface and diminishes the stability of the drawing process.展开更多
The texture evolution of cold drawing copper wires produced by continuous casting was measured by X-ray diffractometry and electron back-scatter diffractometry,and was simulated using Taylor model.The results show tha...The texture evolution of cold drawing copper wires produced by continuous casting was measured by X-ray diffractometry and electron back-scatter diffractometry,and was simulated using Taylor model.The results show that in the drawn poly-crystal copper wires produced by traditional continuous casting,111 and 100 duplex fiber texture forms,and with increasing strain,the intensities of 111 and 100 increase.In the drawn single-crystal copper wires produced by Ohno continuous casting,100 rotates to 111,and there is inhomogeneous distribution of fiber texture along radial direction of the wires,which is caused by the distribution of shear deformation.Compared with 100,111 fiber texture is more stable in the drawn copper wires.Comparison of the experimental results with the simulated results shows that the simulation by Taylor model can analyze the texture evolution of drawn copper wires.展开更多
The size effect of copper wire radius (0.04–0.82 mm) on the diffusion-limited current density of an oxygen reduction reaction in stagnant simulated seawater (naturally aerated 0.5 mol/L NaCl) is investigated by poten...The size effect of copper wire radius (0.04–0.82 mm) on the diffusion-limited current density of an oxygen reduction reaction in stagnant simulated seawater (naturally aerated 0.5 mol/L NaCl) is investigated by potentiodynamic polarization and electrochemical impedance spectroscopy (EIS) and compared with the results obtained in 0.5 mol/L H2SO4. In the oxygen diffusion-limited range, size effect is found to occur independent of electrolytes, which is attributed to non-linear diffusion. Additionally, to satisfy application in a marine setting, an empirical equation correlating oxygen diffusion-limited current density to copper wire radius is proposed by fitting experimental data.展开更多
When a lightning current is impressed through a copper wire, the copper wire would be melted. A straight thin copper wire with a diameter of 0.1 mm,~ is melted due to the specific melting Joule heating （j^2t）m in an...When a lightning current is impressed through a copper wire, the copper wire would be melted. A straight thin copper wire with a diameter of 0.1 mm,~ is melted due to the specific melting Joule heating （j^2t）m in an adiabatic condition. However, it has been recognized in the experiment that the thicker copper wires of φ1 mm are not completely melted, but sheared mainly at the connecting terminal by a relatively low impulse current. Electro-magnetic mechanical shearing stress, etc. are discussed in addition to the conventional Joule heating. New broken mechanisms were presumed and proved in the additional experiments.展开更多
The experimental system for electrically exploding single metal wire has been designed and manufactured. Expansion of the dense plasma column formed from an electrically exploding Cu wire of diameter 30 μm has been s...The experimental system for electrically exploding single metal wire has been designed and manufactured. Expansion of the dense plasma column formed from an electrically exploding Cu wire of diameter 30 μm has been studied with a high-speed photographer to obtain the time-dependent radius (R-t) curve. The experimental results demonstrate that the mean expansion rate of the dense plasma column is 1.94 μm/ns, 2.6 μm/ns and 3.75 μm/ns according to the peak pulse current 4.5 kA, 7 kA and 9.5 kA respectively. The results can be beneficial to giving a profound understanding of the early stage of wire-array Z-pinch physics and to improvement on their design.展开更多
In this study for the first time, a novel copper Solid Phase Microextraction (SPME) fiber has been introduced for removal of naphthalene, phenanthrene and anthracene from aqueous solution. Copper was used as a solid s...In this study for the first time, a novel copper Solid Phase Microextraction (SPME) fiber has been introduced for removal of naphthalene, phenanthrene and anthracene from aqueous solution. Copper was used as a solid support, which was at first coated by 3-mercaptopropyltrimethoxysi- lane. A stationary phase of oxidized multi walled carbon nanotube (MWCNTs)) was bonded to the surface of the copper wire. The developed SPME was characterized by IR and Scanning Electron Microscopy (SEM) and coupled to gas chromatography for separation of the analytes. Stability of the fiber, the effect of coating thickness and recovery time were optimized. The MWCNTs film thickness was about 5 μm which was perfect for a rapid mass transfer. The detection limits were at the range of 0.005 to 0.1 μg·L<sup>-1</sup>. The calibration curves were linear R<sup>2</sup> > 0.9813 in the range of 0.01 to 5 μg·L<sup>-1</sup>. The method has been successfully applied for real samples with standard addition of 5 μL<sup>-1</sup> of each sample. Stability study of the fiber to acid and alkali shows that it can be used for more than 50 times.展开更多
