The relentless drive towards smaller,faster,and more pow-erful electronics has made thermal management a critical bot-tleneck for performance and reliability.For over a century,the thermal conductivity(κ)of metallic ...The relentless drive towards smaller,faster,and more pow-erful electronics has made thermal management a critical bot-tleneck for performance and reliability.For over a century,the thermal conductivity(κ)of metallic materials has long been considered to have an inherent upper limit for thermal conductivity,plateauing~400 W·m^(-1)·K^(-1).This ceiling is rooted in fundamental physics:in typical metals,heat is primarily carried by electrons,and their transport is severely hampered by strong electron-phonon coupling and inherent lat-tice anharmonicity[1].展开更多
文摘The relentless drive towards smaller,faster,and more pow-erful electronics has made thermal management a critical bot-tleneck for performance and reliability.For over a century,the thermal conductivity(κ)of metallic materials has long been considered to have an inherent upper limit for thermal conductivity,plateauing~400 W·m^(-1)·K^(-1).This ceiling is rooted in fundamental physics:in typical metals,heat is primarily carried by electrons,and their transport is severely hampered by strong electron-phonon coupling and inherent lat-tice anharmonicity[1].
