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Theoretical and Experimental Investigations on Thickness Uniformity in Double-sided Lapping
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作者 Zhuolin Cai Zhe Yang +4 位作者 Bo Pan Jiale Lian Lianlin Wang Sergei Pronkevich Jiang Guo 《Chinese Journal of Mechanical Engineering》 2025年第3期151-163,共13页
The double-sided lapping process is extensively employed in the manufacturing of wafers,optical windows,and seal rings due to its high efficiency and ability to achieve precise flatness.However,limited research has ex... The double-sided lapping process is extensively employed in the manufacturing of wafers,optical windows,and seal rings due to its high efficiency and ability to achieve precise flatness.However,limited research has explored the thickness uniformity among different workpieces after double-sided lapping,and the underlying mechanism remains unclear.To address the demand for higher precision,this paper first analyzed the relative kinematic model between the workpiece and the lapping plate to clarify the causes of thickness variations among workpieces after double-sided lapping.Subsequently,a finite element method(FEM)model was developed to account for the pressure distribution on the workpiece surfaces at the initial stage of the process.The results indicate that the number of workpieces influences the final thickness variation.Then,various sets of thin copper plates with different thicknesses were lapped,and the findings revealed that five copper plates processed simultaneously exhibited more uniform thickness compared to the three plates.The experimental results align well with the theoretical analysis.Ultimately,a thickness variation of less than 6μm was achieved on five copper plates measuringΦ100×2.9 mm.This study presents a comprehensive analysis of the mechanisms influencing thickness uniformity in the double-sided lapping process and provides practical guidelines for optimizing the process to achieve stringent precision standards in industrial applications. 展开更多
关键词 Double-sided lapping Thickness uniformity Theoretical analysis FEM Thin copper plate
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淫羊藿苷调控LAP自噬促进酒精抑制的MC3T3-E1细胞成骨分化 被引量:2
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作者 曾麒 陈跃平 +2 位作者 宋世雷 赖渝 吴华华 《中国中药杂志》 北大核心 2025年第3期590-599,共10页
研究细胞自噬在MC3T3-E1细胞成骨诱导(生理)、酒精(alcohol,AL)干预(病理)分化过程中的影响机制,以及淫羊藿苷(icariin,ICA)对AL干预病理状态下MC3T3-E1细胞成骨分化的作用机制。成骨矿化结节染色鉴定该细胞可分化为成骨细胞。CCK-8实... 研究细胞自噬在MC3T3-E1细胞成骨诱导(生理)、酒精(alcohol,AL)干预(病理)分化过程中的影响机制,以及淫羊藿苷(icariin,ICA)对AL干预病理状态下MC3T3-E1细胞成骨分化的作用机制。成骨矿化结节染色鉴定该细胞可分化为成骨细胞。CCK-8实验筛选合适的AL和ICA浓度后,实验分为7组:完全培养基(complete medium,CM)组,成骨诱导培养基(osteogenic induction medium,OIM)组,OIM+0.25 mol·L^(-1)AL组,OIM+0.25 mol·L^(-1)AL+1×10^(-8)mol·L^(-1)ICA组,OIM+0.25 mol·L^(-1)AL+1×10^(-7)mol·L^(-1)ICA组,OIM+0.25 mol·L^(-1)AL+1×10^(-6)mol·L^(-1)ICA组,OIM+0.25 mol·L^(-1)AL+1×10^(-5)mol·L^(-1)ICA组,培养7 d。碱性磷酸酶(alkaline phosphatase,ALP)染色检测ALP相对面积,Western blot、RT-qPCR检测成骨、自噬相关蛋白及mRNA表达情况,活性氧(reactive oxygen species,ROS)染色检测ROS水平,细胞凋亡线粒体膜电位实验检测细胞凋亡情况。结果显示,ICA可上调AL干预后下调的ALP相对面积;AL下调成骨相关蛋白Wnt家族成员1(Wnt family member 1 gene,Wnt1)及成骨相关基因Wnt1、β-连环蛋白(β-catenin)、核心结合因子2(Runt-related transcription factor 2,Runx2)、骨保护素(osteoprotegerin,OPG)、ALP的表达水平,抑制细胞成骨分化,ICA可上调AL抑制的成骨相关蛋白及mRNA的表达水平,促进细胞成骨分化;AL抑制典型自噬,ICA调控Rubicon抑制LC3相关吞噬作用(LC3-associated phagocytosis,LAP)促进典型自噬;ICA下调AL诱导后上升的ROS水平;ICA下调AL干预后导致的成骨细胞凋亡。综上,ICA可调控Rubicon抑制LAP促进典型自噬,清除ROS减少细胞凋亡,最终通过调控Wnt/β-catenin信号通路促进AL干预病理状态下MC3T3-E1细胞的成骨分化。 展开更多
关键词 淫羊藿苷 酒精 成骨细胞 MC3T3-E1细胞 Wnt1/β-catenin通路 成骨分化 骨代谢失衡 自噬 lap
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Dissimilar Friction Stir Lap Welding of Ti Alloy and Al-Li Alloy:Microstructure and Mechanical Property 被引量:1
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作者 Zhang Wenxin Zhang Xiankun +3 位作者 Shi Lei Li Shengli Jiang Yuanning Wu Chuansong 《稀有金属材料与工程》 北大核心 2025年第2期311-318,共8页