By means of annealing at different temperatures, the copper wires with various numbers of grain boundaries were achieved. And the resistivity of copper wires was measured. The results show that with increasing the num...By means of annealing at different temperatures, the copper wires with various numbers of grain boundaries were achieved. And the resistivity of copper wires was measured. The results show that with increasing the number of grain boundaries, the resistivity of copper wires increases, the relationship between the number of grain boundaries and the resistivity of cooper wires can be expressed as y =1.86×10 -8 e -0.90/ x . Unlike dislocation and lattice vacant sites, the curve of the grain boundary vs the resistivity is not linear. Grain boundary controls the general trend of the curve, but the type and the quantity of impurity controls the details of the curve.展开更多
The ultrasonic wedge bonding with d25 μm copper wire was achieved on Au/Ni plated Cu substrate at ambient temperature.Ultrasonic wedge bonding mechanism was investigated by using SEM/EDX,pull test,shear test and micr...The ultrasonic wedge bonding with d25 μm copper wire was achieved on Au/Ni plated Cu substrate at ambient temperature.Ultrasonic wedge bonding mechanism was investigated by using SEM/EDX,pull test,shear test and microhardness test.The results show that the thinning of the Au layer occurs directly below the center of the bonding tool with the bonding power increasing.The interdiffusion between copper wire and Au metallization during the wedge bonding is assumed negligible,and the wedge bonding is achieved by wear action induced by ultrasonic vibration.The ultrasonic power contributes to enhance the deformation of copper wire due to ultrasonic softening effect which is then followed by the strain hardening of the copper wedge bonding.展开更多
By using transmission electron microscopy, the microstructures of drawn industrial single crystal copper wires produced by Ohno Continuous Casting(OCC) process were analyzed. The results show that the typical microstr...By using transmission electron microscopy, the microstructures of drawn industrial single crystal copper wires produced by Ohno Continuous Casting(OCC) process were analyzed. The results show that the typical microstructures in the wires mainly include extended planar dislocation boundaries, a small fraction of twins and some dislocation cells sharing boundaries parallel to drawn direction. Besides the typical microstructures, 9R structure configurations were observed in the wires. The formation of 9R polytypes may be caused by the coupled emission of Shockley dislocations from a boundary.展开更多
Preparation of a glyoxylic acid copper complex and fabrication of fine copper wire by CO2 laser irradiation in air to a thin film of that complex have been investigated. Irradiating laser to the complex thin film spin...Preparation of a glyoxylic acid copper complex and fabrication of fine copper wire by CO2 laser irradiation in air to a thin film of that complex have been investigated. Irradiating laser to the complex thin film spin-coated on a glass substrate, thin film of metallic copper was fabricated in areas that were subjected to laser irradiation in air. The thickness of this thin copper film was approx. 30 to 40 nm, and as non-irradiated areas were etched and removed by a soluble solvent of the copper complex, fine copper wire with 200 μm width was formed by laser direct patterning. The resistivity of this thin copper film depended on the irradiation intensity of the laser and was 3.0 × 10–5 Ω·cm at 12 W intensity (sweep speed: 20 mm/s). This method enables the high-speed deposition of copper wiring in air by a printing process, indicating an inexpensive and useful process for fabricating copper wiring.展开更多
Silver nanoparticles (AgNPs) are directly grown on surface of ~25 μm copper wire by ultrasound-assisted chemical reduction. Silver nitrate is used as precursors, when polyvinylpyrrolidone (PVP) is added as a controll...Silver nanoparticles (AgNPs) are directly grown on surface of ~25 μm copper wire by ultrasound-assisted chemical reduction. Silver nitrate is used as precursors, when polyvinylpyrrolidone (PVP) is added as a controller of the dimension of AgNPs. Influence of growth parameters such as precursor's concentration, ratio proportion of PVP and ultra-sonication on the growth of AgNPs coating are determined. The best morphology, size of the AgNPs are observed on copper wire. The results show that the copper wire coated with AgNPs of^100 nm diameter exhibits good antioxidation and ohmic contact after sinter on Si substrate at a temperature as low as 320℃, is especially suitable as a substitute for silver paste electrode used in silicon solar cells.展开更多
