The characteristic of the bond zone between Ni-based alloy light beam surfacing layer(SL)and base metal(BM)was investigated by scanning electron microscope,energy dispersive spectrometer and X-ray diffraction.The resu...The characteristic of the bond zone between Ni-based alloy light beam surfacing layer(SL)and base metal(BM)was investigated by scanning electron microscope,energy dispersive spectrometer and X-ray diffraction.The results show that the bond zone,which consists ofγ-Ni orγ-(Fe,Ni)planar crystal band close to SL andα-Fe bright band close to heat affected zone(HAZ),is actually the transition zone of composition and microstructure between SL and HAZ,and the metallurgical bond interface lies between theα-Fe bright band and HAZ.With the increase of light beam heat input from 2kJ/mm to 4kJ/mm,the width of the bond zone increases from 4μm to 15μm,and the morphology of bond interface changes from zigzag to straight.The formation of bond interface indicates the formation of reliable metallurgical bond between SL and BM.展开更多
In order to investigate the bonding behavior and mechanism of the interface prepared by explosive welding, the bonding interfaces of 0 Crl 8Ni9/16MnR were observed and analyzed by means of optical microscope （OM） , ...In order to investigate the bonding behavior and mechanism of the interface prepared by explosive welding, the bonding interfaces of 0 Crl 8Ni9/16MnR were observed and analyzed by means of optical microscope （OM） , scanning electron microscope （SEM） and electron probe microanalysis （ EPMA ）. It is found that the welding interfaces are wavy due to the wavy explosive loading. There are three kinds of bonding interfaces i. e. big wave, small wave and micro wave. There are a few seam defects and all elements contents are less than both of the base and .flyer plate in the transition zone of big wavy interface. Moreover, some ＂holes＂ result in the lowest bonding strength of big wavy interface nearby the interface in the base plate. All elements contents of the small wavy interface are between two metals, and there are few seam and hole defects, so it is the higher for the bonding strength of small wavy interface. There is no transition zone and defects in the micro wavy interface, so the interface is the best. To gain the high quality small and micro wavy bonding interface the explosive charge should be controlled.展开更多
基金Item Sponsored by National Natural Science Foundation of China(59905017)
文摘The characteristic of the bond zone between Ni-based alloy light beam surfacing layer(SL)and base metal(BM)was investigated by scanning electron microscope,energy dispersive spectrometer and X-ray diffraction.The results show that the bond zone,which consists ofγ-Ni orγ-(Fe,Ni)planar crystal band close to SL andα-Fe bright band close to heat affected zone(HAZ),is actually the transition zone of composition and microstructure between SL and HAZ,and the metallurgical bond interface lies between theα-Fe bright band and HAZ.With the increase of light beam heat input from 2kJ/mm to 4kJ/mm,the width of the bond zone increases from 4μm to 15μm,and the morphology of bond interface changes from zigzag to straight.The formation of bond interface indicates the formation of reliable metallurgical bond between SL and BM.
文摘In order to investigate the bonding behavior and mechanism of the interface prepared by explosive welding, the bonding interfaces of 0 Crl 8Ni9/16MnR were observed and analyzed by means of optical microscope （OM） , scanning electron microscope （SEM） and electron probe microanalysis （ EPMA ）. It is found that the welding interfaces are wavy due to the wavy explosive loading. There are three kinds of bonding interfaces i. e. big wave, small wave and micro wave. There are a few seam defects and all elements contents are less than both of the base and .flyer plate in the transition zone of big wavy interface. Moreover, some ＂holes＂ result in the lowest bonding strength of big wavy interface nearby the interface in the base plate. All elements contents of the small wavy interface are between two metals, and there are few seam and hole defects, so it is the higher for the bonding strength of small wavy interface. There is no transition zone and defects in the micro wavy interface, so the interface is the best. To gain the high quality small and micro wavy bonding interface the explosive charge should be controlled.
