Large interfacial strains in particles are crucial for promoting bonding in cold spraying(CS),initiated either by adiabatic shear instability(ASI)due to softening prevailing over strain hardening or by hydrostatic pla...Large interfacial strains in particles are crucial for promoting bonding in cold spraying(CS),initiated either by adiabatic shear instability(ASI)due to softening prevailing over strain hardening or by hydrostatic plasticity,which is claimed to promote bonding even without ASI.A thorough microstructural analysis is vital to fully understand the bonding mechanisms at play during microparticle impacts and throughout the CS process.In this study,the HEA CoCrFeMnNi,known for its relatively high strain hardening and resistance to softening,was selected to investigate the microstructure characteristics and bonding mech-anisms in CS.This study used characterization techniques covering a range of length scales,including electron channeling contrast imaging(ECCI),electron backscatter diffraction(EBSD),and high-resolution transmission microscopy(HR-TEM),to explore the microstructure characteristics of bonding and overall structure development of CoCrFeMnNi microparticles after impact in CS.HR-TEM lamellae were prepared using focused ion beam milling.Additionally,the effects of deformation field variables on microstructure development were determined through finite element modeling(FEM)of microparticle impacts.The ECCI,EBSD,and HR-TEM analyses revealed an interplay between dislocation-driven processes and twinning,leading to the development of four distinct deformation microstructures.Significant grain refinement occurs at the interface through continuous dynamic recrystallization(CDRX)due to high strain and temperature rise from adiabatic deformation,signs of softening,and ASI.Near the interface,a necklace-like structure of refined grains forms around grain boundaries,along with elongated grains,resulting from the coexistence of dynamic recovery and discontinuous dynamic recrystallization(DDRX)due to lower temperature rise and strain.Towards the particle or substrate interior,concurrent twinning and dislocation-mediated mechanisms refine the structure,forming straight,curved,and intersected twins.At the top of the particles,only deformed grains with a low dislocation density are observed.Our results showed that DRX induces microstructure softening in highly strained interface areas,facilitating atomic bonding in CoCrFeMnNi.HR-TEM investigation confirms the formation of atomic bonds between particles and substrate,with a gradual change in crystal lattice orientation from the particle to the substrate and the occurrence of some misfit dislocations and vacancies at the interface.Finally,the findings of this research suggest that softening and ASI,even in materials resistant to softening,are required to establish bonding in CS.展开更多
The (DC-GDPAU) is a DC glow discharge plasma experiment that was designed, established, and operated in the Physics Department at Ain Shams University (Egypt). The aim of this experiment is to study and improve some p...The (DC-GDPAU) is a DC glow discharge plasma experiment that was designed, established, and operated in the Physics Department at Ain Shams University (Egypt). The aim of this experiment is to study and improve some properties of a printed circuit board (PCB) by exposing it to the plasma. The device consists of cylindrical discharge chamber with movable parallel circular copper electrodes (cathode and anode) fixed inside it. The distance between them is 12 cm. This plasma experiment works in a low-pressure range (0.15 - 0.70 Torr) for Ar gas with a maximum DC power supply of 200 W. The Paschen curves and electrical plasma parameters (current, volt, power, resistance) characterized to the plasma have been measured and calculated at each cm between the two electrodes. Besides, the electron temperature and ion density are obtained at different radial distances using a double Langmuir probe. The electron temperature (<em>KT<sub>e</sub></em>) was kept stable in range 6.58 to 10.44 eV;whereas the ion density (<em>ni</em>) was in range from 0.91 × 10<sup>10</sup> cm<sup><span style="white-space:nowrap;">−</span>3</sup> to 1.79 × 10<sup>10</sup> cm<sup><span style="white-space:nowrap;">−</span>3</sup>. A digital optical microscope (800×) was employed to draw a comparison between the pre-and after effect of exposure to plasma on the shaping of the circuit layout. The experimental results show that the electrical conductivity increased after plasma exposure, also an improvement in the adhesion force in the Cu foil surface. A significant increase in the conductivity can be directly related to the position of the sample surfaces as well as to the time of exposure. This shows the importance of the obtained results in developing the PCBs manufacturing that uses in different microelectronics devices like those onboard of space vehicles.展开更多