Friction stir lap welding of AA2195 Al-Li alloy and Ti alloy was conducted to investigate the formation,microstructure,and mechanical properties of the joints.Results show that under different welding parameters,with ... Friction stir lap welding of AA2195 Al-Li alloy and Ti alloy was conducted to investigate the formation,microstructure,and mechanical properties of the joints.Results show that under different welding parameters,with the decrease in welding heat input,the weld surface is smoother.The Ti/Al joint interface is flat without obvious Ti and Al mixed structure,and the hook structure is not formed under optimal parameters.Due to the enhanced breaking effect of the stirring head,the hook structural defects and intermetallic compounds are more likely to form at the Ti/Al interface at high rotational speed of 1000 r/min,thereby deteriorating the mechanical properties of joints.Decreasing the heat input is beneficial to hardness enhancement of the aluminum alloy in the weld nugget zone.Under the optimal parameters of rotation speed of 800 r/min and welding speed of 120 mm/min,the maximum tensile shear strength of joint is 289 N/mm. 展开更多
关键词 Ti/Al dissimilar welding friction stir lap welding Ti alloy Al-Li alloy interface bonding mechanical property
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Elucidating the process mechanism in Mg-to-Al friction stir lap welding enhanced by ultrasonic vibration 被引量:3
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作者 Ming Zhai Lei Shi ChuanSong Wu 《Journal of Magnesium and Alloys》 2025年第1期338-355,共18页
The composite structures/components made by friction stir lap welding(FSLW)of Mg alloy sheet and Al alloy sheet are of wide application potentials in the manufacturing sector of transportation vehicles.To further impr... The composite structures/components made by friction stir lap welding(FSLW)of Mg alloy sheet and Al alloy sheet are of wide application potentials in the manufacturing sector of transportation vehicles.To further improve the joint quality,the ultrasonic vibration(UV)is exerted in FSLW,and the UV enhanced FSLW(UVeFSLW)was developed for making Mg-to-Al dissimilar joints.The numerical analysis and experimental investigation were combined to study the process mechanism in Mg/Al UVeFSLW.An equation related to the temperature and strain rate was derived to calculate the grain size at different locations of the weld nugget zone,and the effect of grain size distribution on the threshold thermal stress was included,so that the prediction accuracy of flow stress was further improved.With such modified constitutive equation,the numerical simulation was conducted to compare the heat generation,temperature profiles and material flow behaviors in Mg/Al UVeFSLW/FSLW processes.It was found that the exerted UV decreased the temperature at two checking points on the tool/workpiece interface from 707/671 K in FSLW to 689/660 K in UVeFSLW,which suppressed the IMCs thickness at Mg-Al interface from 1.7μm in FSLW to 1.1μm in UVeFSLW.The exerted UV increased the horizontal materials flow ability,and decreased the upward flow ability,which resulted in the increase of effective sheet thickness/effective lap width from 2.01/3.70 mm in FSLW to 2.04/4.84 mm in UVeFSLW.Therefore,the ultrasonic vibration improved the tensile shear strength of Mg-to-Al lap joints by 18%. 展开更多
关键词 Friction stir lap welding Mg-to-Al dissimilar alloys Ultrasonic vibration Numerical simulation Experimental investigation
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LAP3经JAK2/STAT3途径促进胃癌MGC-803细胞的增殖
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作者 伍石华 全婧丹 +2 位作者 王化修 吕小元 张志伟 《湘南学院学报(医学版)》 2025年第3期1-6,共6页
目的探讨胃癌相关蛋白质LAP3对胃癌细胞增殖的影响及其分子机制。方法采用慢病毒感染胃癌MGC-803细胞,筛选后建立LAP3稳定低表达MGC-803细胞系,分为对照组(MGC-803-shCtrl)、干扰组(MGC-803-shLAP3-1和MGC-803-shLAP3-2),实时荧光定量PC... 目的探讨胃癌相关蛋白质LAP3对胃癌细胞增殖的影响及其分子机制。方法采用慢病毒感染胃癌MGC-803细胞,筛选后建立LAP3稳定低表达MGC-803细胞系,分为对照组(MGC-803-shCtrl)、干扰组(MGC-803-shLAP3-1和MGC-803-shLAP3-2),实时荧光定量PCR和Western Blot检测LAP3表达情况;通过CCK-8法和平板克隆形成实验检测LAP3低表达对胃癌MGC-803细胞增殖的影响;采用Western Blot检测LAP3低表达对胃癌MGC-803细胞中JAK2/STAT3途径的影响;构建裸鼠皮下荷瘤模型,观察LAP3低表达对胃癌MGC-803细胞体内成瘤能力的影响,并通过免疫组化染色检测瘤组织中Ki-67的表达情况。结果MGC-803-shLAP3-1和MGC-803-shLAP3-2组细胞增殖率较MGC-803-shCtrl组均下降,细胞集落数减少(均P<0.01)。MGC-803-shLAP3-1和MGC-803-shLAP3-2组JAK2和STAT3蛋白的磷酸化水平较MGC-803-shCtrl组均降低(均P<0.001)。裸鼠成瘤结果显示,MGC-803-shLAP3-1和MGC-803-shLAP3-2组的肿瘤体积与重量较MGC-803-shCtrl组均下降(均P<0.001);MGC-803-shLAP3-1和MGC-803-shLAP3-2组的肿瘤组织Ki-67阳性表达率较MGC-803-shCtrl组均降低(均P<0.001)。结论LAP3可能通过活化JAK2/STAT3途径促进胃癌细胞的增殖。 展开更多