The deformation microstructure evolution of single crystal copper wires produced by OCC method has been studied with the help of TEM, EBSD; OM. The results show that there are a small number of dendrites; twins in the...The deformation microstructure evolution of single crystal copper wires produced by OCC method has been studied with the help of TEM, EBSD; OM. The results show that there are a small number of dendrites; twins in the undeformed single crystal copper wires. However, it is difficult to observe these dendrites in deformed single crystal copper wires. The structure evolution of deformed single crystal copper wires during drawing process can be divided into three stages. When the true strain is lower than 0.94, macroscopic subdivision of grains is not evident,; the microscopic evolution of deformed structure is that the cells are formed; elongated in drawn direction. When the true strain is between 0.94; 1.96, macroscopic subdivision of grains takes place,; the number of microbands located on {111}; cell blocks is much more than that with the true strain lower than 0.94. When the true strain is larger than 1.96, the macroscopic subdivision of grains becomes more evident than that with the true strain between 0.94; 1.96,; S-bands structure; lamellar boundaries will be formed. From EBSD analysis, it is found that part of 100 texture resulting from solidifying is transformed into 111; 112 due to shear deformation, but 100 texture component is still kept in majority. When the true strain is 0.94, the misorientation angle of dislocation boundaries resulting from deformation is lower than 14°. However, when the true strain arrives at 1.96, the misorientation angle of some boundaries will be greater than 50°,; the peak of misorientation angle distribution produced by texture evolution is located in the range between 25°; 30°.展开更多
In this study,we synthesized high-performance Carbon Fiber/Gold/Copper(CF/Au/Cu)composite wires by using a 2-step deposition method via sputtering and electrodeposition.After Au was sputtered on PANbased CFs as a pre-...In this study,we synthesized high-performance Carbon Fiber/Gold/Copper(CF/Au/Cu)composite wires by using a 2-step deposition method via sputtering and electrodeposition.After Au was sputtered on PANbased CFs as a pre-treatment,the wettability and surface reactivity of the CFs were improved,resulting in a homogeneous deposition of Cu on their surface.At different Cu electrodeposition time,the resulting CF/Au/Cu composite wires could possess a high strength of up to 3.27 GPa(~10 times stronger than copper wires)while their electrical conductivity could be as high as 4.4×10^5 S/cm(~75%of that for copper).More importantly,since the composite wires were lightweight(up to 70%lower than Cu mass density),they are a promising candidate to substitute conventional heavy metal wires in the future electrical applications.展开更多
Formation of copper wiring on a polyimide film by laser irradiation to a stable copper-complex film consisting of glyoxylic acid copper complex and methylamine copper complex in air has been investigated. A stable met...Formation of copper wiring on a polyimide film by laser irradiation to a stable copper-complex film consisting of glyoxylic acid copper complex and methylamine copper complex in air has been investigated. A stable metallic copper on the polyimide film was precipitated even in air. Since this copper was generated only in the laser-irradiated parts, direct patterning of copper wiring was possible. It was also found that copper was precipitated by electroless copper plating on the laser-deposited copper wiring and it was possible to thicken the copper wiring by this precipitation. The resistivity of the copper wiring was almost the same as that of the bulk of metallic copper. The developed method—combining laser irradiation to a copper-complex-coated film and electroless copper plating—enables the high-speed deposition of fine copper wiring on a polyimide film in air by a printing process, indicating an inexpensive and useful process for fabricating copper wiring without high vacuum facility and heat-treatment under inert gas.展开更多
CHINESE Cloisonneis the centuries-old handicraft of creating designs on copper bodies with colored-enamel placed within divisions made of copper wires,which are bent to follow the outline of decorative patterns.This f...CHINESE Cloisonneis the centuries-old handicraft of creating designs on copper bodies with colored-enamel placed within divisions made of copper wires,which are bent to follow the outline of decorative patterns.This form of art originated in the Arab world and was introduced to China during the late Yuan Dynasty(1271-1368),and since then it has become a favorite of the country’s emperors.展开更多
