The effects of thickness and types of gold plating on the resistance to hightemperature discoloration of gold plating on cavity surface of ceramic package were investigated. Itwas found that the thicker gold plating, ...The effects of thickness and types of gold plating on the resistance to hightemperature discoloration of gold plating on cavity surface of ceramic package were investigated. Itwas found that the thicker gold plating, the less discoloration degree for ceramic packages.Non-cyanide gold plating performed better resistance to high-temperature aging than cyanide goldplating. The relationship between the gold plating thickness and the amount of diffused Ni to thegold plating of ceramic packages with Au/Ni and Au/Ni-Co platings after heating at 420℃ for 15 minwas also studied. When the gold plating thickness reach 2.0 μm and 1.6 μm for Au/Ni and Au/Ni-Coplating systems, respectively, no discoloration was observed on the gold plating surface of cavity,and the corresponding diffused Ni amounts (mass fraction) are 1.0% and 0.4%, while the diffused Coto the gold plating is 0.04%.展开更多
The effects of thickness and types of gold plating on the resistance to high temperature discoloration of gold plating on cavity surface of ceramic package were investigated. It was found that the thicker gold plating...The effects of thickness and types of gold plating on the resistance to high temperature discoloration of gold plating on cavity surface of ceramic package were investigated. It was found that the thicker gold plating, the less discoloration degree for ceramic packages. Non-cyanide gold plating performed better resistance to high-temperature aging than cyanide gold plating. The relationship between the gold plating thickness and the amount of diffused Ni to the gold plating of ceramic packages with Au/Ni and Au/Ni-Co platings after heating at 420℃for 15 min was also studied. When the gold plating thickness reach 2.0 μm and 1.6 μm for Au/Ni and Au/Ni-Co plating systems, respectively, no discoloration was observed on the gold plating surface of cavity, and the corresponding diffused Ni amounts (mass fraction) are 1.0% and 0.4%, while the diffused Co to the gold plating is 0.04%.展开更多
With the rapid development of electronic integration technology,highly integrated chips are in urgent need of packaging materials that are thermally matched to printed circuit boards.Here,Zn_(1-x)Co_(x)Al_(2)O_(4)(ZCA...With the rapid development of electronic integration technology,highly integrated chips are in urgent need of packaging materials that are thermally matched to printed circuit boards.Here,Zn_(1-x)Co_(x)Al_(2)O_(4)(ZCAO,x=0.00-0.20)ceramics are synthesized using the solid-state reaction method.The phase composition,microstructure,microwave dielectric properties and CTE of Zn^(2+)in the ZnAl_(2)O_(4) ceramic substituted by Co^(2+)are systematically revealed.An appropriate amount of Co^(2+)substitution promotes a more homogeneous grain growth to form a dense microstructure.The average grain size,bulk density and relative density of ZCAO(x=0.10)ceramic are 1.59μm,4.472 g/cm and 97.4%,respectively.The optimal microwave dielectric properties(ε_(r)=8.2,Q×f=100,701 GHz,Tf=-66 ppm/℃)of the ZCAO(x=0.10)ceramic sintered at 1450℃ are achieved.More importantly,the ZCAO(x=0.10)possesses a CTE=11.59 ppm/℃ that is nearly thermally matched to the printed circuit boards(PCB,CTEpcB=12 ppm/℃).This ceramic has great potential for application in the electronic packaging of PCB devices.展开更多
文摘The effects of thickness and types of gold plating on the resistance to hightemperature discoloration of gold plating on cavity surface of ceramic package were investigated. Itwas found that the thicker gold plating, the less discoloration degree for ceramic packages.Non-cyanide gold plating performed better resistance to high-temperature aging than cyanide goldplating. The relationship between the gold plating thickness and the amount of diffused Ni to thegold plating of ceramic packages with Au/Ni and Au/Ni-Co platings after heating at 420℃ for 15 minwas also studied. When the gold plating thickness reach 2.0 μm and 1.6 μm for Au/Ni and Au/Ni-Coplating systems, respectively, no discoloration was observed on the gold plating surface of cavity,and the corresponding diffused Ni amounts (mass fraction) are 1.0% and 0.4%, while the diffused Coto the gold plating is 0.04%.
文摘The effects of thickness and types of gold plating on the resistance to high temperature discoloration of gold plating on cavity surface of ceramic package were investigated. It was found that the thicker gold plating, the less discoloration degree for ceramic packages. Non-cyanide gold plating performed better resistance to high-temperature aging than cyanide gold plating. The relationship between the gold plating thickness and the amount of diffused Ni to the gold plating of ceramic packages with Au/Ni and Au/Ni-Co platings after heating at 420℃for 15 min was also studied. When the gold plating thickness reach 2.0 μm and 1.6 μm for Au/Ni and Au/Ni-Co plating systems, respectively, no discoloration was observed on the gold plating surface of cavity, and the corresponding diffused Ni amounts (mass fraction) are 1.0% and 0.4%, while the diffused Co to the gold plating is 0.04%.
基金supported by the Sichuan Science and Technology Program(Grant No.2021JDTD0026)Sichuan Science and Technology Major Projects(Grant No.2019ZDZX0026)the Jiangxi Innovative Talent Program.
文摘With the rapid development of electronic integration technology,highly integrated chips are in urgent need of packaging materials that are thermally matched to printed circuit boards.Here,Zn_(1-x)Co_(x)Al_(2)O_(4)(ZCAO,x=0.00-0.20)ceramics are synthesized using the solid-state reaction method.The phase composition,microstructure,microwave dielectric properties and CTE of Zn^(2+)in the ZnAl_(2)O_(4) ceramic substituted by Co^(2+)are systematically revealed.An appropriate amount of Co^(2+)substitution promotes a more homogeneous grain growth to form a dense microstructure.The average grain size,bulk density and relative density of ZCAO(x=0.10)ceramic are 1.59μm,4.472 g/cm and 97.4%,respectively.The optimal microwave dielectric properties(ε_(r)=8.2,Q×f=100,701 GHz,Tf=-66 ppm/℃)of the ZCAO(x=0.10)ceramic sintered at 1450℃ are achieved.More importantly,the ZCAO(x=0.10)possesses a CTE=11.59 ppm/℃ that is nearly thermally matched to the printed circuit boards(PCB,CTEpcB=12 ppm/℃).This ceramic has great potential for application in the electronic packaging of PCB devices.