关键词 胃癌 lap3 JAK2/STAT3途径 细胞增殖
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Hole inhibition mechanisms of Mg/steel lap joint by pinless friction stir spot welding
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作者 Tao-tao Li Hong-de Ding +5 位作者 Rui-feng Li Kai Qi Zhen-guang Liu Xiao-qiang Zhang Yue Zhao Lei Qiao 《Journal of Iron and Steel Research International》 2025年第4期1085-1101,共17页
Pinless friction stir spot welding(P-FSSW)was performed to manufacture Mg/steel lap joints.Orthogonal tests for P-FSSW of Mg/steel were investigated,and the main factors affecting the properties of Mg/steel lap joints... Pinless friction stir spot welding(P-FSSW)was performed to manufacture Mg/steel lap joints.Orthogonal tests for P-FSSW of Mg/steel were investigated,and the main factors affecting the properties of Mg/steel lap joints were derived.The shear force of the Mg/steel lap joints gradually increased and then decreased as the welding time increased.Maximum shear force was 5.3 kN.Fe-Al intermetallic compound(IMC)was formed at the Mg/steel interface near the steel side,and Mg-Al IMCs were formed at the Mg/steel interface near the Mg alloy side.Mg/steel lap joint was transformed from an initial solid-state welding to fusion-brazing welding as the welding time increased.No hole defects were formed in Mg/steel solid-state welding joints,whereas hole defects appeared in Mg/steel fusion-brazing welding joints.The temperature field of Mg/steel lap joints was simulated to analyze hole defects generated during the welding process.Hole defects can be eliminated by changing the spindle deflection angle,and the shear force decreased.Excessive spindle deflection can also lead to failure to form a stable joint.Hole defects were removed because the spindle deflection angle reduced the interfacial reaction temperature,and a solid-state welding joint was formed,which resulted in an absence of fusion-brazing welding hole formation. 展开更多
关键词 Mg/steel lap joint Pinless friction stir spot welding Hole inhibition SIMULATION
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Improving microstructure,tensile properties and corrosion resistance of AA6016 and AA2519 alloys friction stir lap joints via TIG arc
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作者 Tie YI Sheng-dan LIU +2 位作者 Chen FANG Geng-duo JIANG Xuan-xuan DAI 《Transactions of Nonferrous Metals Society of China》 2025年第2期405-417,共13页
The effects of tungsten inert gas arc-assisted friction stir welding(TIG-FSW)on the microstructure,tensile properties and corrosion resistance of AA6016 and AA2519 alloys lap joints were investigated by means of optic... The effects of tungsten inert gas arc-assisted friction stir welding(TIG-FSW)on the microstructure,tensile properties and corrosion resistance of AA6016 and AA2519 alloys lap joints were investigated by means of optical microscope,scanning electron microscope,tensile test at room temperature,corrosion immersion tests and electrochemical measurements.The results show that the introduction of TIG arc during FSW process results in a more uniform microstructure of the joint with no tunnel hole defects.Furthermore,it enhances tensile strength and elongation of the joint with increased rates of 11.5%and 50.0%,respectively;meanwhile,the corrosion current density and largest corrosion depth are decreased with reduction rates of 78.2%and 45.7%,respectively.TIG-FSW can promote flow,contact and diffusion of materials,thus improving microstructure of the joint.Additionally,it reduces the size and number of secondary phase particles.Consequently,these factors contribute to the higher tensile properties and corrosion resistance of the joints. 展开更多
关键词 friction stir welding lap joint dissimilar aluminum alloys secondary phase particles MICROSTRUCTURE tensile properties corrosion resistance
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Achievement of superb-strength lap joint via opposite-directions flowing friction stir lap welding of 2024 aluminum alloys