The paper studies the twin wire butt welding of 6mm-thick T2 copper and Q235 steel plate by using the twin wire consisting of one copper-plated welding wire and one steel welding wire.According to the appearance detec...The paper studies the twin wire butt welding of 6mm-thick T2 copper and Q235 steel plate by using the twin wire consisting of one copper-plated welding wire and one steel welding wire.According to the appearance detection,the weld joint gained is sound in shape without crackles,pores,incomplete fusion and other defects.As shown by the mechanical property,SEM and EDAX and in the metallographic analysis and test,the rupture position of copper-steel welded joint is located in the copper-part HAZ when the tensile strength reaches above 210MPa and Fe content of the welded joint involved in 1# test specimen reaches around 22.78%-26.75%,with the hardness achieving between 102～107HB and the weld structure being (α+ε) duplex solid solution.展开更多
基金supported by the National Natural Science Foundation of China(No.22422402)National Key Research and Development Program of China(No.2022YFF0705300)Key Research and Development Program of Jiangxi Province(No.20232BBG70004)。
文摘The performance and price of copper-based micro linear products are determined by the diameter uniformity.How to accurately detect the wire diameter of long-length copper based micro linear products without cutting or damage has always been a technical concern for production enterprises.Herein,a novel approach was developed for nondestructive detection of the average diameter at any given segment of a long copper wire by assessing the adsorption capacity of arginine on its surface.The amount of adsorbent on the surface of the copper wire exhibits a positive correlation with the area,which can be detected by extractive electrospray ionization mass spectrometry(EESI-MS)after online elution with ammonia.The experimental results demonstrated that the analysis can be completed within 15 min,with a good linear relationship between copper wires with different diameters and the adsorption capacity of arginine.The linear correlation coefficient R2was 0.995,the relative standard deviation was 1.10%-2.81%,and the detection limit reached 2.5μm(length of segment=4 cm),showing potential applications for facile measurement of the average diameter of various metal wires.
基金Project supported by“Unveiled the List of Commanders”Key Core Common Technology Projects of Ji’an,ChinaProject(LJKMZ20220591)supported by the Basic Scientific Research Project of the Education Department of Liaoning Province,ChinaProject(CSTB2023NSCQ-LZX0116)supported by the Natural Science Foundation Joint Fund for Innovation and Development Projects of Chongqing,China。
文摘The ultrafine copper wire with a diameter of 18μm is prepared via cold drawing process from the single crystal downcast billet(Φ8 mm),taking a drawing strain to 12.19.In this paper,in-depth investigation of the microstructure feature,texture evolution,mechanical properties,and electrical conductivity of ultrafine wires ranging fromΦ361μm toΦ18μm is performed.Specially,the microstructure feature and texture type covering the whole longitudinal section of ultrafine wires are elaborately characterized.The results show that the average lamella thickness decreases from 1.63μm to 102 nm during the drawing process.Whereas,inhomogeneous texture evolution across different wire sections was observed.The main texture types of copper wires are comprised of<111>,<001>and<112>orientations.Specifically,the peripheral region is primarily dominated by<111>and<112>,while the central region is dominated by<001>and<111>.As the drawing strain increases,the volume fraction of hard orientation<111>with low Schmid factor increases,where notably higher fraction of<111>is resulted from the consumption of<112>and<001>for the wire ofΦ18μm.For drawn copper wire of 18μm,superior properties are obtained with a tensile strength of 729.8 MPa and an electrical conductivity of 86.9%IACS.Furthermore,it is found that grain strengthening,dislocation strengthening,and texture strengthening are three primary strengthening mechanisms of drawn copper wire,while the dislocation density is the main factor on the reducing of conductivity.
基金the National Natural Science Foundation of China(Nos.U21A2051,52173297,52071133)the R&D Projects of Henan Academy of Sciences of China(No.220910009)+2 种基金the Key R&D and Promotion Projects of Henan Province of China(No.212102210441)the Joint Fund of Henan Science and Technology R&D Plan of China(No.222103810037)the Zhongyuan Scholar Workstation Funded Project of China(No.214400510028).