文摘Large interfacial strains in particles are crucial for promoting bonding in cold spraying(CS),initiated either by adiabatic shear instability(ASI)due to softening prevailing over strain hardening or by hydrostatic plasticity,which is claimed to promote bonding even without ASI.A thorough microstructural analysis is vital to fully understand the bonding mechanisms at play during microparticle impacts and throughout the CS process.In this study,the HEA CoCrFeMnNi,known for its relatively high strain hardening and resistance to softening,was selected to investigate the microstructure characteristics and bonding mech-anisms in CS.This study used characterization techniques covering a range of length scales,including electron channeling contrast imaging(ECCI),electron backscatter diffraction(EBSD),and high-resolution transmission microscopy(HR-TEM),to explore the microstructure characteristics of bonding and overall structure development of CoCrFeMnNi microparticles after impact in CS.HR-TEM lamellae were prepared using focused ion beam milling.Additionally,the effects of deformation field variables on microstructure development were determined through finite element modeling(FEM)of microparticle impacts.The ECCI,EBSD,and HR-TEM analyses revealed an interplay between dislocation-driven processes and twinning,leading to the development of four distinct deformation microstructures.Significant grain refinement occurs at the interface through continuous dynamic recrystallization(CDRX)due to high strain and temperature rise from adiabatic deformation,signs of softening,and ASI.Near the interface,a necklace-like structure of refined grains forms around grain boundaries,along with elongated grains,resulting from the coexistence of dynamic recovery and discontinuous dynamic recrystallization(DDRX)due to lower temperature rise and strain.Towards the particle or substrate interior,concurrent twinning and dislocation-mediated mechanisms refine the structure,forming straight,curved,and intersected twins.At the top of the particles,only deformed grains with a low dislocation density are observed.Our results showed that DRX induces microstructure softening in highly strained interface areas,facilitating atomic bonding in CoCrFeMnNi.HR-TEM investigation confirms the formation of atomic bonds between particles and substrate,with a gradual change in crystal lattice orientation from the particle to the substrate and the occurrence of some misfit dislocations and vacancies at the interface.Finally,the findings of this research suggest that softening and ASI,even in materials resistant to softening,are required to establish bonding in CS.
文摘The (DC-GDPAU) is a DC glow discharge plasma experiment that was designed, established, and operated in the Physics Department at Ain Shams University (Egypt). The aim of this experiment is to study and improve some properties of a printed circuit board (PCB) by exposing it to the plasma. The device consists of cylindrical discharge chamber with movable parallel circular copper electrodes (cathode and anode) fixed inside it. The distance between them is 12 cm. This plasma experiment works in a low-pressure range (0.15 - 0.70 Torr) for Ar gas with a maximum DC power supply of 200 W. The Paschen curves and electrical plasma parameters (current, volt, power, resistance) characterized to the plasma have been measured and calculated at each cm between the two electrodes. Besides, the electron temperature and ion density are obtained at different radial distances using a double Langmuir probe. The electron temperature (<em>KT<sub>e</sub></em>) was kept stable in range 6.58 to 10.44 eV;whereas the ion density (<em>ni</em>) was in range from 0.91 × 10<sup>10</sup> cm<sup><span style="white-space:nowrap;">−</span>3</sup> to 1.79 × 10<sup>10</sup> cm<sup><span style="white-space:nowrap;">−</span>3</sup>. A digital optical microscope (800×) was employed to draw a comparison between the pre-and after effect of exposure to plasma on the shaping of the circuit layout. The experimental results show that the electrical conductivity increased after plasma exposure, also an improvement in the adhesion force in the Cu foil surface. A significant increase in the conductivity can be directly related to the position of the sample surfaces as well as to the time of exposure. This shows the importance of the obtained results in developing the PCBs manufacturing that uses in different microelectronics devices like those onboard of space vehicles.