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作者 Zhiqing ZHANG Peng GONG +4 位作者 Shude JI Lin MA Chen JIN Xiuyan LI Qi SONG 《Chinese Journal of Aeronautics》 2025年第8期588-603,共16页
It is common for the rotating pin largely plunging into lower sheet to break up lap interface of Friction Stir Lap Welding(FSLW)joint,but the unavoidable up-bending morphology of hook outside Nugget Zone(NZ)largely re... It is common for the rotating pin largely plunging into lower sheet to break up lap interface of Friction Stir Lap Welding(FSLW)joint,but the unavoidable up-bending morphology of hook outside Nugget Zone(NZ)largely reduces the joint bearing ability.Based on the novel Opposite-directions Flowing FSLW(OF-FSLW)by the self-developed rotating tool with an Xshaped right-left thread pin,the 2024 aluminum alloys lap joint was successfully welded in this study.The migration law of lap interface during welding was investigated by the experimental and numerical methods,and then how the rotating pin and its rotating velocity affect the formation and strength of OF-FSLW joint was further analyzed.The results show that the Material Concentrated Zone(MCZ)which formed above the original lap interface made the hook bend downward,the NZ greatly enlarged and the beginning part of cold lap compressed and thickened,thereby heightening the joint bearing ability.For the OF-FSLW joint,its maximum tensile strength was403 MPa,and the corresponding joint efficiency of 90.8%was an incredible and superb value for the 2000 series heat-treatment strengthened aluminum alloys friction stir welded joint.The OF-FSLW technology by the rotating tool with an X-shaped right-left thread pin is proven to be a greatly effective approach for manufacturing the aluminum alloys lap joint with superb strength. 展开更多
关键词 2024-T4 aluminum alloys Opposite-directions flowing friction stir lapwelding Rotatingtool withanXshaped right-left thread pin lap interface Tensile strength
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莱斯特评估包(LAP)结合PDCA循环质控指导全科规培住院医师门诊接诊能力的教学实践研究
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作者 尹向辉 孙军奎 +7 位作者 贺连栋 刘宝明 韩芳 李索南措 薛兴翠 汪丽玲 郭蕊 白小林 《青海医药杂志》 2024年第8期60-63,共4页
目的:探讨莱斯特评估包(LAP)结合PDCA循环质控指导全科规范化培训住院医师(简称全科住培医师)在门诊接诊能力的教学实践效果。方法:收集2023年1月—2023年12月于青海红十字医院及西宁市城北区马坊社区、城东区东关社区参与全科住培医师... 目的:探讨莱斯特评估包(LAP)结合PDCA循环质控指导全科规范化培训住院医师(简称全科住培医师)在门诊接诊能力的教学实践效果。方法:收集2023年1月—2023年12月于青海红十字医院及西宁市城北区马坊社区、城东区东关社区参与全科住培医师培训的2021级及2022级医师40名,随机分为对照组和观察组各20名。对照组接受LAP的教学模式,观察组接受LAP联合PDCA循环质控指导的教学模式。每周进行考核,4周考核结束后进行匿名填写满意度调查表。结果:通过定期的门诊培训及考核,培训前及培训第二周,两组全科住培医师LAP总分比较,差异均无统计学意义(P>0.05),培训第一周、第三周、第四周,观察组全科住培医师LAP总分分别为(75.58±2.48)分、(82.13±2.17)分、(86.80±2.18)分,均高于对照组(P<0.05)。在带教第四周后,观察组全科住培医师首诊病史采集评分为(17.10±0.84)分、解决问题评分为(17.88±1.11)分,均高于对照组(P <0.05),两组全科住培医师体格检查评分、患者管理评分、医患关系评分、预防保健评分及病历记录评分比较,差异均无统计学意义(P>0.05)。教学满意度调查中观察组非常满意16名(80.0%),对照组3名(15.0%),两组比较,差异有统计学意义(P <0.05)。结论:LAP结合PDCA循环质控指导应用于全科住培医师门诊接诊能力临床教学中有较好的效果,值得临床推广应用。 展开更多
关键词 lap PDCA 全科 规培住院医师门诊教学
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Damage mechanisms during lapping and mechanical polishing CdZnTe wafers 被引量:2
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作者 LI Yan,KANG Renke,GAO Hang,and WU Dongjiang Key Laboratory for Precision and Non-Traditional Machining Technology (Ministry of Education),Dalian University of Technology,Dalian 116024,China 《Rare Metals》 SCIE EI CAS CSCD 2010年第3期276-279,共4页
CdZnTe wafers were machined by lapping and mechanical polishing processes,and their surface and subsurface damages were investigated.The surface damages are mainly induced by three-body abrasive wear and embedded abra... CdZnTe wafers were machined by lapping and mechanical polishing processes,and their surface and subsurface damages were investigated.The surface damages are mainly induced by three-body abrasive wear and embedded abrasive wear during lapping process.A new damage type,which is induced by the indentation of embedded abrasives,is found in the subsurface.When a floss pad is used to replace the lapping plate during machining,the surface damage is mainly induced by two-body abrasive and three-body abrasive wear,and the effect of embedded abrasives on the surface is greatly weakened.Moreover,this new damage type nearly disappears on the subsurface. 展开更多