文摘A crystal plasticity finite element model was developed for the drawing deformation of pure copper micro wire,based on rate-dependent crystal plasticity theory.The impact of wire diameter compression ratio on the micro-mechanical deformation behavior during the wire drawing process was investigated.Results indicate that the internal deformation and slip of the drawn wire are unevenly distributed,forming distinct slip and non-slip zones.Additionally,horizontal strain concentration bands develop within the drawn wire.As the wire diameter compression ratio increases,the strength of the slip systems and the extent of slip zones inside the deformation zone also increase.However,the fluctuating stress state,induced by contact pressure and frictional stress,results in a rough and uneven wire surface and diminishes the stability of the drawing process.
基金Projects(50771076,50901055)supported by the National Natural Science Foundation of ChinaProject(07JK274)supported by the Education Department Foundation of Shaanxi Province,China
文摘The texture evolution of cold drawing copper wires produced by continuous casting was measured by X-ray diffractometry and electron back-scatter diffractometry,and was simulated using Taylor model.The results show that in the drawn poly-crystal copper wires produced by traditional continuous casting,111 and 100 duplex fiber texture forms,and with increasing strain,the intensities of 111 and 100 increase.In the drawn single-crystal copper wires produced by Ohno continuous casting,100 rotates to 111,and there is inhomogeneous distribution of fiber texture along radial direction of the wires,which is caused by the distribution of shear deformation.Compared with 100,111 fiber texture is more stable in the drawn copper wires.Comparison of the experimental results with the simulated results shows that the simulation by Taylor model can analyze the texture evolution of drawn copper wires.
基金Supported by the National Natural Science Foundation of China (No.50971118)
文摘The size effect of copper wire radius (0.04–0.82 mm) on the diffusion-limited current density of an oxygen reduction reaction in stagnant simulated seawater (naturally aerated 0.5 mol/L NaCl) is investigated by potentiodynamic polarization and electrochemical impedance spectroscopy (EIS) and compared with the results obtained in 0.5 mol/L H2SO4. In the oxygen diffusion-limited range, size effect is found to occur independent of electrolytes, which is attributed to non-linear diffusion. Additionally, to satisfy application in a marine setting, an empirical equation correlating oxygen diffusion-limited current density to copper wire radius is proposed by fitting experimental data.
文摘When a lightning current is impressed through a copper wire, the copper wire would be melted. A straight thin copper wire with a diameter of 0.1 mm,~ is melted due to the specific melting Joule heating （j^2t）m in an adiabatic condition. However, it has been recognized in the experiment that the thicker copper wires of φ1 mm are not completely melted, but sheared mainly at the connecting terminal by a relatively low impulse current. Electro-magnetic mechanical shearing stress, etc. are discussed in addition to the conventional Joule heating. New broken mechanisms were presumed and proved in the additional experiments.
基金The project supported by Pre-research Foundation of Chinese Acadeny of Engineering Physics(No.20010103)
文摘The experimental system for electrically exploding single metal wire has been designed and manufactured. Expansion of the dense plasma column formed from an electrically exploding Cu wire of diameter 30 μm has been studied with a high-speed photographer to obtain the time-dependent radius (R-t) curve. The experimental results demonstrate that the mean expansion rate of the dense plasma column is 1.94 μm/ns, 2.6 μm/ns and 3.75 μm/ns according to the peak pulse current 4.5 kA, 7 kA and 9.5 kA respectively. The results can be beneficial to giving a profound understanding of the early stage of wire-array Z-pinch physics and to improvement on their design.
文摘In this study for the first time, a novel copper Solid Phase Microextraction (SPME) fiber has been introduced for removal of naphthalene, phenanthrene and anthracene from aqueous solution. Copper was used as a solid support, which was at first coated by 3-mercaptopropyltrimethoxysi- lane. A stationary phase of oxidized multi walled carbon nanotube (MWCNTs)) was bonded to the surface of the copper wire. The developed SPME was characterized by IR and Scanning Electron Microscopy (SEM) and coupled to gas chromatography for separation of the analytes. Stability of the fiber, the effect of coating thickness and recovery time were optimized. The MWCNTs film thickness was about 5 μm which was perfect for a rapid mass transfer. The detection limits were at the range of 0.005 to 0.1 μg·L<sup>-1</sup>. The calibration curves were linear R<sup>2</sup> > 0.9813 in the range of 0.01 to 5 μg·L<sup>-1</sup>. The method has been successfully applied for real samples with standard addition of 5 μL<sup>-1</sup> of each sample. Stability study of the fiber to acid and alkali shows that it can be used for more than 50 times.
