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Height-slope co-design enables scalable 3D printing of high-performance,multifunctional metasurfaces
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作者 HAO HU ZHUO SUN +2 位作者 XIAOXUE HU SIXING XI XIAOLEI WANG 《Photonics Research》 2026年第1期170-179,共10页
Precise and efficient wavefront control is essential for next-generation photonic systems.While metasurfaces provide a powerful platform,their implementation—particularly in the terahertz(THz)regime,which is vital fo... Precise and efficient wavefront control is essential for next-generation photonic systems.While metasurfaces provide a powerful platform,their implementation—particularly in the terahertz(THz)regime,which is vital for 6G communications,optical computing,and biomedical imaging—is often constrained by limited structural tunability,computationally intensive full-wave simulations,and complex fabrication processes.Here,we present a height–slope co-design strategy that enables the scalable 3D printing of high-performance,multifunctional metasurfaces.By introducing sidewall slope as an additional structural degree of freedom,the accessible design space is significantly expanded,enabling electromagnetic functionalities beyond those achievable with conventional width-or height-only modulation.A compact analytical model replaces brute-force parameter sweeps,accelerating the design process by over two orders of magnitude while maintaining high accuracy.Additionally,slope-assisted resonance tuning improves transmission efficiency,and integration with coating techniques enables broadband amplitude modulation and asymmetric transmission.The proposed strategy is experimentally validated through the design,fabrication,and characterization of a series of THz metasurfaces exhibiting enhanced beam control,mechanical stability,and spectral versatility.This geometric co-design approach provides a scalable and generalizable methodology for the rapid realization of multifunctional photonic components. 展开更多
关键词 g communicationsoptical computingand biomedical imaging wavefront control d printing metasurfaces height slope co design fabrication processesherewe
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