关键词 lapping mechanical polishing WAFERS SURFACE SUBSURFACE ABRASIVE
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Optimization experiment on eccentric lapping of cylindrical rollers 被引量:2
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作者 Jia Su Julong Yuan +1 位作者 Sen Zhang Binghai Lv 《Nanotechnology and Precision Engineering》 EI CAS CSCD 2018年第3期197-204,共8页
Cylindrical rollers are important elements of bearings,and their machining accuracy and consistency affect the bearing quality.Using a GCr15 cylindrical roller ofФ11×12 as the processing object in this study,the... Cylindrical rollers are important elements of bearings,and their machining accuracy and consistency affect the bearing quality.Using a GCr15 cylindrical roller ofФ11×12 as the processing object in this study,the effects of loading pressure,abrasive concentration,and speed combination on cylindrical roller machining precision were investigated using the orthogonal experimental design method on a double-side eccentric pendulum lapping and polishing machine.The machining parameters of the lapping stage were optimized,and the lapping optimal process parameters were determined by S/N response analysis and analysis of variance(ANOVA).The results show that when the experiment was optimized using loading pressure of 10 N/roller,abrasive concentrationof 20.0 wt%,and rotational speed combination,the material removal rate(MRR)of cylindrical roller reached 0.0896μm/min;the average roughness of the batch decreased from 0.056μm to 0.027μm,51.8%lower than the original batch average roughness,and the deviation decreased from the initial 0.022μm to 0.014μm;the batch average roundness error decreased from 0.47μm to 0.28μm,40.4%lower than the original batch average roundness error,and the deviation decreased from the initial 0.19μm to 0.038μm;and the batch average diameter variation decreased from 4.5μm to about 3.6μm,20%lower than the original batch average diameter variation.The double-side eccentric lapping of cylinder rollers does not only lead to improvement in the surface quality and shape accuracy of rollers,but also improvement in the batch consistency. 展开更多
关键词 Cylindrical ROLLER ECCENTRIC PENDULUM type Orthogonal EXPERIMENT lapping BATCH consistency
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Modeling and Validation of Indentation Depth of Abrasive Grain into Lithium Niobate Wafer by Fixed-Abrasive Lapping 被引量:2
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作者 Zhu Nannan Zhu Yongwei +3 位作者 Xu Jun Wang Zhankui Xu Sheng Zuo Dunwen 《Transactions of Nanjing University of Aeronautics and Astronautics》 EI CSCD 2017年第1期97-104,共8页
The prediction of indentation depth of abrasive grain in hydrophilic fixed-abrasive(FA)lapping is crucial for controlling material removal rate and surface quality of the work-piece being machined.By applying the theo... The prediction of indentation depth of abrasive grain in hydrophilic fixed-abrasive(FA)lapping is crucial for controlling material removal rate and surface quality of the work-piece being machined.By applying the theory of contact mechanics,a theoretical model of the indentation depth of abrasive grain was developed and the relationships between indentation depth and properties of contact pairs and abrasive back-off were studied.Also,the average surface roughness(Ra)of lapped wafer was approximately calculated according to the obtained indentation depth.To verify the rationality of the proposed model,a series of lapping experiments on lithium niobate(LN)wafers were carried out,whose average surface roughness Ra was measured by atomic force microscope(AFM).The experimental results were coincided with the theoretical predictions,verifying the rationality of the proposed model.It is concluded that the indentation depth of the fixed abrasive was primarily affected by the applied load,wafer micro hardness and pad Young′s modulus and so on.Moreover,the larger the applied load,the more significant the back-off of the abrasive grain.The model established in this paper is helpful to the design of FA pad and its machining parameters,and the prediction of Ra as well. 展开更多