文摘By means of annealing at different temperatures, the copper wires with various numbers of grain boundaries were achieved. And the resistivity of copper wires was measured. The results show that with increasing the number of grain boundaries, the resistivity of copper wires increases, the relationship between the number of grain boundaries and the resistivity of cooper wires can be expressed as y =1.86×10 -8 e -0.90/ x . Unlike dislocation and lattice vacant sites, the curve of the grain boundary vs the resistivity is not linear. Grain boundary controls the general trend of the curve, but the type and the quantity of impurity controls the details of the curve.
基金Prpject(E052104/50705021)supported by the National Natural Science Foundation of ChinaProject(2006:01504489)supported by the Development Program for Outstanding Young Teachers in HIT
文摘The ultrasonic wedge bonding with d25 μm copper wire was achieved on Au/Ni plated Cu substrate at ambient temperature.Ultrasonic wedge bonding mechanism was investigated by using SEM/EDX,pull test,shear test and microhardness test.The results show that the thinning of the Au layer occurs directly below the center of the bonding tool with the bonding power increasing.The interdiffusion between copper wire and Au metallization during the wedge bonding is assumed negligible,and the wedge bonding is achieved by wear action induced by ultrasonic vibration.The ultrasonic power contributes to enhance the deformation of copper wire due to ultrasonic softening effect which is then followed by the strain hardening of the copper wedge bonding.
基金Project(50771076) supported by the National Natural Science Foundation of ChinaProject(07JK274) supported by the Education Department of Shaanxi Province, China
文摘By using transmission electron microscopy, the microstructures of drawn industrial single crystal copper wires produced by Ohno Continuous Casting(OCC) process were analyzed. The results show that the typical microstructures in the wires mainly include extended planar dislocation boundaries, a small fraction of twins and some dislocation cells sharing boundaries parallel to drawn direction. Besides the typical microstructures, 9R structure configurations were observed in the wires. The formation of 9R polytypes may be caused by the coupled emission of Shockley dislocations from a boundary.
文摘Preparation of a glyoxylic acid copper complex and fabrication of fine copper wire by CO2 laser irradiation in air to a thin film of that complex have been investigated. Irradiating laser to the complex thin film spin-coated on a glass substrate, thin film of metallic copper was fabricated in areas that were subjected to laser irradiation in air. The thickness of this thin copper film was approx. 30 to 40 nm, and as non-irradiated areas were etched and removed by a soluble solvent of the copper complex, fine copper wire with 200 μm width was formed by laser direct patterning. The resistivity of this thin copper film depended on the irradiation intensity of the laser and was 3.0 × 10–5 Ω·cm at 12 W intensity (sweep speed: 20 mm/s). This method enables the high-speed deposition of copper wiring in air by a printing process, indicating an inexpensive and useful process for fabricating copper wiring.
基金financially supported by the National Natuie Science Foundation of China (No 11204082)Shanghai Natural Pond (No, 16ZR1410700)
文摘Silver nanoparticles (AgNPs) are directly grown on surface of ~25 μm copper wire by ultrasound-assisted chemical reduction. Silver nitrate is used as precursors, when polyvinylpyrrolidone (PVP) is added as a controller of the dimension of AgNPs. Influence of growth parameters such as precursor's concentration, ratio proportion of PVP and ultra-sonication on the growth of AgNPs coating are determined. The best morphology, size of the AgNPs are observed on copper wire. The results show that the copper wire coated with AgNPs of^100 nm diameter exhibits good antioxidation and ohmic contact after sinter on Si substrate at a temperature as low as 320℃, is especially suitable as a substitute for silver paste electrode used in silicon solar cells.
