The evolution of display backplane technologies has been driven by the relentless pursuit of higher form factor and superior performance coupled with lower power consumption.Current state-of-the-art backplane technolo...The evolution of display backplane technologies has been driven by the relentless pursuit of higher form factor and superior performance coupled with lower power consumption.Current state-of-the-art backplane technologies based on amorphous Si,poly Si,and IGZO,face challenges in meeting the requirements of next-generation displays,including larger dimensions,higher refresh rates,increased pixel density,greater brightness,and reduced power consumption.In this context,2D chalcogenides have emerged as promising candidates for thin-film transistors(TFTs)in display backplanes,offering advantages such as high mobility,low leakage current,mechanical robustness,and transparency.This comprehensive review explores the significance of 2D chalcogenides as materials for TFTs in next-generation display backplanes.We delve into the structural characteristics,electronic properties,and synthesis methods of 2D chalcogenides,emphasizing scalable growth strategies that are relevant to large-area display backplanes.Additionally,we discuss mechanical flexibility and strain engineering,crucial for the development of flexible displays.Performance enhancement strategies for 2D chalcogenide TFTs have been explored encompassing techniques in device engineering and geometry optimization,while considering scaling over a large area.Active-matrix implementation of 2D TFTs in various applications is also explored,benchmarking device performance on a large scale which is a necessary aspect of TFTs used in display backplanes.Furthermore,the latest development on the integration of 2D chalcogenide TFTs with different display technologies,such as OLED,quantum dot,and MicroLED displays has been reviewed in detail.Finally,challenges and opportunities in the field are discussed with a brief insight into emerging trends and research directions.展开更多
Free space optical interconnections（FSOIs） are anticipated to become a prevalent technology for short-range high-speed communication. FSOIs use lasers in board-to-board and rack-to-rack communication to achieve impr...Free space optical interconnections（FSOIs） are anticipated to become a prevalent technology for short-range high-speed communication. FSOIs use lasers in board-to-board and rack-to-rack communication to achieve improved performance in next generation servers and are expected to help meet the growing demand for massive amounts of inter-card data communication. An array of transmitters and receivers arranged to create an optical bus for inter-card and card-to-backplane communication could be the solution. However, both chip heating and cooling fans produce temperature gradients and hot air flow that results in air turbulence inside the server, which induces signal fading and, hence, influences the communication performance. In addition, the proximity between neighboring transmitters and receivers in the array leads to crosstalk in the received signal, which further contributes to signal degradation. In this Letter, the primary objective is to experimentally examine the off-axis crosstalk between links in the presence of turbulence inside a server chassis. The effects of geometrical and inter-chassis turbulence characteristics are investigated and first-and second-order statistics are derived.展开更多
基金supported in part by the National Research Foundation of Korea Grant Number:RS-2024-00448809National Research Foundation of Korea Grant Number:RS-2025-00517255+1 种基金National Research Foundation of Korea Grant Number:No.2021M3H4A1A02056037supported by Basic Science Research Program through the National Research Foundation of Korean(NRF)funded by the Ministry of Education(2020R1A6A1A03040516).
文摘The evolution of display backplane technologies has been driven by the relentless pursuit of higher form factor and superior performance coupled with lower power consumption.Current state-of-the-art backplane technologies based on amorphous Si,poly Si,and IGZO,face challenges in meeting the requirements of next-generation displays,including larger dimensions,higher refresh rates,increased pixel density,greater brightness,and reduced power consumption.In this context,2D chalcogenides have emerged as promising candidates for thin-film transistors(TFTs)in display backplanes,offering advantages such as high mobility,low leakage current,mechanical robustness,and transparency.This comprehensive review explores the significance of 2D chalcogenides as materials for TFTs in next-generation display backplanes.We delve into the structural characteristics,electronic properties,and synthesis methods of 2D chalcogenides,emphasizing scalable growth strategies that are relevant to large-area display backplanes.Additionally,we discuss mechanical flexibility and strain engineering,crucial for the development of flexible displays.Performance enhancement strategies for 2D chalcogenide TFTs have been explored encompassing techniques in device engineering and geometry optimization,while considering scaling over a large area.Active-matrix implementation of 2D TFTs in various applications is also explored,benchmarking device performance on a large scale which is a necessary aspect of TFTs used in display backplanes.Furthermore,the latest development on the integration of 2D chalcogenide TFTs with different display technologies,such as OLED,quantum dot,and MicroLED displays has been reviewed in detail.Finally,challenges and opportunities in the field are discussed with a brief insight into emerging trends and research directions.
文摘Free space optical interconnections（FSOIs） are anticipated to become a prevalent technology for short-range high-speed communication. FSOIs use lasers in board-to-board and rack-to-rack communication to achieve improved performance in next generation servers and are expected to help meet the growing demand for massive amounts of inter-card data communication. An array of transmitters and receivers arranged to create an optical bus for inter-card and card-to-backplane communication could be the solution. However, both chip heating and cooling fans produce temperature gradients and hot air flow that results in air turbulence inside the server, which induces signal fading and, hence, influences the communication performance. In addition, the proximity between neighboring transmitters and receivers in the array leads to crosstalk in the received signal, which further contributes to signal degradation. In this Letter, the primary objective is to experimentally examine the off-axis crosstalk between links in the presence of turbulence inside a server chassis. The effects of geometrical and inter-chassis turbulence characteristics are investigated and first-and second-order statistics are derived.