关键词 fixed-abrasive lapping INDENTATION DEPTH ABRASIVE back-off lithium NIOBATE WAFER average surface roughness
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MINITYPE MACHINING SYSTEM FOR DIAMOND LAPPING & POLISHING BY USING BRUSHLESS DIRECT CURRENT MOTOR AS PRECISE SPINDLE 被引量:1
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作者 FU Huinan CHEN Dongsheng ZHAO Yong LIN Binquan 《Chinese Journal of Mechanical Engineering》 SCIE EI CAS CSCD 2008年第2期27-30,共4页
A minitype precise spindle system which can machine precisely and stably in the process of diamond lapping and polishing is designed. In such minitype spindle system, the brushless DC spindle motor is used to drive th... A minitype precise spindle system which can machine precisely and stably in the process of diamond lapping and polishing is designed. In such minitype spindle system, the brushless DC spindle motor is used to drive the lapping finish table, which is built with fluid dynamic bearings. Some measures have been taken to make the lapping system dynamic balance, and a servo controller which can adjust the speed of motor from 1200 r/min to 5400 r/min is designed. Experiments show that the spindle system is reliable and stable for diamond polishing, and the detection results by atomic force microscope(AFM) show that the surfaces of diamond edge's Ra is 6.725 nm and whole diamond average Ra is 3.25 nm. 展开更多
关键词 DIAMOND lapping polishing Spindle system
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High Speed Lapping of SiC Ceramic Material with Solid (Fixed) Abrasives 被引量:1
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作者 张伟 杨鑫宏 +2 位作者 尚春民 胡孝勇 胡忠辉 《Defence Technology(防务技术)》 SCIE EI CAS 2005年第2期225-228,共4页
An experimental investigation is carried out to machine SiC ceramic material through the method of high speed plane lapping with solid(fixed) abrasives after the critical condition of brittle-ductile transition is the... An experimental investigation is carried out to machine SiC ceramic material through the method of high speed plane lapping with solid(fixed) abrasives after the critical condition of brittle-ductile transition is theoretically analyzed. The results show that the material removal mechanism and the surface roughness are chiefly related to the granularity of abrasives for brittle materials such as SiC ceramic. It is easily realized to machine SiC ceramic in the ductile mode using W3.5 grit and a high efficiency, low cost and smooth surface with a surface roughness of R_a 2.4?nm can be achieved. 展开更多
关键词 SiC ceramic MATERIAL high speed lapping with SOLID ABRASIVE machining in DUCTILE mode surface roughness
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Subsurface Damage of Monocrystalline Germanium Wafers by Fixed and Free Abrasive Lappings 被引量:1
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作者 Tang Suyang Sun Yuli +5 位作者 Wang gong Li Jun Xu gang Liu Zhigang Zhu Yongwei Zuo Dunwen 《Transactions of Nanjing University of Aeronautics and Astronautics》 EI CSCD 2017年第5期496-503,共8页
The subsurface damage(SSD)layers of monocrystalline germanium wafers lapped by three different ways were measured and compared by the method of nanoindentation and micro morphology.Three ways such as ice-fixed abrasiv... The subsurface damage(SSD)layers of monocrystalline germanium wafers lapped by three different ways were measured and compared by the method of nanoindentation and micro morphology.Three ways such as ice-fixed abrasive,thermosetting fixed abrasive and free abrasive lappings are adopted to lap monocrystalline germanium wafers.The SSD depth was measured by a nanoindenter,and the morphology of SSD layer was observed by an atomic force microscopy(AFM).The results show that the SSD layer of monocrystalline germanium wafer is mainly composed of soft corrosion layer and plastic scratch and crack growth layer.Compared with thermosetting fixed abrasive and free abrasive lappings,the SSD depth lapped with ice-fixed abrasive is shallower.Moreover,the SSD morphology of monocrystalline germanium wafer lapped with ice-fixed abrasive is superior to those of two other processing ways. 展开更多
