The special point is found in frequency characteristics of one model of an oscillatory contour about which it wasn’t reported in scientific literature earlier. The point settles down at a frequency, the smaller reson...The special point is found in frequency characteristics of one model of an oscillatory contour about which it wasn’t reported in scientific literature earlier. The point settles down at a frequency, the smaller resonant frequency of a contour. The module of an impedance doesn’t depend on the size of active resistance at this frequency. Physical interpretation of the phenomenon doesn’t exist at the moment. This article is continuation of the already research, results of calculations of existence region of the impedance module of an oscillatory contour are for the first time given in it and phase charts are provided. Two models of an oscillatory contour are considered. Existence region of the module of an impedance are essentially different for the considered models. Phase charts of an impedance are calculated depending on relative frequency. Results of research can be used in the electrician and the electronic engineer and manual for profound studying of electrical equipment.展开更多
针对冷轧制备铜/不锈钢复合极薄带所需首道次压下量较大导致的轧机负荷极大的技术难题,及在不锈钢基体表面电沉积铜方法存在的材料性能不达标问题,作者所在研究团队提出了电沉积辅助冷轧制备铜/不锈钢极薄复合带的设想,即采用热处理、...针对冷轧制备铜/不锈钢复合极薄带所需首道次压下量较大导致的轧机负荷极大的技术难题,及在不锈钢基体表面电沉积铜方法存在的材料性能不达标问题,作者所在研究团队提出了电沉积辅助冷轧制备铜/不锈钢极薄复合带的设想,即采用热处理、冷轧手段改善不锈钢基体与铜沉积层的结合效果。本文就电沉积阶段不同的工艺参数对铜沉积层宏微观特性的影响,以及铜沉积层的生长机理进行了系统的研究,得出以下主要结论。铜沉积层的生长过程受到电流密度值与基体表面状态的影响,当基体表面光滑时,铜层与基体的初始结合强度不足,在沉积过程中出现铜层脱落的现象,因此需要选用合适的打磨方式使基体表面保持粗糙的状态。随电流密度增大(20~80 m A·cm^(-2)),铜沉积层表面的粗糙度增大,且在达到80 m A·cm^(-2)时,表面表现为松散的颗粒状,致密性显著变差;在稳定电镀区(小于60m A·cm^(-2))沉积过程中,被还原的铜离子在不锈钢带表面形成初始铜层,随后在铜沉积层外表面的低谷位置继续生长,最终演变为平整致密形态;在非稳定电镀区(大于60 m A·cm^(-2))沉积过程中,铜原子以球状颗粒的形式附着于表面的峰位,形成铜脊,相邻铜脊间存在较深的沟壑,导致的铜沉积层结构疏松,致密性差;采用400目砂纸打磨基体表面,在电流密度20 m A·cm^(-2)条件下进行电沉积效果较好,铜沉积层厚度与沉积时间近似为线性关系,可通过控制沉积时间获得所需厚度的铜沉积层。本研究结果为铜/不锈钢极薄复合带在冷轧制备过程中预制初始铜复合层提供了理论依据与调控策略。展开更多
文摘The special point is found in frequency characteristics of one model of an oscillatory contour about which it wasn’t reported in scientific literature earlier. The point settles down at a frequency, the smaller resonant frequency of a contour. The module of an impedance doesn’t depend on the size of active resistance at this frequency. Physical interpretation of the phenomenon doesn’t exist at the moment. This article is continuation of the already research, results of calculations of existence region of the impedance module of an oscillatory contour are for the first time given in it and phase charts are provided. Two models of an oscillatory contour are considered. Existence region of the module of an impedance are essentially different for the considered models. Phase charts of an impedance are calculated depending on relative frequency. Results of research can be used in the electrician and the electronic engineer and manual for profound studying of electrical equipment.
文摘针对冷轧制备铜/不锈钢复合极薄带所需首道次压下量较大导致的轧机负荷极大的技术难题,及在不锈钢基体表面电沉积铜方法存在的材料性能不达标问题,作者所在研究团队提出了电沉积辅助冷轧制备铜/不锈钢极薄复合带的设想,即采用热处理、冷轧手段改善不锈钢基体与铜沉积层的结合效果。本文就电沉积阶段不同的工艺参数对铜沉积层宏微观特性的影响,以及铜沉积层的生长机理进行了系统的研究,得出以下主要结论。铜沉积层的生长过程受到电流密度值与基体表面状态的影响,当基体表面光滑时,铜层与基体的初始结合强度不足,在沉积过程中出现铜层脱落的现象,因此需要选用合适的打磨方式使基体表面保持粗糙的状态。随电流密度增大(20~80 m A·cm^(-2)),铜沉积层表面的粗糙度增大,且在达到80 m A·cm^(-2)时,表面表现为松散的颗粒状,致密性显著变差;在稳定电镀区(小于60m A·cm^(-2))沉积过程中,被还原的铜离子在不锈钢带表面形成初始铜层,随后在铜沉积层外表面的低谷位置继续生长,最终演变为平整致密形态;在非稳定电镀区(大于60 m A·cm^(-2))沉积过程中,铜原子以球状颗粒的形式附着于表面的峰位,形成铜脊,相邻铜脊间存在较深的沟壑,导致的铜沉积层结构疏松,致密性差;采用400目砂纸打磨基体表面,在电流密度20 m A·cm^(-2)条件下进行电沉积效果较好,铜沉积层厚度与沉积时间近似为线性关系,可通过控制沉积时间获得所需厚度的铜沉积层。本研究结果为铜/不锈钢极薄复合带在冷轧制备过程中预制初始铜复合层提供了理论依据与调控策略。
