The microstructure characteristics of TiNi alloy were investigated to elucidate the active deformation mechanisms during hot rolling and the corresponding tribology performance.The deformation was mainly dominated by ...The microstructure characteristics of TiNi alloy were investigated to elucidate the active deformation mechanisms during hot rolling and the corresponding tribology performance.The deformation was mainly dominated by a combination of mechanical twinning involving the {114}_(B2) and {112}_(B2) twins,dislocations,and stacking faults during the manufacturing process.Moreover,various heat treatments were performed to differentiate the discrepancies in tribological behaviors of hot-rolled and heattreated alloys.Hot-rolled microstructures with high defect density approximate to nanoscale precipitates through aging as the wear resistance of the alloy improves,albeit it is softer compared to the aged one.As demonstrated by the X-ray diffraction(XRD) results of the wear tracks,microstructures undergo the stress-induced martensitic(SIM) transformation during dry sliding.From differential scanning calorimetry(DSC) analysis,the martensitic transformation temperature is lowered by defects in the austenite phase.The activation of the SIM transformation can be a sluggish process owing to the effect of twinning,where both primary and secondary twins are involved.Furthermore,a reversible transformation that is related to pseudoelasticity causes a decrease in wear volume at room temperature,which is higher than the austenite finish temperature.Meanwhile,abrasive wear advances toward adhesion.Additionally,the hot-rolled sheet with y fiber-{111}//ND(normal direction) exhibits better wear resistance compared to the sheet with α fiber-{100}//ND.展开更多
集成电路测试机(Automatic Test Equipment,ATE)是用于验证芯片功能与性能的核心设备,传统测试方法存在效率低、精度不足等问题,为此提出一种基于ST3020 ATE测试机的自动测试方案,该设备具备自动化、高效率、高精度、宽量程、高灵活性...集成电路测试机(Automatic Test Equipment,ATE)是用于验证芯片功能与性能的核心设备,传统测试方法存在效率低、精度不足等问题,为此提出一种基于ST3020 ATE测试机的自动测试方案,该设备具备自动化、高效率、高精度、宽量程、高灵活性与良好扩展性等特点。以芯片UC2625为测试对象,通过软件层面编写自动测试代码,硬件层面设计接口板PCB,结合循环测试、数组存储与比对等技术,系统研究了该芯片的逻辑功能与关键参数指标,最终实现了完整的ATE自动测试方案。测试结果与芯片手册规格相符,满足实际测试要求。方案在自动测试方法上进行了有益探索,为我国ATE测试技术的自主发展提供了重要参考。展开更多
基金financially supported by the National Natural Science Foundation of China (Nos. U1737204and 51673205)the Key Research Program of Frontier ScienceChinese Academy of Sciences (No. QYZDJ-SSW-SLH056)。
文摘The microstructure characteristics of TiNi alloy were investigated to elucidate the active deformation mechanisms during hot rolling and the corresponding tribology performance.The deformation was mainly dominated by a combination of mechanical twinning involving the {114}_(B2) and {112}_(B2) twins,dislocations,and stacking faults during the manufacturing process.Moreover,various heat treatments were performed to differentiate the discrepancies in tribological behaviors of hot-rolled and heattreated alloys.Hot-rolled microstructures with high defect density approximate to nanoscale precipitates through aging as the wear resistance of the alloy improves,albeit it is softer compared to the aged one.As demonstrated by the X-ray diffraction(XRD) results of the wear tracks,microstructures undergo the stress-induced martensitic(SIM) transformation during dry sliding.From differential scanning calorimetry(DSC) analysis,the martensitic transformation temperature is lowered by defects in the austenite phase.The activation of the SIM transformation can be a sluggish process owing to the effect of twinning,where both primary and secondary twins are involved.Furthermore,a reversible transformation that is related to pseudoelasticity causes a decrease in wear volume at room temperature,which is higher than the austenite finish temperature.Meanwhile,abrasive wear advances toward adhesion.Additionally,the hot-rolled sheet with y fiber-{111}//ND(normal direction) exhibits better wear resistance compared to the sheet with α fiber-{100}//ND.
文摘集成电路测试机(Automatic Test Equipment,ATE)是用于验证芯片功能与性能的核心设备,传统测试方法存在效率低、精度不足等问题,为此提出一种基于ST3020 ATE测试机的自动测试方案,该设备具备自动化、高效率、高精度、宽量程、高灵活性与良好扩展性等特点。以芯片UC2625为测试对象,通过软件层面编写自动测试代码,硬件层面设计接口板PCB,结合循环测试、数组存储与比对等技术,系统研究了该芯片的逻辑功能与关键参数指标,最终实现了完整的ATE自动测试方案。测试结果与芯片手册规格相符,满足实际测试要求。方案在自动测试方法上进行了有益探索,为我国ATE测试技术的自主发展提供了重要参考。