关键词 subsurface damage(SSD) NANOINDENTATION fixed abrasive lapping monocrystalline germanium wafer
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Stress-Induced Deformation of Thin Copper Substrate in Double-Sided Lapping 被引量:1
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作者 Jiang Guo Zengxu He +4 位作者 Bo Pan Bin Wang Qian Bai Jinxing Kong Renke Kang 《Chinese Journal of Mechanical Engineering》 SCIE EI CAS CSCD 2023年第1期80-89,共10页
Double-sided lapping is an precision machining method capable of obtaining high-precision surface.However,during the lapping process of thin pure copper substrate,the workpiece will be warped due to the influence of r... Double-sided lapping is an precision machining method capable of obtaining high-precision surface.However,during the lapping process of thin pure copper substrate,the workpiece will be warped due to the influence of residual stress,including the machining stress and initial residual stress,which will deteriorate the flatness of the workpiece and ultimately affect the performance of components.In this study,finite element method(FEM)was adopted to study the effect of residual stress-related on the deformation of pure copper substrate during double-sided lapping.Considering the initial residual stress of the workpiece,the stress caused by the lapping and their distribution characteristics,a prediction model was proposed for simulating workpiece machining deformation in lapping process by measuring the material removal rate of the upper and lower surfaces of the workpiece under the corresponding parameters.The results showed that the primary cause of the warping deformation of the workpiece in the doublesided lapping is the redistribution of initial residual stress caused by uneven material removal on the both surfaces.The finite element simulation results were in good agreement with the experimental results. 展开更多
关键词 Machining deformation Double-sided lapping Residual stress Finite element simulation
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CVD Micro-diamond Coated Tool Lapping with Sapphire Wafer
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作者 Feng Wei Lu Wenzhuang +2 位作者 Yu Yaping Yang Bin Zuo Dunvuen 《Transactions of Nanjing University of Aeronautics and Astronautics》 EI CSCD 2017年第1期81-88,共8页
Micro-diamond films were prepared on YG6 substrate by hot filament chemical vapor deposition method.An innovative micro-diamond coated tool was used to the lap sapphire wafer.The effect of load,rotating speed,and lapp... Micro-diamond films were prepared on YG6 substrate by hot filament chemical vapor deposition method.An innovative micro-diamond coated tool was used to the lap sapphire wafer.The effect of load,rotating speed,and lapping time on material removal rate(MRR)and surface roughness was investigated.The results showed that the best process parameters were 3N,100r/min and 15 min.The surface quality of sapphire improved significantly after lapping.The coating after lapping adhered well and did not show any peeling.The innovative micro-diamond coated tool was feasible and suitable for the lapping of the single crystal sapphire wafer. 展开更多
关键词 micro-diamond film SAPPHIRE surface ROUGHNESS lapping
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Finite Element Analysis for Grinding and Lapping of Wire-sawn Silicon Wafers
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作者 Z J PEI X J XIN 《厦门大学学报(自然科学版)》 CAS CSCD 北大核心 2002年第S1期10-,共1页
Silicon wafers are the most widely used substrates for semiconductors. The falling price of silicon wafers has created tremendous pressure on silicon wafer manufacturers to develop cost-effective manufacturing process... Silicon wafers are the most widely used substrates for semiconductors. The falling price of silicon wafers has created tremendous pressure on silicon wafer manufacturers to develop cost-effective manufacturing processes. A critical issue in wafer production is the waviness induced by wire sawing. If this waviness is not removed, it will affect wafer flatness and semiconductor performance. In practice, both lapping and grinding have been used to flatten wire-sawn wafers. Although grinding is