As semiconductor devices approach fundamental physical scaling limits,molecular electronics has emerged as apotential technological paradigm for sustaining Moore’s Law through the capabilities of single-molecule-scal...As semiconductor devices approach fundamental physical scaling limits,molecular electronics has emerged as apotential technological paradigm for sustaining Moore’s Law through the capabilities of single-molecule-scalefunctional manipulation and quantum modulation.At the foundational research level,the convergence of atomicprecisionfabrication techniques with molecule-electrode interfaces and molecular orbital engineering has enabledthe directional construction of electronically functional single-molecule devices,including molecular switches,rectifiers,and field-effect transistors,accompanied by preliminary validations of molecular device array integration.However,molecular electronics confronts multifaceted challenges spanning device-level bottlenecks in precisemolecular assembly,accurate quantum charge transport characterizations,and performance reproducibility,coupledwith integration-level limitations imposed by conventional two-dimensional planar architectures that fundamentallyconstrain functional density scaling,rendering the realization of high-density integrated molecular devices withoperational logic capabilities exceptionally demanding.To address these critical issues,researchers have developedvarious device fabrication and characterization techniques in recent years,such as the integration of top-down micro/nano-fabrication technologies with bottom-up atomic manufacturing approaches,which have significantly enhancedthe stability of molecular devices and data reproducibility.This review systematically summarizes recent advances inpreparation methodologies for molecular electronic devices with high reproducibility and reliability,with prospectiveemphasis on an integrated architecture strategy combining atomic manufacturing technologies with threedimensional(3D)integrated manufacturing technologies,offering a potential roadmap to transcend conventionaltwo-dimensional integration paradigms and realize logical computing functionalities in molecular electronic devices.展开更多
基金support from the National Key R&D Program of China(2024YFA1208103)the National Natural Science Foundation of China(Nos.22173075,21933012,22325303,22250003,22303071)+1 种基金the Fujian Provincial Department of Science and Technology(2023H6002)the Fundamental Research Funds for the Central Universities(Nos.20720220020,20720200068).
文摘As semiconductor devices approach fundamental physical scaling limits,molecular electronics has emerged as apotential technological paradigm for sustaining Moore’s Law through the capabilities of single-molecule-scalefunctional manipulation and quantum modulation.At the foundational research level,the convergence of atomicprecisionfabrication techniques with molecule-electrode interfaces and molecular orbital engineering has enabledthe directional construction of electronically functional single-molecule devices,including molecular switches,rectifiers,and field-effect transistors,accompanied by preliminary validations of molecular device array integration.However,molecular electronics confronts multifaceted challenges spanning device-level bottlenecks in precisemolecular assembly,accurate quantum charge transport characterizations,and performance reproducibility,coupledwith integration-level limitations imposed by conventional two-dimensional planar architectures that fundamentallyconstrain functional density scaling,rendering the realization of high-density integrated molecular devices withoperational logic capabilities exceptionally demanding.To address these critical issues,researchers have developedvarious device fabrication and characterization techniques in recent years,such as the integration of top-down micro/nano-fabrication technologies with bottom-up atomic manufacturing approaches,which have significantly enhancedthe stability of molecular devices and data reproducibility.This review systematically summarizes recent advances inpreparation methodologies for molecular electronic devices with high reproducibility and reliability,with prospectiveemphasis on an integrated architecture strategy combining atomic manufacturing technologies with threedimensional(3D)integrated manufacturing technologies,offering a potential roadmap to transcend conventionaltwo-dimensional integration paradigms and realize logical computing functionalities in molecular electronic devices.