基金Supported by the National Natural Science Foundation of China (Grant Nos. 50471098 and 59971033)the Natural Science Foundation of Shaanxi Province, China (Grant No. 2003E101)the Teaching and Research Award Program for Outstanding Young Teachers in Higher Education Institution of MOE, China
文摘The deformation microstructure evolution of single crystal copper wires produced by OCC method has been studied with the help of TEM, EBSD; OM. The results show that there are a small number of dendrites; twins in the undeformed single crystal copper wires. However, it is difficult to observe these dendrites in deformed single crystal copper wires. The structure evolution of deformed single crystal copper wires during drawing process can be divided into three stages. When the true strain is lower than 0.94, macroscopic subdivision of grains is not evident,; the microscopic evolution of deformed structure is that the cells are formed; elongated in drawn direction. When the true strain is between 0.94; 1.96, macroscopic subdivision of grains takes place,; the number of microbands located on {111}; cell blocks is much more than that with the true strain lower than 0.94. When the true strain is larger than 1.96, the macroscopic subdivision of grains becomes more evident than that with the true strain between 0.94; 1.96,; S-bands structure; lamellar boundaries will be formed. From EBSD analysis, it is found that part of 100 texture resulting from solidifying is transformed into 111; 112 due to shear deformation, but 100 texture component is still kept in majority. When the true strain is 0.94, the misorientation angle of dislocation boundaries resulting from deformation is lower than 14°. However, when the true strain arrives at 1.96, the misorientation angle of some boundaries will be greater than 50°,; the peak of misorientation angle distribution produced by texture evolution is located in the range between 25°; 30°.
基金Lloyd’s Register Foundation(R-265-000-553-597)for the financial support for this project.
文摘In this study,we synthesized high-performance Carbon Fiber/Gold/Copper(CF/Au/Cu)composite wires by using a 2-step deposition method via sputtering and electrodeposition.After Au was sputtered on PANbased CFs as a pre-treatment,the wettability and surface reactivity of the CFs were improved,resulting in a homogeneous deposition of Cu on their surface.At different Cu electrodeposition time,the resulting CF/Au/Cu composite wires could possess a high strength of up to 3.27 GPa(~10 times stronger than copper wires)while their electrical conductivity could be as high as 4.4×10^5 S/cm(~75%of that for copper).More importantly,since the composite wires were lightweight(up to 70%lower than Cu mass density),they are a promising candidate to substitute conventional heavy metal wires in the future electrical applications.
文摘Formation of copper wiring on a polyimide film by laser irradiation to a stable copper-complex film consisting of glyoxylic acid copper complex and methylamine copper complex in air has been investigated. A stable metallic copper on the polyimide film was precipitated even in air. Since this copper was generated only in the laser-irradiated parts, direct patterning of copper wiring was possible. It was also found that copper was precipitated by electroless copper plating on the laser-deposited copper wiring and it was possible to thicken the copper wiring by this precipitation. The resistivity of the copper wiring was almost the same as that of the bulk of metallic copper. The developed method—combining laser irradiation to a copper-complex-coated film and electroless copper plating—enables the high-speed deposition of fine copper wiring on a polyimide film in air by a printing process, indicating an inexpensive and useful process for fabricating copper wiring without high vacuum facility and heat-treatment under inert gas.
文摘CHINESE Cloisonneis the centuries-old handicraft of creating designs on copper bodies with colored-enamel placed within divisions made of copper wires,which are bent to follow the outline of decorative patterns.This form of art originated in the Arab world and was introduced to China during the late Yuan Dynasty(1271-1368),and since then it has become a favorite of the country’s emperors.
基金Foundation item:NUST Research Funding,No.2010XQTR01
文摘The paper studies the twin wire butt welding of 6mm-thick T2 copper and Q235 steel plate by using the twin wire consisting of one copper-plated welding wire and one steel welding wire.According to the appearance detection,the weld joint gained is sound in shape without crackles,pores,incomplete fusion and other defects.As shown by the mechanical property,SEM and EDAX and in the metallographic analysis and test,the rupture position of copper-steel welded joint is located in the copper-part HAZ when the tensile strength reaches above 210MPa and Fe content of the welded joint involved in 1# test specimen reaches around 22.78%-26.75%,with the hardness achieving between 102～107HB and the weld structure being (α+ε) duplex solid solution.