not as effective as lapping in removing waviness, it has many other advantages over lapping (such as higher throughput, fully automatic, and more benign to environment) and has great potential to reduce manufacturing cost of silicon wafers. This paper presents a finite element analysis (FEA) study on grinding and lapping of wire-sawn silicon wafers. An FEA model is first developed to simulate the waviness deformation of wire-sawn wafers in grinding and lapping processes. It is then used to explain how the waviness is removed or reduced by lapping and grinding and why the effectiveness of grinding in removing waviness is different from that of lapping. Furthermore, the model is used to study the effects of various parameters including active-grinding-zone orientation, grinding force, waviness wavelength, and waviness height on the reduction and elimination of waviness. Finally, the results of pilot experiments to verify the model are discussed. 展开更多
关键词 finite element analysis GRINDING lapping silicon wafer waviness removal
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Strengthening strategy for high-performance friction stir lap welded joints based on 5083 Al alloy 被引量:2
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作者 Yujia Shen Jijie Wang +5 位作者 Beibei Wang Peng Xue Fengchao Liu Dingrui Ni Bolv Xiao Zongyi Ma 《International Journal of Minerals,Metallurgy and Materials》 SCIE EI CAS CSCD 2024年第11期2498-2507,共10页
During aircraft,ship,and automobile manufacturing,lap structures are frequently produced among Al alloy skins,wall panels,and stiffeners.The occurrence of welding defects severely decreases mechanical properties durin... During aircraft,ship,and automobile manufacturing,lap structures are frequently produced among Al alloy skins,wall panels,and stiffeners.The occurrence of welding defects severely decreases mechanical properties during friction stir lap welding(FSLW).This study focuses on investigating the effects of rotation rate,multipass welding,and cooling methods on lap defect formation,microstructural evolution,and mechanical properties.Hook defects were eliminated by decreasing welding speed,applying two-pass FLSW with a small welding tool,and introducing additional water cooling,thus leading to a remarkable increase in effective sheet thickness and lap width.This above strategy yielded defect-free joints with an ultrafine-grained microstructure and increased tensile shear force from 298 to 551 N/mm.The fracture behavior of FSLW joints was systematically studied,and a fracture factor of lap joints was proposed to predict their fracture mode.By reducing the rotation rate,using two-pass welding,and employing additional water cooling strategies,an enlarged,strengthened,and defect-free lap zone with refined ultrafine grains was achieved with a quality comparable to that of lap welds based on 7xxx Al alloys.Importantly,this study provides a valuable FSLW method for eliminating hook defects and improving joint performance. 展开更多
关键词 friction stir lap welding defect control microstructure fracture mechanisms mechanical properties
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ANALYSIS ON LAPPING AND POLISHING PRESSURE DISTRIBUTION OF HARD MAGNETIC DISK SUBSTRATE 被引量:10
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作者 Cai, Guangqi Cai, Rui +1 位作者 Lu, Yushan Min, Xinli 《Chinese Journal of Mechanical Engineering》 SCIE EI CAS CSCD 1998年第4期53-57,共5页
The contact model of lapping and polishing for magnetic disk substrate is presented. Based on elastic contact theory, pressure distribution for this model are analyzed. Further, the effects of various parameters, such... The contact model of lapping and polishing for magnetic disk substrate is presented. Based on elastic contact theory, pressure distribution for this model are analyzed. Further, the effects of various parameters, such as the material properties of the PVA(polyvinyl acetate),grinding stone, the polishing pad and the base plate, the thickness of the pad or the stone on the pressure distribution have been discussed. 展开更多
关键词 lapping POLISHING Magnetic disk substrate
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